component
PGA300ARHHR
Public Made by Adomby adom
Texas Instruments Pre-ordered Chips, VQFN-36-EP(6x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPGA300ARHHR
Texas Instruments · Pre-ordered Chips · VQFN-36-EP(6x6)
PGA300ARHHR from Texas Instruments, in a VQFN-36-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 2 | DVDD_MEM | power_in | Supply for the EEPROM and OTP; connect to DVDD. |
| 3 | DVDD | power_out | DVDD regulator output (1.8 V typical); connect a 100 nF capacitor to DVSS. |
| 4 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 5 | PWR | power_in | Input supply (3.3 V to 30 V recommended, also the OWI communication line); connect a 100 nF capacitor to GND. |
| 6 | DACCAP | passive | DAC capacitor pin for the external RC low-pass filter between the DAC output and the DAC gain amplifier. |
| 7 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 8 | OUT | output | DAC gain stage output (absolute rating -0.3 V to 33 V). |
| 9 | AVDD | power_out | AVDD regulator output (3 V typical); connect a 100 nF capacitor to AVSS. |
| 10 | GND | power_in | Ground; connect AVSS, DVSS and GND together. |
| 11 | FB- | input | Feedback negative input of the output amplifier; connect to OUT in voltage output mode, unused in current output mode. |
| 12 | FB+ | input | Feedback positive input of the output amplifier (-2 V to VPWR + 0.3 V); returns to the supply return in current output mode, unused in voltage output mode. |
| 13 | COMP | input | Output amplifier compensation pin for driving large capacitive loads. |
| 14 | BRG- | power_out | Bridge drive, negative terminal. |
| 15 | BRG+ | power_out | Bridge drive, positive terminal (programmable 2.5 V, 2 V or 1.25 V bridge supply). |
| 16 | REFCAP | passive | Precision reference capacitor pin; connect a 100 nF capacitor to AVSS (10 nF to 1000 nF allowed). |
| 17 | INP- | input | Resistive sensor negative input (-0.3 V to 2 V absolute maximum). |
| 18 | INP+ | input | Resistive sensor positive input (-0.3 V to 2 V absolute maximum). |
| 19 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 20 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 21 | INT+ | input | External temperature sensor positive input (-0.3 V to 2 V absolute maximum). |
| 22 | INT- | input | External temperature sensor negative input (-0.3 V to 2 V absolute maximum). |
| 23 | AVSS | power_in | Analog ground; connect AVSS, DVSS and GND together. |
| 24 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 25 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 26 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 27 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 28 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 29 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 30 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 31 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 32 | DVSS | power_in | Digital ground; connect AVSS, DVSS and GND together. |
| 33 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 34 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 35 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 36 | NU | unconnected | No external connection: leave floating; solder to the PCB but do not connect electrically to any net. |
| 37 | Thermal Pad | power_in | Exposed thermal pad; connect to AVSS. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-36-EP(6x6) |
| Category | Interface ICs |
| Pins | 37 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VPWR | -28 | 33 | V | 5 | ||
| Voltage at sensor input pins INP+, INP-, INT+, INT- | -0.3 | 2 | V | 5 | |||
| Voltage at AVDD, AVSS, BRG+, BRG-, COMP, DACCAP, DVDD, DVDD_MEM, DVSS, FB-, REFCAP | -0.3 | 3.6 | V | 5 | |||
| Voltage at FB+ pin | -2 | V | max = VPWR + 0.3 V | 5 | |||
| Voltage at OUT pin | -0.3 | 33 | V | 5 | |||
| Supply current (OUT shorted to GND) | IPWR | 25 | mA | OUT pin shorted to GND | 5 | ||
| Maximum junction temperature | TJmax | 155 | °C | 5 | |||
| Storage temperature | Tstg | -40 | 150 | °C | 5 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | HBM, ANSI/ESDA/JEDEC JS-001 | 5 | |
| ESD CDM | V(ESD) | -500 | 500 | V | CDM, JESD22-C101 | 5 | |
| Supply voltage | VPWR | 3.3 | 30 | V | 5 | ||
| Slew rate | 0.5 | V/µs | VPWR = 0V to 30V | 5 | |||
| Capacitance on PWR pin | 10 | 100 | nF | 5 | |||
| Capacitance on REFCAP pin | 10 | 100 | 1000 | nF | 5 | ||
| Operating ambient temperature | TA | -40 | 150 | °C | 5 | ||
| EEPROM programming temperature | -40 | 140 | °C | 5 | |||
| Junction-to-ambient thermal resistance | RθJA | 30.6 | °C/W | RHH (VQFN) 36 pin | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 16.4 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 5.4 | °C/W | 5 | |||
| Junction-to-top characterization parameter | ψJT | 0.2 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ψJB | 5.4 | °C/W | 5 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 0.7 | °C/W | 5 | |||
| Reverse voltage | -28 | V | 6 | ||||
| Drop across reverse voltage protection element | 20 | mV | 6 | ||||
| AVDD voltage | VAVDD | 3 | V | CAVDD = 100nF | 6 | ||
| DVDD voltage - operating | VDVDD | 1.8 | V | CDVDD = 100nF | 6 | ||
| Bridge excitation voltage, 2.5 V setting | VBRG+, VBRG- | 2.5 | V | VBRDG_CTRL[1:0] = 0b00, no load | 6 | ||
| Bridge current supply | IBRG | 1.5 | mA | 6 | |||
| Bridge capacitive load | CBRG | 2 | nF | RBRG = 20kΩ | 6 | ||
| External temperature sensor capacitive load | CTEMP | 100 | nF | 6 | |||
| Internal temperature sensor range | -40 | 150 | °C | 6 | |||
| P gain input offset voltage | 10 | µV | 7 | ||||
| P gain CMRR | 110 | dB | fCM = 50Hz, P gain = 5V/V | 7 | |||
| P ADC INL | INL | -0.5 | 0.5 | LSB | 8 | ||
| P ADC differential input range | -2.5 | 2.5 | V | 8 | |||
| T ADC INL | INL | -0.5 | 0.5 | LSB | 8 | ||
| Supply current, normal operation | IPWR | 2.5 | mA | No load on BRG, no load on DAC | 11 | ||
| Supply current, EEPROM programming | IPWR | 9 | mA | EEPROM programming, no load on BRG and DAC | 11 |
CAD (KiCad official)
- Symbol:
PGA300ARHHR - Footprint:
Package_DFN_QFN:QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm - 3D model: VQFN-36-EP(6x6) (KiCad packages3D, STEP)
- 3D model files:
pga300arhhr-etched.step/pga300arhhr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pga300arhhr.step/pga300arhhr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (80 pp, sha256
95d99ebc3c877db5, retrieved 2026-10-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).