main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 1d ago
viewers pic16f18325-i: viewers · Ray 1d ago
package.json Publish 0.1.0 · Ray 1d ago
page.json Set visibility: public · Ray 1d ago
pic16f18325-i-etched.glb Publish 0.1.0 · Ray 1d ago
pic16f18325-i-etched.step pic16f18325-i: factory component page (tier=lcsc) · Ray 1d ago
pic16f18325-i-hero.glb pic16f18325-i: hero GLB from the etched model (keeps the MPN mark) · Ray 1d ago
pic16f18325-i-hero.overlay.json Publish 0.1.0 · Ray 1d ago
pic16f18325-i.glb Publish 0.1.0 · Ray 1d ago
pic16f18325-i.kicad_mod Publish 0.1.0 · Ray 1d ago
pic16f18325-i.kicad_sym Publish 0.1.0 · Ray 1d ago
pic16f18325-i.lbr Publish 0.1.0 · Ray 1d ago
pic16f18325-i.step Publish 0.1.0 · Ray 1d ago
README.md Publish 0.1.0 · Ray 1d ago

PIC16F18325-I

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-14

PIC16F18325-I from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply; the datasheet gives the operating range as 2.3V to 5.5V for PIC16F18325 and requires all VDD pins to be decoupled.
2 RA5 bidirectional General purpose I/O with ADC channel ANA5, TMR1 clock input T1CKI, secondary oscillator input SOSCIN, CLC input CLCIN3, external clock input CLKIN, or crystal pin OSC1 (LP, XT, HS modes).
3 RA4 bidirectional General purpose I/O with ADC channel ANA4, TMR1 gate input T1G, secondary oscillator output SOSCO, and CLKOUT (FOSC/4) or crystal pin OSC2 (LP, XT, HS modes).
4 RA3 input Input-only pin (its TRIS bit always reads 1) that serves as Master Clear MCLR with internal pull-up when MCLRE is set, or as programming voltage VPP.
5 RC5 bidirectional General purpose I/O with ADC channel ANC5, Comparator/modular input MDCIN2, TMR3 clock input T3CKI, CCP1 input, SPI data input SDI2 or I2C data SDA2, and EUSART asynchronous input RX.
6 RC4 bidirectional General purpose I/O with ADC channel ANC4, TMR3 gate input T3G, SPI clock SCK2 or I2C clock SCL2, and CLC input CLCIN1.
7 RC3 bidirectional General purpose I/O with ADC channel ANC3, comparator C1/C2 negative inputs, modular source input MDMIN, TMR5 gate input T5G, CCP2 input, Slave Select 1 input SS1, and CLC input CLCIN0.
8 RC2 bidirectional General purpose I/O with ADC channel ANC2, comparator C1/C2 negative inputs, and modular carrier input MDCIN1.
9 RC1 bidirectional General purpose I/O with ADC channel ANC1, comparator C1/C2 negative inputs, CCP4 input, SPI data input SDI1 or I2C data SDA1, and CLC input CLCIN2.
10 RC0 bidirectional General purpose I/O with ADC channel ANC0, comparator C2 positive input C2IN0+, TMR5 clock input T5CKI, SPI clock SCK1 or I2C clock SCL1.
11 RA2 bidirectional General purpose I/O with ADC channel ANA2, ADC negative reference VREF-, DAC negative reference DAC1REF-, TMR0 clock input T0CKI, CCP3 input, CWG1IN/CWG2IN inputs, and external interrupt INT.
12 RA1 bidirectional General purpose I/O with ADC channel ANA1, ADC positive reference VREF+, comparator C1/C2 negative inputs, DAC positive reference DAC1REF+, and in-circuit serial programming clock ICSPCLK.
13 RA0 bidirectional General purpose I/O with ADC channel ANA0, comparator C1 positive input C1IN0+, DAC output DAC1OUT, SPI slave select SS2, and in-circuit serial programming data ICSPDAT.
14 VSS power_in Ground reference for the device.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-14
Category Single Chip Microcomputer/Microcontroller
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature under bias TA -40 125 °C Ambient temperature under bias 410
Storage temperature TSTG -65 150 °C 410
Voltage on VDD pin with respect to VSS (PIC16F18325/18345) VDD -0.3 6.5 V PIC16F18325/18345 410
Voltage on MCLR pin with respect to VSS VMCLR -0.3 9 V 410
Maximum current on VSS pin, -40°C to +85°C IVSS 250 mA -40°C ≤ TA ≤ +85°C 410
Maximum current on VSS pin, +85°C to +125°C IVSS 85 mA +85°C ≤ TA ≤ +125°C 410
Maximum current on VDD pin, -40°C to +85°C IVDD 250 mA -40°C ≤ TA ≤ +85°C 410
Maximum current on VDD pin, +85°C to +125°C IVDD 85 mA +85°C ≤ TA ≤ +125°C 410
Maximum current on any I/O pin IIO 50 mA 410
Clamp current, IK IK 20 mA VPIN < 0 or VPIN > VDD 410
Total power dissipation PD 800 mW 410
Operating voltage VDD (PIC16F, FOSC ≤ 16 MHz) VDD 2.3 5.5 V PIC16F18325/18345, FOSC ≤ 16 MHz 411
Operating voltage VDD (PIC16F, FOSC ≤ 32 MHz) VDD 2.5 5.5 V PIC16F18325/18345, FOSC ≤ 32 MHz 411
Industrial operating ambient temperature TA -40 85 °C Industrial temperature 411
Supply voltage VDD, FOSC ≤ 16 MHz VDD 2.3 5.5 V PIC16F18325/18345, FOSC ≤ 16 MHz: 413
Supply voltage VDD, FOSC > 16 MHz VDD 2.5 5.5 V PIC16F18325/18345, FOSC > 16 MHz 413
RAM data retention voltage VDR 1.7 V Device in Sleep mode 413
Power-on Reset release voltage VPOR 1.6 V BOR and LPBOR disabled 413
Power-on Reset rearm voltage VPORR 1.5 V BOR and LPBOR disabled 413
VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 V/ms BOR and LPBOR disabled 413
Supply current XT = 4 MHz (PIC16F) IDDXT4 330 435 uA 3.0V 415
Supply current HFINTOSC = 16 MHz (PIC16F) IDDHFO16 1.4 1.8 mA 3.0V 415
Supply current HFINTOSC = 32 MHz PLL (PIC16F) IDDHFOPLL 2.4 3.1 mA 3.0V 415
Supply current HS+PLL = 32 MHz (PIC16F) IDDHSPLL32 2.3 3 mA 3.0V 415
Supply current IDLE mode, HFINTOSC = 16 MHz (PIC16F) IDDIDLE 800 1300 uA 3.0V 415
Power-down current IPD base (PIC16F, +85°C) IPD 0.3 2.4 uA VREGPM = 1, 3.0V, Max. +85°C column 416
Power-down current IPD base (PIC16F, +125°C) IPD 0.3 5.6 uA VREGPM = 1, 3.0V, Max. +125°C column 416
Power-down current LFINTOSC/WDT (PIC16F, +85°C) IPD_WDT 0.5 3.3 uA 3.0V, Max. +85°C column 416
Power-down current Secondary Oscillator (PIC16F, +85°C) IPD_SOSC 1.5 3.2 uA 3.0V, Max. +85°C column 416
Power-down current FVR (PIC16F, +85°C) IPD_FVR 40 70 uA 3.0V, Max. +85°C column 416
Power-down current Brown-out Reset (PIC16F, +85°C) IPD_BOR 10.5 16.4 uA 3.0V, Max. +85°C column 416
Power-down current Low Power BOR (PIC16F, +85°C) IPD_LPBOR 0.2 2.9 uA 3.0V, Max. +85°C column 416
Power-down current ADC non-converting (PIC16F, +85°C) IPD_ADCA 0.3 2.4 uA 3.0V, ADC not converting, Max. +85°C column 416
Power-down current comparator (PIC16F, +85°C) IPD_CMP 30 44 uA 3.0V, Max. +85°C column 416
Input low voltage TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 417
Input low voltage Schmitt Trigger buffer VIL 0.2 V 2.0V ≤ VDD ≤ 5.5V 417
Input low voltage SMBus levels VIL 0.8 V 2.7V ≤ VDD ≤ 5.5V 417
Input low voltage MCLR VIL 0.2 V MCLR 417
Input high voltage TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 417
Input high voltage Schmitt Trigger buffer VIH 0.8 V 2.0V ≤ VDD ≤ 5.5V 417
Input high voltage SMBus levels VIH 2.1 V 2.7V ≤ VDD ≤ 5.5V 417
Input high voltage MCLR VIH 0.7 V MCLR 417
I/O port input leakage current IIL -125 125 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance, 85°C 417
Weak pull-up current IPUR 25 120 200 uA VDD = 3.0V, VPIN = VSS 417
Output low voltage I/O ports VOL 0.6 V IOL = 10.0 mA, VDD = 3.0V 417
Thermal resistance junction to ambient, 14-pin TSSOP JA 100 C/W 14-pin TSSOP package 419
Thermal resistance junction to case, 14-pin TSSOP JC 24.4 C/W 14-pin TSSOP package 419
Maximum junction temperature TJMAX 150 C 419
Power dissipation PD 0.8 W PD = PINTERNAL + PI/O 419
Brown-out Reset voltage BORV = 0 VBOR 2.55 2.7 2.85 V BORV = 0 426
Brown-out Reset voltage BORV = 1 (PIC16F18325/18345) VBOR 2.3 2.45 2.6 V BORV = 1 (PIC16F18325/18345) 426
Low-Power Brown-out Reset voltage VLPBOR 1.8 2.1 2.5 V PIC16LF18325/18345 426

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPS BODY RxyPPS 278

CAD (KiCad official)

  • Symbol: PIC16F18325-I
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: pic16f18325-i-etched.step / pic16f18325-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f18325-i.step / pic16f18325-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (495 pp, sha256 b938cfac92c10b2e, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF