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PIC16LF18323-I

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Microchip Tech Microcontroller Units (MCUs/MPUs/SOCs), TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PIC16LF18323-I

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-14

PIC16LF18323-I from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply; PIC16LF18323 operates from 1.8V to 3.6V and requires a decoupling capacitor (0.1 µF recommended) to VSS.
2 RA5 bidirectional General purpose I/O RA5 shared with ANA5, T1CKI, CLCIN3, SOSCI/SOSCIN, OSC1 and CLKIN.
3 RA4 bidirectional General purpose I/O RA4 shared with ANA4, T1G, SOSCO, OSC2 and CLKOUT (FOSC/4 output).
4 RA3/MCLR/VPP input Input-only RA3 that serves as Master Clear (with internal weak pull-up) and VPP programming voltage input.
5 RC5 bidirectional General purpose I/O RC5 shared with ANC5, MDCIN2, CCP1 and RX.
6 RC4 bidirectional General purpose I/O RC4 shared with ANC4 and CLCIN1.
7 RC3 bidirectional General purpose I/O RC3 shared with ANC3, C1IN3-, C2IN3-, MDMIN, CCP2, CLCIN0 and SS1.
8 RC2 bidirectional General purpose I/O RC2 shared with ANC2, C1IN2-, C2IN2- and MDCIN1.
9 RC1 bidirectional General purpose I/O RC1 shared with ANC1, C1IN1-, C2IN1-, SDA1/SDI1 and CLCIN2.
10 RC0 bidirectional General purpose I/O RC0 shared with ANC0, C2IN0+, SCL1 (I2C clock) and SCK1 (SPI clock).
11 RA2 bidirectional General purpose I/O RA2 shared with ANA2, VREF-, DAC1REF-, T0CKI, CWG1IN and INT external interrupt.
12 RA1 bidirectional General purpose I/O RA1 shared with ANA1, VREF+, C1IN0-, C2IN0-, DAC1REF+ and ICSPCLK/ICDCLK (programming/debug clock).
13 RA0 bidirectional General purpose I/O RA0 shared with ANA0, C1IN0+, DAC1OUT and ICSPDAT/ICDDAT (programming/debug data).
14 VSS power_in Ground reference.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-14
Category Single Chip Microcomputer/Microcontroller
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 1.8 3.6 V FOSC ≤ 16 MHz 393
Supply voltage VDD 2.5 3.6 V FOSC > 16 MHz 393
Operating ambient temperature (Industrial) TA -40 85 °C Industrial 391
VDD on VDD pin VDD -0.3 4 V PIC16LF18313/18323, with respect to VSS 390
Voltage on MCLR pin -0.3 9 V with respect to VSS 390
Storage temperature -65 150 °C 390
Ambient temperature under bias -40 125 °C 390
Maximum current on VSS pin 250 mA -40°C ≤ TA ≤ +85°C 390
Maximum current on VDD pin 250 mA -40°C ≤ TA ≤ +85°C 390
Maximum current on any I/O pin 50 mA 390
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 390
Total power dissipation 800 mW 390
RAM data retention voltage VDR 1.5 V Device in Sleep mode 393
Power-on Reset release voltage VPOR 1.6 V BOR and LPBOR disabled 393
Power-on Reset rearm voltage VPORR 0.8 V BOR and LPBOR disabled 393
VDD rise rate for internal POR SVDD 0.05 V/ms BOR and LPBOR disabled 393
Supply current XT 4 MHz IDDXT4 292 390 uA XT = 4 MHz, 3.0V 395
Supply current HFINTOSC 16 MHz IDDHFO16 1.2 1.5 mA HFINTOSC = 16 MHz, 3.0V 395
Supply current HFINTOSC 32 MHz IDDHFOPLL 2 2.6 mA HFINTOSC = 32 MHz, 3.0V 395
Supply current HS+PLL 32 MHz IDDHSPLL32 2 2.4 mA HS+PLL = 32 MHz, 3.0V 395
Idle mode supply current IDDIDLE 733 1100 uA Idle Mode, HFINTOSC = 16 MHz, 3.0V 395
Doze mode supply current IDDDOZE 786 uA DOZE mode, HFINTOSC = 16 MHz, DOZE Ratio = 16, 3.0V 395
Power-down current base IPD 0.03 2 µA 3.0V, VREGPM = 1, max at +85°C 396
Power-down current base, VREGPM = 0 IPD 12.8 22 µA 3.0V, VREGPM = 0, max at +85°C 396
Power-down current LFINTOSC/WDT IPD_WDT 0.4 2.9 µA 3.0V, max at +85°C 396
Power-down current secondary oscillator IPD_SOSC 1.3 2.8 µA 3.0V, max at +85°C 396
Power-down current FVR IPD_FVR 45 74 µA 3.0V, max at +85°C 396
Power-down current BOR IPD_BOR 10.6 16 µA 3.0V, max at +85°C 396
Power-down current LPBOR IPD_LPBOR 0.3 2.5 µA 3.0V, max at +85°C 396
Power-down current ADC non-converting IPD_ADCA 0.3 2 µA 3.0V, ADC not converting, max at +85°C 396
Power-down current comparator IPD_CMP 30 45 µA 3.0V, max at +85°C 396
Input low voltage, TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 397
Input low voltage, TTL buffer VIL 0.15 V 1.8V ≤ VDD ≤ 4.5V, max is 0.15 VDD 397
Input low voltage, Schmitt Trigger VIL 0.2 V 2.0V ≤ VDD ≤ 5.5V, max is 0.2 VDD 397
Input high voltage, TTL buffer VIH 0.8 V 1.8V ≤ VDD ≤ 4.5V, min is 0.25 VDD + 0.8 397
Input high voltage, Schmitt Trigger VIH 0.8 V 2.0V ≤ VDD ≤ 5.5V, min is 0.8 VDD 397
Input leakage current, I/O ports IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 397
Weak pull-up current IPUR 25 120 200 µA VDD = 3.0V, VPIN = VSS 397
Output low voltage VOL 0.6 V IOL = 10.0 mA, VDD = 3.0V 397
Output high voltage VOH 0.7 V IOH = 6.0 mA, VDD = 3.0V, min is VDD - 0.7 397
I/O pin capacitance CIO 5 50 pF All I/O pins 397
HFINTOSC accuracy FHFOSC -5 5 % -40°C to +125°C, per Figure 35-6 (±2% to ±5% regions) 402
LFINTOSC frequency FLFOSC 31 kHz 402
Brown-out Reset voltage VBOR 1.8 1.9 2.1 V BORV = 1 (PIC16LF18313/18323) 406
Brown-out Reset voltage VBOR 2.55 2.7 2.85 V BORV = 0 406
Low-power Brown-out Reset voltage VLPBOR 1.8 2.1 2.5 V PIC16LF18313/18323 406
Watchdog Timer time-out period TWDT 10 16 27 ms 16 ms Nominal Reset Time 406
Power-up Timer period TPWRT 40 65 140 ms 406
ADC resolution NR 10 bit VDD = 3.0V, TA = 25°C 407
ADC integral error EIL -1 0.1 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 407
ADC differential error EDL -1 0.1 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 407
ADC offset error EOFF -2 0.5 2 LSb ADCREF+ = 3.0V, ADCREF- = 0V 407
ADC gain error EGN -2 0.2 2 LSb ADCREF+ = 3.0V, ADCREF- = 0V 407
Comparator input offset voltage VIOFF -50 50 mV VICM = VDD/2 410
Comparator hysteresis CHYST 15 25 35 mV 410
FVR 1x gain accuracy VFVR1 -4 4 % VDD ≥ 2.5V, -40°C to 85°C 410
FVR 2x gain accuracy VFVR2 -4 4 % VDD ≥ 2.5V, -40°C to 85°C 410
Thermal resistance junction-to-ambient θJA 100 °C/W 14-pin TSSOP package 399
Thermal resistance junction-to-case θJC 24.4 °C/W 14-pin TSSOP package 399
Maximum junction temperature TJMAX 150 °C 399
Power dissipation PD 0.8 W PD = PINTERNAL + PI/O 399

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPS BODY RxyPPS 259

CAD (KiCad official)

  • Symbol: PIC16LF18323-I
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: pic16lf18323-i-etched.step / pic16lf18323-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16lf18323-i.step / pic16lf18323-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (471 pp, sha256 5b9713da292b02eb, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF