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PIC12F1840-E

Microchip Tech · Microcontrollers (MCU/MPU/SOC) · PDIP-8

PIC12F1840-E from Microchip Tech, in a PDIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply; the PIC12F1840 operates from 2.3V-5.5V (the PIC12LF1840 from 1.8V-3.6V).
2 RA5 bidirectional General-purpose I/O (25 mA sink/source) that is also CLKIN external clock input, OSC1 crystal connection, Timer1 oscillator input T1OSI, Timer1 clock input T1CKI, SR latch inverting output SRNQ, PWM P1A, CCP1, and USART DT/RX.
3 RA4 bidirectional General-purpose I/O (25 mA sink/source) that is also ADC channel AN3, capacitive sensing CPS3, OSC2/CLKOUT crystal connection or FOSC/4 output, Timer1 oscillator output T1OSO, comparator C1IN1-, clock reference CLKR, SPI SDO, USART CK/TX, PWM P1B, Timer1 gate T1G, and modulator carrier input MDCIN2.
4 MCLR/VPP/RA3 input RA3 is an input-only pin (TRISA3 always reads '1') that functions as Master Clear reset input MCLR with internal pull-up or as high-voltage programming input VPP, and also carries the SS and T1G alternate functions.
5 RA2 bidirectional General-purpose I/O (25 mA sink/source) that is also ADC channel AN2, capacitive sensing CPS2, comparator C1OUT, SR latch output SRQ, Timer0 clock T0CKI, CCP1/P1A, ECCP auto-shutdown fault input FLT0, I2C SDA, SPI SDI, external interrupt INT, and modulator carrier input MDCIN1.
6 RA1/ICSPCLK bidirectional General-purpose I/O (25 mA sink/source) that is also ADC channel AN1, VREF input, capacitive sensing CPS1, comparator C1IN0-, SR latch input SRI, USART RX/DT, I2C SCL, SPI SCK, modulator source input MDMIN, and the ICSP serial programming clock ICSPCLK.
7 RA0/ICSPDAT bidirectional General-purpose I/O (25 mA sink/source) that is also ADC channel AN0, DAC output DACOUT, capacitive sensing CPS0, comparator C1IN+, USART TX/CK, SPI SDO and SS, PWM P1B, modulator output MDOUT, and the ICSP data pin ICSPDAT.
8 VSS power_in Ground reference for the device.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package PDIP-8
Category Embedded Processors & Controllers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature under bias -40 125 °C 302
Storage temperature -65 150 °C 302
Voltage on VDD with respect to VSS, PIC12F1840 VDD -0.3 6.5 V PIC12F1840 302
Voltage on MCLR with respect to VSS -0.3 9 V 302
Voltage on all other pins with respect to VSS -0.3 V Printed maximum is (VDD + 0.3V) 302
Maximum current out of VSS pin, industrial 170 mA -40°C ≤ TA ≤ +85°C for industrial 302
Maximum current out of VSS pin, extended 70 mA -40°C ≤ TA ≤ +125°C for extended 302
Maximum current into VDD pin, industrial 170 mA -40°C ≤ TA ≤ +85°C for industrial 302
Maximum current into VDD pin, extended 70 mA -40°C ≤ TA ≤ +125°C for extended 302
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 302
Operating temperature, extended (-E) TA -40 125 °C Extended range, -40°C ≤ TA ≤ +125°C 305
Supply voltage VDD (VDDMIN, VDDMAX) VDD 2.3 5.5 V FOSC ≤ 16 MHz 305
Supply voltage VDD (VDDMIN, VDDMAX) VDD 2.5 5.5 V FOSC ≤ 32 MHz 305
RAM data retention voltage VDR 1.7 V Device in Sleep mode 305
VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 V/ms See Section 7.1 Power-On Reset (POR) 305
Fixed Voltage Reference voltage for ADC VADFVR -8 6 % 1.024V, VDD ≥ 2.5V; 2.048V, VDD ≥ 2.5V; 4.096V, VDD ≥ 4.75V 305
Fixed Voltage Reference voltage for Comparator and DAC VCDAFVR -11 7 % 1.024V, VDD ≥ 2.5V; 2.048V, VDD ≥ 2.5V; 4.096V, VDD ≥ 4.75V 305
Supply current IDD, LP oscillator 32 kHz (extended) IDD 17 60 µA VDD = 2.3V, FOSC = 32 kHz LP oscillator, -40°C ≤ TA ≤ +125°C 307
Supply current IDD, LP oscillator 32 kHz (extended) IDD 19 70 µA VDD = 3.0V, FOSC = 32 kHz LP oscillator, -40°C ≤ TA ≤ +125°C 307
Supply current IDD, LP oscillator 32 kHz (extended) IDD 22 80 µA VDD = 5.0V, FOSC = 32 kHz LP oscillator, -40°C ≤ TA ≤ +125°C 307
Supply current IDD, HFINTOSC 16 MHz IDD 0.9 1.5 mA VDD = 2.3V, FOSC = 16 MHz HFINTOSC 308
Supply current IDD, HFINTOSC 16 MHz IDD 1.2 2 mA VDD = 3.0V, FOSC = 16 MHz HFINTOSC 308
Supply current IDD, HFINTOSC 16 MHz IDD 1.3 2.1 mA VDD = 5.0V, FOSC = 16 MHz HFINTOSC 308
Supply current IDD, EXTRC 4 MHz IDD 290 400 µA VDD = 2.3V, FOSC = 4 MHz EXTRC 309
Supply current IDD, EXTRC 4 MHz IDD 415 550 µA VDD = 3.0V, FOSC = 4 MHz EXTRC 309
Supply current IDD, EXTRC 4 MHz IDD 495 600 µA VDD = 5.0V, FOSC = 4 MHz EXTRC 309
Power-down base current IPD (WDT, BOR, FVR, T1OSC disabled), +125°C IPD 0.2 10 µA VDD = 2.3V, all peripherals inactive, Max. at +125°C 310
Power-down base current IPD (WDT, BOR, FVR, T1OSC disabled), +125°C IPD 0.3 12 µA VDD = 3.0V, all peripherals inactive, Max. at +125°C 310
Power-down base current IPD (WDT, BOR, FVR, T1OSC disabled), +125°C IPD 0.5 15 µA VDD = 5.0V, all peripherals inactive, Max. at +125°C 310
Input low voltage, I/O port with TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 312
Input high voltage, I/O port with TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 312
Input leakage current, I/O ports (85°C) IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, pin at high impedance, 85°C 312
Input leakage current, MCLR (85°C) IIL -200 50 200 nA VSS ≤ VPIN ≤ VDD, pin at high impedance, 85°C 312
Weak pull-up current IPUR 25 100 200 µA VDD = 3.3V, VPIN = VSS 312
Weak pull-up current IPUR 25 140 300 µA VDD = 5.0V, VPIN = VSS 312
Output low voltage, I/O ports VOL 0.6 V IOL = 8 mA, VDD = 5V 312
Capacitive loading, OSC2 pin COSC2 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 313
Capacitive loading, all I/O pins CIO 50 pF All I/O pins 313
MCLR pulse width (low) TMCL 2 µs 321
Low-power Watchdog Timer time-out period TWDTLP 10 16 27 ms VDD = 3.3V-5V, 1:16 Prescaler used 321
Power-up Timer period, PWRTE = 0 TPWRT 40 65 140 ms PWRTE = 0 321
Brown-out Reset voltage, BORV = 0 VBOR 2.55 2.7 2.85 V BORV = 0, PIC12F1840 321
Brown-out Reset voltage, BORV = 1 VBOR 2.35 2.45 2.58 V BORV = 1, PIC12F1840 321
Brown-out Reset hysteresis VHYST 0 25 75 mV -40°C to +85°C 321
I/O high-impedance from MCLR Low or Watchdog Timer Reset TIOZ 2 µs 321
Brown-out Reset DC response time TBORDC 1 3 35 µs VDD ≤ VBOR 321
Data EEPROM byte endurance ED 100 K E/W -40°C to +85°C 314
Program Flash cell endurance EP 10 K E/W -40°C to +85°C, self-write and block erase 314
HFINTOSC frequency tolerance HFOSC -2 2 % HFINTOSC, 0°C ≤ TA ≤ +60°C, VDD ≥ 2.5V 318
HFINTOSC frequency tolerance HFOSC -3 3 % HFINTOSC, 60°C ≤ TA ≤ +85°C, VDD ≥ 2.5V 318
HFINTOSC frequency tolerance HFOSC -5 5 % HFINTOSC, -40°C ≤ TA ≤ +125°C 318
ADC clock period TAD (FOSC-based) TAD 1 9 µs VDD = 3.0V, TA ≤ 25°C 324
Maximum junction temperature TJMAX 150 °C 315
Thermal resistance junction to ambient, 8-pin PDIP JA 89.3 °C/W 8-pin PDIP package 315
Thermal resistance junction to case, 8-pin PDIP JC 43.1 °C/W 8-pin PDIP package 315

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin SN = SOIC, 8-Lead Pattern: QTP, SQTP, Code or Special Requirements 395

CAD (KiCad official)

  • Symbol: PIC12F1840-E
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: PDIP-8 (KiCad packages3D, STEP)
  • 3D model files: pic12f1840-e-etched.step / pic12f1840-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic12f1840-e.step / pic12f1840-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (397 pp, sha256 79e88d8e63728e96, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF