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PIC16F18346T-I

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Microchip Tech Microcontroller Units (MCUs/MPUs/SOCs), SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PIC16F18346T-I

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · SOIC-20-300mil

PIC16F18346T-I from Microchip Tech, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply; 2.3V to 5.5V for PIC16F18346 (1.8V to 3.6V for the LF version), must be connected and decoupled with a 0.1 µF capacitor.
2 RA5 bidirectional General purpose I/O with ANA5 ADC input, T1CKI/T3CKI/T5CKI timer clock inputs, SOSCIN/SOSCI secondary oscillator, and CLKIN/OSC1 external clock or crystal connection.
3 RA4 bidirectional General purpose I/O with ANA4 ADC input, T1G/T3G/T5G gate inputs, CCP4 input, SOSCO secondary oscillator, and CLKOUT (FOSC/4) or OSC2 crystal connection.
4 RA3/MCLR/VPP input Input-only pin serving as general purpose input, Master Clear reset with internal weak pull-up (MCLR), or programming voltage input (VPP).
5 RC5 bidirectional General purpose I/O with ANC5 ADC input, MDCIN2 modular carrier input and CCP1 input.
6 RC4 bidirectional General purpose I/O with ANC4 ADC input.
7 RC3 bidirectional General purpose I/O with ANC3 ADC input, C1IN3-/C2IN3- comparator negative inputs, MDMIN modular source input, CCP2 input and CLCIN1 input.
8 RC6 bidirectional General purpose I/O with ANC6 ADC input and SS1 slave select input.
9 RC7 bidirectional General purpose I/O with ANC7 ADC input.
10 RB7 bidirectional General purpose I/O with ANB7 ADC input and SCK2 SPI clock / SCL2 I2C clock.
11 RB6 bidirectional General purpose I/O with ANB6 ADC input and SCK1 SPI clock / SCL1 I2C clock.
12 RB5 bidirectional General purpose I/O with ANB5 ADC input, SDI2 SPI data in / SDA2 I2C data, EUSART RX/DT and CLCIN3 input.
13 RB4 bidirectional General purpose I/O with ANB4 ADC input, SDI1 SPI data in / SDA1 I2C data and CLCIN2 input.
14 RC2 bidirectional General purpose I/O with ANC2 ADC input, C1IN2-/C2IN2- comparator negative inputs and MDCIN1 modular carrier input.
15 RC1 bidirectional General purpose I/O with ANC1 ADC input and C1IN1-/C2IN1- comparator negative inputs.
16 RC0 bidirectional General purpose I/O with ANC0 ADC input and C2IN0+ comparator positive input.
17 RA2 bidirectional General purpose I/O with ANA2 ADC input, VREF- and DAC1REF- reference inputs, T0CKI, CCP3, CWG1IN/CWG2IN, CLCIN0 and INT external interrupt inputs.
18 RA1/ICSPCLK bidirectional General purpose I/O with ANA1 ADC input, VREF+, C1IN0-/C2IN0-, DAC1REF+, SS2 slave select input, and ICDCLK/ICSPCLK debug and programming clock.
19 RA0/ICSPDAT bidirectional General purpose I/O with ANA0 ADC input, C1IN0+ comparator input, DAC1OUT analog output, and ICDDAT/ICSPDAT debug and programming data.
20 VSS power_in Ground reference; must be connected.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-20-300mil
Category Single Chip Microcomputer/Microcontroller
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (FOSC ≤ 16 MHz) VDD 2.3 5.5 V FOSC ≤ 16 MHz 414
Supply voltage (FOSC > 16 MHz) VDD 2.5 5.5 V FOSC > 16 MHz 414
RAM data retention voltage VDR 1.7 V Device in Sleep mode 414
Power-on Reset release voltage VPOR 1.6 V BOR and LPBOR disabled 414
Power-on Reset rearm voltage VPORR 1.5 V BOR and LPBOR disabled 414
VDD rise rate for internal POR SVDD 0.05 V/ms BOR and LPBOR disabled 414
Supply current XT 4 MHz IDDXT4 332 479 uA XT = 4 MHz, VDD = 3.0V 416
Supply current HFO 16 MHz IDDHFO16 1.4 1.9 mA HFO = 16 MHz, VDD = 3.0V 416
Supply current HFO 32 MHz IDDHFOPLL 2.3 2.9 mA HFO = 32 MHz, VDD = 3.0V 416
Supply current HS+PLL 32 MHz IDDHSPLL32 2.3 2.9 mA HS+PLL = 32 MHz, VDD = 3.0V 416
Power-down current base (VREGPM = 1), max at +85°C IPD 0.4 2.5 uA VDD = 3.0V, VREGPM = 1; max at +85°C (6 uA max at +125°C) 417
Power-down current base (VREGPM = 0), max at +85°C IPD 13 22 uA VDD = 3.0V, VREGPM = 0; max at +85°C (27 uA max at +125°C) 417
Watchdog timer power-down current, max at +85°C IPD_WDT 1.1 3.3 uA VDD = 3.0V; max at +85°C (6.6 uA max at +125°C) 417
Input low voltage, TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 418
Input low voltage, SMBus levels VIL 0.8 V 2.7V ≤ VDD ≤ 5.5V 418
Input high voltage, TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 418
Input high voltage, SMBus levels VIH 2.1 V 2.7V ≤ VDD ≤ 5.5V 418
Input leakage current, I/O ports (85°C) IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance, 85°C 418
Input leakage current, I/O ports (125°C) IIL -1000 5 1000 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance, 125°C 418
Weak pull-up current IPUR 25 120 200 uA VDD = 3.0V, VPIN = VSS 418
Output low voltage, I/O ports VOL 0.6 V IOL = 10.0 mA, VDD = 3.0V 418
I/O pin capacitance CIO 5 50 pF 418
Brown-out Reset voltage BORV = 0 VBOR 2.55 2.7 2.85 V BORV = 0 428
Brown-out Reset voltage BORV = 1 VBOR 2.3 2.45 2.6 V BORV = 1 (PIC16F18326/18346) 428
Calibrated HFINTOSC frequency accuracy FHFOSC 3.92 4 4.08 MHz 25°C 423
ADC integral error EIL -1 0.1 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 429
ADC differential error EDL -1 0.1 1 LSb ADCREF+ = 3.0V, ADCREF-= 0V 429
Fixed Voltage Reference 1x accuracy VFVR1 -4 4 % VDD ≥ 2.5V, -40°C to 85°C 432
Fixed Voltage Reference 4x accuracy VFVR4 -5 5 % VDD ≥ 4.75V, -40°C to 85°C 432
Voltage on VDD pin w.r.t. VSS VDD -0.3 6.5 V PIC16F18326/18346 411
Voltage on MCLR pin -0.3 9 V with respect to VSS 411
Storage temperature -65 150 °C 411
Maximum current on any I/O pin 50 mA 411
Total power dissipation PD 800 mW 411
Operating ambient temperature, extended TA -40 125 °C Extended temperature 412
Thermal resistance junction to ambient θJA 77.7 °C/W 20-pin SOIC package 420
Thermal resistance junction to case θJC 23.1 °C/W 20-pin SOIC package 420
Maximum junction temperature TJMAX 150 °C 420

CAD (KiCad official)

  • Symbol: PIC16F18346T-I
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: pic16f18346t-i-etched.step / pic16f18346t-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f18346t-i.step / pic16f18346t-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (500 pp, sha256 caaf66beaba7d548, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF