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PIC16F18313-I

Microchip Tech · MICROCHIP · SOIC-8

PIC16F18313-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply pin; the PIC16F18313 operating voltage range is 2.3V to 5.5V.
2 RA5 bidirectional General purpose I/O pin RA5, also usable as ADC channel ANA5, TMR1 clock input, external clock input CLKIN or oscillator pin OSC1.
3 RA4 bidirectional General purpose I/O pin RA4, also usable as ADC channel ANA4, comparator C1IN1- input, TMR1 gate input, or CLKOUT (FOSC/4) output.
4 RA3 input Input-only pin RA3 that is also the MCLR (master clear, internal pull-up when enabled) and VPP programming voltage pin.
5 RA2 bidirectional General purpose I/O pin RA2, also usable as ADC channel ANA2, VREF- input, TMR0 clock input, external interrupt INT or CWG1 input.
6 RA1 bidirectional General purpose I/O pin RA1, also usable as ADC channel ANA1, VREF+ input, comparator C1IN0- input, or the ICSP programming clock ICSPCLK / ICD clock ICDCLK.
7 RA0 bidirectional General purpose I/O pin RA0, also usable as ADC channel ANA0, comparator C1IN0+ input, DAC1OUT output, or the ICSP data pin ICSPDAT / ICD data ICDDAT.
8 VSS power_in Ground reference pin for the device.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Embedded Processors & Controllers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Voltage VDD (FOSC <= 16 MHz) VDD 2.3 5.5 V PIC16F18313/18323, FOSC <= 16 MHz 393
Operating Voltage VDD (FOSC > 16 MHz) VDD 2.5 5.5 V PIC16F18313/18323, FOSC > 16 MHz 393
Operating Ambient Temperature (Industrial) TA -40 85 °C Industrial temperature range (-I) 391
Voltage on VDD pin with respect to VSS VDD -0.3 6.5 V PIC16F18313/18323 390
Voltage on MCLR pin with respect to VSS VMCLR -0.3 9 V 390
Ambient temperature under bias TA -40 125 °C 390
Storage temperature -65 150 °C 390
Maximum current on VSS pin 250 mA -40°C <= TA <= +85°C 390
Maximum current on VDD pin 250 mA -40°C <= TA <= +85°C 390
Maximum current on any I/O pin 50 mA 390
Clamp current IK IK 20 mA VPIN < 0 or VPIN > VDD 390
Total power dissipation 800 mW 390
Maximum junction temperature TJMAX 150 °C 399
Supply Voltage in Sleep (RAM retention) VDR 1.7 V Device in Sleep mode 393
Power-on Reset Release Voltage VPOR 1.6 V BOR and LPBOR disabled 393
Power-on Reset ReARM Voltage VPORR 1.5 V BOR and LPBOR disabled 393
VDD Rise Rate to ensure Internal POR Signal SVDD 0.05 V/ms BOR and LPBOR disabled 393
Supply Current XT = 4 MHz IDDXT4 302 410 uA XT = 4 MHz, 3.0V 395
Supply Current HFINTOSC = 16 MHz IDDHFO16 1.3 1.6 mA HFINTOSC = 16 MHz, 3.0V 395
Supply Current Idle Mode HFINTOSC = 16 MHz IDDIDLE 743 1100 uA Idle Mode, HFINTOSC = 16 MHz, 3.0V 395
Power-down current IPD base IPD 0.3 2.4 uA 3.0V, VREGPM = 1, Max +85°C 396
Power-down current Low-Frequency INTOSC/WDT IPD_WDT 0.5 3.3 uA 3.0V, Max +85°C 396
Power-down current Secondary Oscillator IPD_SOSC 1.5 3.2 uA 3.0V, Max +85°C 396
Power-down current FVR IPD_FVR 40 70 uA 3.0V, Max +85°C 396
Power-down current Brown-out Reset IPD_BOR 10.5 16.4 uA 3.0V, Max +85°C 396
Power-down current ADC non-converting IPD_ADCA 0.3 2.4 uA 3.0V, ADC not converting, Max +85°C 396
Power-down current Comparator IPD_CMP 30 44 uA 3.0V, Max +85°C 396
Input Low Voltage, TTL buffer VIL 0.8 V 4.5V <= VDD <= 5.5V 397
Input Low Voltage, Schmitt Trigger buffer VIL 0.2 x VDD 2.0V <= VDD <= 5.5V 397
Input Low Voltage, MCLR VIL 0.2 x VDD 397
Input High Voltage, TTL buffer VIH 2 V 4.5V <= VDD <= 5.5V 397
Input High Voltage, Schmitt Trigger buffer VIH 0.8 x VDD 2.0V <= VDD <= 5.5V 397
Input High Voltage, SMBus levels VIH 2.1 V 2.7V <= VDD <= 5.5V 397
Input High Voltage, MCLR VIH 0.7 x VDD 397
Input Leakage Current I/O Ports IIL -125 125 nA VSS <= VPIN <= VDD, pin at high-impedance, 85°C 397
Input Leakage Current MCLR IIL -200 200 nA VSS <= VPIN <= VDD, pin at high-impedance, 85°C 397
Weak Pull-up Current IPUR 25 120 200 uA VDD = 3.0V, VPIN = VSS 397
Output Low Voltage I/O ports VOL 0.6 V IOL = 10.0 mA, VDD = 3.0V 397
Pin capacitance All I/O pins CIO 5 50 pF 397
Data EEPROM Byte Endurance ED 100 k E/W -40°C <= TA <= 85°C 398
Byte Erase and Write Cycle Time TD_BEW 4 5 ms 398
Self-Timed Row Erase or Self-Timed Write TP_REW 2 2.5 ms 398
Low-Frequency Internal Oscillator Frequency FLFOSC 31 kHz 402
Clock Duty Cycle TECL_DC 40 60 % External clock modes 401
System Clock Frequency FOSC 32 MHz 401
Instruction Period TCY 125 ns 401
MCLR Pulse Width Low to ensure Reset TMCLR 2 us 406
Watchdog Timer Time-out Period TWDT 10 16 27 ms 16 ms Nominal Reset Time 406
Power-up Timer Period TPWRT 40 65 140 ms 406
Brown-out Reset Voltage BORV = 0 VBOR 2.55 2.7 2.85 V BORV = 0 406
Brown-out Reset Voltage BORV = 1 VBOR 2.3 2.45 2.6 V BORV = 1 (PIC16F18313/18323) 406
Brown-out Reset Hysteresis VBORHYS 0 25 75 mV 406
Brown-out Reset Response Time TBORDC 1 3 35 us 406
1x Gain FVR (1.024V nominal) accuracy VFVR1 -4 4 % VDD >= 2.5V, -40°C to 85°C 410
2x Gain FVR (2.048V nominal) accuracy VFVR2 -4 4 % VDD >= 2.5V, -40°C to 85°C 410
4x Gain FVR (4.096V nominal) accuracy VFVR4 -5 5 % VDD >= 4.75V, -40°C to 85°C 410
FVR Start-up Time TFVRST 35 us 410
Comparator Input Offset Voltage VIOFF -50 50 mV VICM = VDD/2 410
Comparator Hysteresis CHYST 15 25 35 mV 410
Comparator Response Time, Rising Edge TRESP 300 600 ns Response time measured with one input at VDD/2 410
ADC Integral Error EIL -1 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 407
ADC Recommended Impedance of Analog Voltage Source ZAIN 10 k 407
DAC Absolute Accuracy VACC -0.5 0.5 LSb 410
DAC Settling Time TST 10 us DACR[4:0] transitions from 00000 to 01111 410
Junction-to-Ambient Thermal Resistance 8-pin SOIC JA 112.4 C/W 8-pin SOIC package 399
Junction-to-Case Thermal Resistance 8-pin SOIC JC 50 C/W 8-pin SOIC package 399

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPS BODY RxyPPS 259

CAD (KiCad official)

  • Symbol: PIC16F18313-I
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: pic16f18313-i-etched.step / pic16f18313-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f18313-i.step / pic16f18313-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (471 pp, sha256 5b9713da292b02eb, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF