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PIC16F1516-I

Public Made by Adom

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Microchip Tech MICROCHIP, SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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PIC16F1516-I

Microchip Tech · MICROCHIP · SOIC-28-300mil

PIC16F1516-I from Microchip Tech, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RE3/MCLR/VPP input General purpose input with WPU, Master Clear with internal pull-up, or high-voltage programming voltage (VPP) input.
2 RA0/AN0/SS bidirectional General purpose I/O, ADC channel 0 input, or alternate-location Slave Select input (APFCON SSSEL=1).
3 RA1/AN1 bidirectional General purpose I/O or ADC channel 1 input.
4 RA2/AN2 bidirectional General purpose I/O or ADC channel 2 input.
5 RA3/AN3/VREF+ bidirectional General purpose I/O, ADC channel 3 input, or ADC positive voltage reference input.
6 RA4/T0CKI bidirectional General purpose I/O or Timer0 clock input.
7 RA5/AN4/SS/VCAP bidirectional General purpose I/O, ADC channel 4 input, default Slave Select input, or voltage regulator filter capacitor pin (PIC16F1516 only).
8 VSS power_in Ground reference.
9 RA7/OSC1/CLKIN bidirectional General purpose I/O, crystal/resonator connection (LP, XT, HS modes), or external clock input (EC mode).
10 RA6/OSC2/CLKOUT bidirectional General purpose I/O, crystal/resonator connection (LP, XT, HS modes), or FOSC/4 output.
11 RC0/SOSCO/T1CKI bidirectional General purpose I/O, secondary oscillator connection, or Timer1 clock input.
12 RC1/SOSCI/CCP2 bidirectional General purpose I/O, secondary oscillator connection, or Capture/Compare/PWM 2 (default location).
13 RC2/AN14/CCP1 bidirectional General purpose I/O, ADC channel 14 input, or Capture/Compare/PWM 1.
14 RC3/AN15/SCK/SCL bidirectional General purpose I/O, ADC channel 15 input, SPI clock, or I2C clock (open-drain).
15 RC4/AN16/SDI/SDA bidirectional General purpose I/O, ADC channel 16 input, SPI data input, or I2C data input/output (open-drain).
16 RC5/AN17/SDO bidirectional General purpose I/O, ADC channel 17 input, or SPI data output.
17 RC6/AN18/TX/CK bidirectional General purpose I/O, ADC channel 18 input, USART asynchronous transmit, or USART synchronous clock.
18 RC7/AN19/RX/DT bidirectional General purpose I/O, ADC channel 19 input, USART asynchronous receive, or USART synchronous data.
19 VSS power_in Ground reference.
20 VDD power_in Positive supply; 2.3V-5.5V for PIC16F1516.
21 RB0/AN12/INT bidirectional General purpose I/O with IOC and WPU, ADC channel 12 input, or external interrupt.
22 RB1/AN10 bidirectional General purpose I/O with IOC and WPU, or ADC channel 10 input.
23 RB2/AN8 bidirectional General purpose I/O with IOC and WPU, or ADC channel 8 input.
24 RB3/AN9/CCP2 bidirectional General purpose I/O with IOC and WPU, ADC channel 9 input, or alternate-location Capture/Compare/PWM 2.
25 RB4/AN11 bidirectional General purpose I/O with IOC and WPU, or ADC channel 11 input.
26 RB5/AN13/T1G bidirectional General purpose I/O with IOC and WPU, ADC channel 13 input, or Timer1 gate input.
27 RB6/ICSPCLK bidirectional General purpose I/O with IOC and WPU, or in-circuit programming/debug clock.
28 RB7/ICSPDAT bidirectional General purpose I/O with IOC and WPU, or ICSP data I/O.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-28-300mil
Category Embedded Processors & Controllers
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (FOSC ≤ 16 MHz) VDD 2.3 5.5 V FOSC ≤ 16 MHz 269
Supply Voltage (16 MHz < FOSC ≤ 20 MHz) VDD 2.5 5.5 V FOSC ≤ 20 MHz 269
RAM Data Retention Voltage VDR 1.7 V Device in Sleep mode 269
Power-on Reset Release Voltage VPOR 1.6 V 269
Power-on Reset Rearm Voltage VPORR 1.42 V 269
Fixed Voltage Reference Voltage for ADC VADFVR -8 6 % 1.024V, VDD ≥ 2.5V; 2.048V, VDD ≥ 2.5V; 4.096V, VDD ≥ 4.75V 269
VDD Rise Rate for internal POR SVDD 0.05 V/ms See Section 6.1 269
Supply Current, LP 32 kHz IDD 13 38 µA FOSC = 32 kHz LP, VDD = 3.0V, -40°C ≤ TA ≤ +85°C 271
Supply Current, LP 32 kHz IDD 14 45 µA FOSC = 32 kHz LP, VDD = 5.0V, -40°C ≤ TA ≤ +85°C 271
Supply Current, XT 1 MHz IDD 170 350 µA FOSC = 1 MHz XT, VDD = 5.0V 271
Supply Current, XT 4 MHz IDD 370 650 µA FOSC = 4 MHz XT, VDD = 5.0V 271
Supply Current, EC 500 kHz low-power IDD 40 60 µA FOSC = 500 kHz EC, VDD = 5.0V 271
Supply Current, EC 4 MHz medium-power IDD 330 480 µA FOSC = 4 MHz EC, VDD = 5.0V 271
Supply Current, EC 20 MHz high-power IDD 1.7 2 mA FOSC = 20 MHz EC, VDD = 5.0V 272
Supply Current, LFINTOSC 31 kHz IDD 25 40 µA FOSC = 31 kHz LFINTOSC, VDD = 5.0V, -40°C ≤ TA ≤ +85°C 272
Supply Current, HFINTOSC 500 kHz IDD 335 400 µA FOSC = 500 kHz HFINTOSC, VDD = 5.0V 272
Supply Current, HFINTOSC 8 MHz IDD 0.75 1.1 mA FOSC = 8 MHz HFINTOSC, VDD = 5.0V 272
Supply Current, HFINTOSC 16 MHz IDD 1.2 1.7 mA FOSC = 16 MHz HFINTOSC, VDD = 5.0V 272
Supply Current, HS 20 MHz IDD 1.7 2.1 mA FOSC = 20 MHz HS, VDD = 5.0V 273
Supply Current, EXTRC 4 MHz IDD 350 500 µA FOSC = 4 MHz EXTRC (Note 4), VDD = 5.0V 273
Base Power-down Current IPD 0.47 6 µA VDD = 5.0V, WDT, BOR, FVR, SOSC disabled, low-power regulator active; max at +85°C (15 at +125°C) 274
Base Power-down Current IPD 0.3 4 µA VDD = 3.0V, WDT, BOR, FVR, SOSC disabled, low-power regulator active; max at +85°C 274
LPWDT Current IPD 0.85 8 µA VDD = 5.0V; max at +85°C 274
FVR Current IPD 20 29 µA VDD = 5.0V; max at +85°C 274
BOR Current IPD 9 20 µA VDD = 5.0V; max at +85°C 274
LPBOR Current IPD 0.45 8 µA VDD = 5.0V; max at +85°C 274
SOSC Current IPD 1.4 10 µA VDD = 5.0V; max at +85°C 274
ADC Current, no conversion IPD 0.5 6 µA VDD = 5.0V, no conversion in progress; max at +85°C 274
ADC Current, conversion in progress IPD 280 µA VDD = 5.0V, conversion in progress 275
Input Low Voltage, TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 276
Input Low Voltage, TTL buffer VIL 0.15 V 1.8V ≤ VDD ≤ 4.5V; printed as 0.15 VDD 276
Input Low Voltage, Schmitt Trigger VIL 0.2 V 2.0V ≤ VDD ≤ 5.5V; printed as 0.2 VDD 276
Input High Voltage, TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 276
Input High Voltage, Schmitt Trigger VIH 0.8 V 2.0V ≤ VDD ≤ 5.5V; printed as 0.8 VDD 276
Input Leakage Current, I/O ports IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance at 85°C (±1000 at 125°C) 276
Input Leakage Current, MCLR IIL -200 50 200 nA VSS ≤ VPIN ≤ VDD at 85°C 276
Weak Pull-up Current IPUR 25 140 300 µA VDD = 5.0V, VPIN = VSS 276
Output Low Voltage, I/O ports VOL 0.6 V IOL = 8 mA, VDD = 5V; IOL = 6 mA, VDD = 3.3V; IOL = 1.8 mA, VDD = 1.8V 276
Output High Voltage, I/O ports VOH 0.7 V VDD - 0.7; IOH = 3.5 mA, VDD = 5V; IOH = 3 mA, VDD = 3.3V; IOH = 1 mA, VDD = 1.8V 277
HFINTOSC Frequency HFOSC 16 MHz VDD = 3.0V at +25°C; tolerance 6.5% 282
Brown-out Reset Voltage, BORV = 0 VBOR 2.55 2.7 2.85 V BORV = 0 285
Brown-out Reset Voltage, BORV = 1 VBOR 2.35 2.45 2.58 V BORV = 1 (PIC16F1516/7/8/9) 285
Low-Power Brown-out Reset Voltage VLPBOR 1.8 2.1 2.5 V LPBOR = 0 285
LDO Regulation Voltage 3 V 290
Absolute Max VDD VDD -0.3 6.5 V PIC16F1516/7/8/9, with respect to VSS 265
Absolute Max MCLR Voltage -0.3 9 V with respect to VSS 265
Absolute Max Voltage on other pins -0.3 V -0.3V to (VDD + 0.3V) with respect to VSS 265
Storage Temperature -65 150 °C 265
Ambient Temperature under bias -40 125 °C 265
Max current on VSS pin, 28-pin 350 mA -40°C ≤ TA ≤ +85°C (120 mA at +85°C ≤ TA ≤ +125°C) 265
Max current on VDD pin, 28-pin 250 mA -40°C ≤ TA ≤ +85°C (85 mA at +85°C ≤ TA ≤ +125°C) 265
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 265
Max output current sunk by any I/O pin 50 mA 265
Max output current sourced by any I/O pin 50 mA 265
Operating Ambient Temperature, Industrial TA -40 85 °C Industrial 266
Thermal Resistance Junction to Ambient θJA 69.7 °C/W 28-pin SOIC package 279
Thermal Resistance Junction to Case θJC 18.9 °C/W 28-pin SOIC package 279
Maximum Junction Temperature TJMAX 150 °C 279

CAD (KiCad official)

  • Symbol: PIC16F1516-I
  • Footprint: Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm
  • 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
  • 3D model files: pic16f1516-i-etched.step / pic16f1516-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f1516-i.step / pic16f1516-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (359 pp, sha256 36ecb0635584b704, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF