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PIC16F1614-I

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-14

PIC16F1614-I from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply pin; the PIC16F1614 operating voltage range is stated as 2.3V to 5.5V.
2 RA5 bidirectional General purpose I/O that also serves as CLKIN external clock input in EC mode, with T1CKI, T2IN and SMTWIN1 inputs.
3 RA4 bidirectional General purpose I/O that also serves as AN3 ADC input, T1G gate input, SMTSIG1 input and CLKOUT (FOSC/4) output.
4 RA3 input Input-only general purpose pin with interrupt-on-change and weak pull-up, shared with MCLR (host clear with internal pull-up) and VPP (programming voltage).
5 RC5 bidirectional General purpose I/O that also serves as T3CKI, CCP1, RX and ATIN inputs, and as HIC5 high current drive pin rated up to 100 mA at 5V.
6 RC4 bidirectional General purpose I/O that also serves as T3G, CLCIN1 and CK inputs, and as HIC4 high current drive pin rated up to 100 mA at 5V.
7 RC3 input General purpose input with interrupt-on-change and weak pull-up, also serving as AN7 ADC channel, C1IN3-/C2IN3- comparator inputs, CCP2, CLCIN0, ATCC and SS inputs.
8 RC2 bidirectional General purpose I/O that also serves as AN6 ADC channel and C1IN2-/C2IN2- comparator negative inputs.
9 RC1 bidirectional General purpose I/O that also serves as AN5 ADC channel, C1IN1-/C2IN1- comparator negative inputs, T4IN, SMTSIG2 and SDI inputs.
10 RC0 bidirectional General purpose I/O that also serves as AN4 ADC channel, C2IN+ comparator positive input, T5CKI input and SCK.
11 RA2 bidirectional General purpose I/O that also serves as AN2 ADC channel, T0CKI, CWG1IN, ZCD1IN and external interrupt INT input.
12 RA1 bidirectional General purpose I/O that also serves as AN1 ADC channel, VREF+ voltage reference input, C1IN0-/C2IN0- comparator inputs and ICSPCLK programming clock.
13 RA0 bidirectional General purpose I/O that also serves as AN0 ADC channel, C1IN+ comparator positive input, DAC1OUT1 output and ICSPDAT programming data I/O.
14 VSS power_in Ground reference pin.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-14
Category Single Chip Microcomputer/Microcontroller
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDD 2.3 5.5 V FOSC 16 MHz 516
Supply Voltage VDD 2.5 5.5 V FOSC 32 MHz 516
RAM Data Retention Voltage VDR 1.7 V Device in Sleep mode 516
VDD Rise Rate SVDD 0.05 V/ms Ensures that the Power-on Reset signal is released properly. 516
FVR Gain Voltage Accuracy for ADC VADFVR -5 5 % 1x VFVR, VDD 2.5V 516
FVR Gain Voltage Accuracy for Comparator/DAC VCDAFVR -7 7 % 1x VFVR, VDD 2.5V 516
Supply Current, 1 MHz External Clock ECM IDD 65 120 µA VDD 2.3V; FOSC = 1 MHz, External Clock (ECM), Medium-Power mode 517
Supply Current, 1 MHz External Clock ECM IDD 85 150 µA VDD 3.0V; FOSC = 1 MHz, External Clock (ECM), Medium-Power mode 517
Supply Current, 1 MHz External Clock ECM IDD 115 200 µA VDD 5.0V; FOSC = 1 MHz, External Clock (ECM), Medium-Power mode 517
Supply Current, 4 MHz External Clock ECM IDD 180 310 µA VDD 2.3V; FOSC = 4 MHz, External Clock (ECM), Medium-Power mode 517
Supply Current, 4 MHz External Clock ECM IDD 240 410 µA VDD 3.0V; FOSC = 4 MHz, External Clock (ECM), Medium-Power mode 517
Supply Current, 4 MHz External Clock ECM IDD 295 520 µA VDD 5.0V; FOSC = 4 MHz, External Clock (ECM), Medium-Power mode 517
Supply Current, 16 MHz HFINTOSC IDD 780 1500 µA VDD 2.3V; FOSC = 16 MHz, HFINTOSC 518
Supply Current, 16 MHz HFINTOSC IDD 1000 1900 µA VDD 3.0V; FOSC = 16 MHz, HFINTOSC 518
Supply Current, 16 MHz HFINTOSC IDD 1090 2100 µA VDD 5.0V; FOSC = 16 MHz, HFINTOSC 518
Base Power-down Current Low-Power Sleep IPD 0.25 3 µA VDD 2.3V; WDT, BOR, FVR disabled, all Peripherals inactive, Low-Power Sleep mode; max at +85°C 520
Base Power-down Current Low-Power Sleep IPD 0.3 4 µA VDD 3.0V; WDT, BOR, FVR disabled, all Peripherals inactive, Low-Power Sleep mode; max at +85°C 520
Base Power-down Current Low-Power Sleep IPD 0.4 6 µA VDD 5.0V; WDT, BOR, FVR disabled, all Peripherals inactive, Low-Power Sleep mode; max at +85°C 520
Input Low Voltage TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 522
Input High Voltage TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 522
Input Leakage Current I/O Ports IIL -125 125 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 522
Input Leakage Current I/O Ports IIL -1000 1000 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 125°C 522
Input Leakage Current MCLR IIL -200 200 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 522
Weak Pull-up Current IPUR 25 100 200 µA VDD = 3.3V, VPIN = VSS 522
Weak Pull-up Current IPUR 25 140 300 µA VDD = 5.0V, VPIN = VSS 522
Output Low Voltage I/O Ports VOL 0.6 V IOL = 8.0 mA, VDD = 5.0V 522
Pin Capacitance All I/O pins CIO 50 pF 522
MCLR Pulse Width (low) TMCL 2 µs 531
Low-Power Watchdog Timer Time-out Period TWDTLP 10 16 27 ms VDD = 3.3V-5V, 1:512 Prescaler used 531
Oscillator Start-up Timer Period TOST 1024 TOSC 531
Power-up Timer Period TPWRT 40 65 140 ms PWRTE = 0 531
I/O High-impedance from MCLR Low or WDT Reset TIOZ 2 µs 531
Brown-out Reset Voltage VBOR 2.55 2.7 2.85 V BORV = 0 531
Brown-out Reset Voltage VBOR 2.35 2.45 2.58 V BORV = 1 (PIC16F1614/8) 531
HFINTOSC Wake-up from Sleep Start-up Time TWARM 5 15 µs 527
External CLKIN Period OS02 31.25 ns External Clock (EC) 526
ADC Integral Error EIL -1.7 1.7 LSb VREF = 3.0V 533
ADC Differential Error EDL -1 1 LSb No missing codes, VREF = 3.0V 533
ADC Offset Error EOFF -2.5 2.5 LSb VREF = 3.0V 533
ADC Gain Error EGN -2 2 LSb VREF = 3.0V 533
ADC Reference Voltage VREF 1.8 V VREF = (VRPOS - VRNEG) 533
Recommended Impedance of Analog Voltage Source ZAIN 10 kΩ Can go higher if external 0.01µF capacitor is present on input pin. 533
Voltage on VDD pin VDD -0.3 6.5 V PIC16F1614/8 513
Voltage on MCLR pin VMCLR -0.3 9 V 513
Ambient temperature under bias TA -40 125 °C 513
Storage temperature TSTG -65 150 °C 513
Maximum current on VSS pin IVSS 250 mA -40°C ≤ TA ≤ +85°C 513
Maximum current on VDD pin IVDD 250 mA -40°C ≤ TA ≤ +85°C 513
Current sunk by any standard I/O pin IOL 50 mA 513
Current sourced by any standard I/O pin IOH 50 mA 513
Current sunk by any High Current I/O pin IOL 100 mA 513
Current sourced by any High Current I/O pin IOH 100 mA 513
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 513
Operating Ambient Temperature Range Industrial TA -40 85 °C Industrial Temperature 514

CAD (KiCad official)

  • Symbol: PIC16F1614-I
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: pic16f1614-i-etched.step / pic16f1614-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f1614-i.step / pic16f1614-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (585 pp, sha256 70101a4a3c06f10e, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF