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PIC18F14K22-E

Microchip Tech · Microcontrollers (MCU/MPU/SOC) · QFN-20-EP(4x4)

PIC18F14K22-E from Microchip Tech, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RA3/MCLR/VPP input PORTA<3> digital input (only when MCLR functionality is disabled); active-low Master Clear with internal pull-up, or high-voltage programming input (VPP).
2 RC5/CCP1/P1A bidirectional Digital I/O; ECCP1 capture input or compare/PWM output (CCP1), or Enhanced CCP1 PWM output channel A (P1A).
3 RC4/C2OUT/P1B/SRNQ bidirectional Digital I/O; Comparator C2 output, Enhanced CCP1 PWM output channel B (P1B), or SR latch inverted output (SRNQ).
4 RC3/AN7/C12IN3-/P1C/PGM bidirectional Digital I/O; ADC channel 7, Comparator C1/C2 inverting input 3, Enhanced CCP1 PWM output channel C (P1C), or Low-Voltage ICSP programming enable (PGM) when LVP is enabled.
5 RC6/AN8/SS bidirectional Digital I/O; ADC channel 8, or SPI slave select input for the MSSP module (TTL input).
6 RC7/AN9/SDO bidirectional Digital I/O; ADC channel 9, or SPI data output from the MSSP module.
7 RB7/TX/CK bidirectional Digital I/O; EUSART asynchronous transmit output (TX) or EUSART synchronous clock input/output (CK).
8 RB6/SCK/SCL bidirectional Digital I/O; SPI clock input/output (SCK) or I2C clock input/output (SCL) for the MSSP module.
9 RB5/AN11/RX/DT bidirectional Digital I/O; ADC channel 11, EUSART asynchronous receive (RX), or EUSART synchronous data (DT).
10 RB4/AN10/SDI/SDA bidirectional Digital I/O; ADC channel 10, SPI data input (SDI), or I2C data I/O (SDA) for the MSSP module.
11 RC2/AN6/C12IN2-/P1D bidirectional Digital I/O; ADC channel 6, Comparator C1/C2 inverting input 2, or Enhanced CCP1 PWM output channel D (P1D).
12 RC1/AN5/C12IN1- bidirectional Digital I/O; ADC channel 5 or Comparator C1/C2 inverting input 1.
13 RC0/AN4/C2IN+ bidirectional Digital I/O; ADC channel 4 or Comparator C2 noninverting input.
14 RA2/AN2/C1OUT/T0CKI/INT2/SRQ bidirectional Digital I/O; ADC channel 2, Comparator C1 output, Timer0 external clock input (T0CKI), external interrupt 2 (INT2), or SR latch output (SRQ).
15 RA1/AN1/C12IN0-/VREF+/INT1/PGC bidirectional Digital I/O; ADC channel 1, Comparator C1/C2 inverting input 0, ADC and DAC reference voltage (high) input (VREF+), external interrupt 1 (INT1), or ICSP programming clock (PGC).
16 RA0/AN0/CVREF/VREF-/C1IN+/INT0/PGD bidirectional Digital I/O; ADC channel 0, DAC reference voltage output (CVREF/DAC1OUT), ADC and DAC reference voltage (low) input (VREF-), Comparator C1 noninverting input, external interrupt 0 (INT0), or ICSP programming data (PGD).
17 VSS power_in Ground reference for logic and I/O pins.
18 VDD power_in Positive supply for logic and I/O pins.
19 RA5/OSC1/CLKIN/T13CKI bidirectional Digital I/O; oscillator crystal input or external clock input (OSC1/CLKIN, ST buffer in RC mode), and Timer1/Timer3 external clock input (T13CKI).
20 RA4/AN3/OSC2/CLKOUT bidirectional Digital I/O; ADC channel 3, oscillator crystal output (OSC2) in crystal modes, or CLKOUT (instruction cycle clock, 1/4 of OSC1 frequency) in RC mode.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package QFN-20-EP(4x4)
Category Embedded Processors & Controllers
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage on VDD pin with respect to VSS (PIC18F1XK22) -0.3 6.5 V PIC18F1XK22 319
Voltage on MCLR pin with respect to VSS -0.3 9 V 319
Voltage on all other pins with respect to VSS -0.3 V Maximum is VDD + 0.3V 319
Ambient temperature under bias -40 125 °C 319
Storage temperature -65 150 °C 319
Maximum current on VSS pin 85 mA -40°C ≤ TA ≤ +125°C, Extended 319
Maximum current on VDD pin 85 mA -40°C ≤ TA ≤ +125°C, Extended 319
Maximum current sunk by all ports 250 mA 319
Maximum current sourced by all ports 250 mA 319
Maximum output current sunk by any I/O pin 50 mA 319
Maximum output current sourced by any I/O pin 50 mA 319
Clamp current, IK IK 20 mA VPIN < 0 or VPIN > VDD 319
Operating supply voltage VDD VDD 2.3 5.5 V FOSC ≤ 20 MHz 324
Operating supply voltage VDD VDD 3 5.5 V FOSC ≤ 64 MHz, 85°C 324
Operating ambient temperature range TA (extended) TA -40 125 °C Extended temperature 320
RAM data retention voltage VDR 1.7 V Device in Sleep mode 324
VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 V/ms 324
Power-down base current (IPD) IPD 17 55 µA VDD = 2.3V; WDT, BOR, FVR and T1OSC disabled, all peripherals inactive; +125°C 332
Power-down base current (IPD) IPD 18 65 µA VDD = 3.0V; WDT, BOR, FVR and T1OSC disabled, all peripherals inactive; +125°C 332
Power-down base current (IPD) IPD 20 80 µA VDD = 5.0V; WDT, BOR, FVR and T1OSC disabled, all peripherals inactive; +125°C 332
Supply current IDD, RC_RUN (LFINTOSC) IDD 28 55 µA VDD = 2.3V, FOSC = 31 kHz (RC_RUN mode, LFINTOSC source); +125°C 326
Supply current IDD, RC_RUN (LFINTOSC) IDD 32 75 µA VDD = 3.0V, FOSC = 31 kHz (RC_RUN mode, LFINTOSC source); +125°C 326
Supply current IDD, RC_RUN (LFINTOSC) IDD 40 80 µA VDD = 5.0V, FOSC = 31 kHz (RC_RUN mode, LFINTOSC source); +125°C 326
Supply current IDD, RC_RUN (HFINTOSC 1 MHz) IDD 0.45 0.55 mA -40°C to +125°C, VDD = 2.3V, FOSC = 1 MHz (RC_RUN mode, HFINTOSC source) 326
Supply current IDD, RC_RUN (HFINTOSC 1 MHz) IDD 0.6 0.82 mA -40°C to +125°C, VDD = 3.0V, FOSC = 1 MHz (RC_RUN mode, HFINTOSC source) 326
Supply current IDD, RC_RUN (HFINTOSC 1 MHz) IDD 0.8 1 mA -40°C to +125°C, VDD = 5.0V, FOSC = 1 MHz (RC_RUN mode, HFINTOSC source) 326
Supply current IDD, RC_RUN (HF-INTOSC 16 MHz) IDD 2.4 3.5 mA -40°C to +125°C, VDD = 2.3V, FOSC = 16 MHz (RC_RUN mode, HF-INTOSC source) 326
Supply current IDD, RC_RUN (HF-INTOSC 16 MHz) IDD 3.5 4.6 mA -40°C to +125°C, VDD = 3.0V (RC_RUN mode, HF-INTOSC source) 326
Supply current IDD, RC_RUN (HF-INTOSC 16 MHz) IDD 3.7 4.7 mA -40°C to +125°C, VDD = 5.0V (RC_RUN mode, HF-INTOSC source) 326
External CLKIN frequency (EC, extended range devices) FOSC 48 MHz EC, ECIO Oscillator mode (Extended Range Devices); min printed as DC 341
Oscillator frequency, RC mode FOSC 4 MHz RC Oscillator mode; min printed as DC 341
Oscillator frequency, XT mode FOSC 0.1 4 MHz XT Oscillator mode 341
Oscillator frequency, HS mode FOSC 4 25 MHz HS Oscillator mode 341
Oscillator frequency, HS + PLL mode (extended range) FOSC 4 12 MHz HS + PLL Oscillator mode (Extended Range Devices) 341
Oscillator frequency, LP mode FOSC 5 33 kHz LP Oscillator mode 341
External CLKIN period (EC, extended range devices) TOSC 20.8 ns EC, ECIO Oscillator mode (Extended Range Devices) 341
HFINTOSC calibrated frequency tolerance HFOSC -2 2 % 0°C ≤ TA ≤ 60°C 342
HFINTOSC calibrated frequency tolerance HFOSC -3 3 % 60°C ≤ TA ≤ +85°C 342
HFINTOSC calibrated frequency tolerance HFOSC -5 5 % 342
PLL oscillator frequency range (F10) FOSC 4 16 MHz VDD = 3.0-5.0V, -40°C to +85°C 342
PLL oscillator frequency range (F10) FOSC 4 12 MHz VDD = 3.0-5.0V, 125°C 342
PLL on-chip VCO system frequency (F11) FSYS 16 64 MHz VDD = 3.0-5.0V, -40°C to +85°C 342
PLL on-chip VCO system frequency (F11) FSYS 16 48 MHz VDD = 3.0-5.0V, 125°C 342
PLL start-up time (lock time) trc 2 ms 342
CLKOUT stability (jitter) CLK -0.25 0.25 % 342
Integral error EIL -2 2 LSb VREF = 3.0V 347
Differential error EDL -1.5 1.5 LSb No missing codes, VREF = 3.0V 347
Offset error EOFF -3 3 LSb VREF = 3.0V 347
Gain error EGN -3 3 LSb VREF = 3.0V 347
Recommended impedance of analog voltage source ZAIN 10 kΩ Can go higher if external 0.01 µF capacitor is present on input pin. 347
Thermal resistance junction to ambient, 20-pin QFN 4x4mm JA 43 C/W 20-pin QFN 4x4mm package 338
Thermal resistance junction to case, 20-pin QFN 4x4mm JC 5.3 C/W 20-pin QFN 4x4mm package 338
Maximum junction temperature TJMAX 150 C 338

CAD (KiCad official)

  • Symbol: PIC18F14K22-E
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: pic18f14k22-e-etched.step / pic18f14k22-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic18f14k22-e.step / pic18f14k22-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (387 pp, sha256 21f69d409798287f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF