component
PCF8574P
Public Made by Adomby adom
HGSEMI I/O Expanders, DIP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPCF8574P
HGSEMI · I/O Expanders · DIP-16
PCF8574P from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Hardware address input 0, one of three pins that set the device's I2C slave address (up to 8 PCF8574 devices on one bus). |
| 2 | A1 | input | Hardware address input 1, one of three pins that set the device's I2C slave address (up to 8 PCF8574 devices on one bus). |
| 3 | A2 | input | Hardware address input 2, one of three pins that set the device's I2C slave address (up to 8 PCF8574 devices on one bus). |
| 4 | P0 | bidirectional | Quasi-bidirectional I/O 0 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 5 | P1 | bidirectional | Quasi-bidirectional I/O 1 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 6 | P2 | bidirectional | Quasi-bidirectional I/O 2 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 7 | P3 | bidirectional | Quasi-bidirectional I/O 3 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 8 | VSS | power_in | Supply ground, 0 V reference for the device. |
| 9 | P4 | bidirectional | Quasi-bidirectional I/O 4 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 10 | P5 | bidirectional | Quasi-bidirectional I/O 5 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 11 | P6 | bidirectional | Quasi-bidirectional I/O 6 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 12 | P7 | bidirectional | Quasi-bidirectional I/O 7 with latched output; LOW-level output current IOL is 10 mA min to 25 mA max at VOL = 1 V with VDD = 5 V, and it is HIGH at power-on. |
| 13 | INT | output | Open-drain interrupt output, active LOW, signalling a change on the port inputs to the microcontroller; minimum IOL is 1.6 mA at VOL = 0.4 V. |
| 14 | SCL | input | I2C-bus serial clock line, which must be pulled up to the positive supply and runs at up to 100 kHz. |
| 15 | SDA | bidirectional | I2C-bus serial data line, which must be pulled up to the positive supply and carries data in both directions. |
| 16 | VDD | power_in | Supply voltage, specified from 2.5 V to 6.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-16 |
| Category | Interface |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | -0.5 | 7 | V | 11 | ||
| DC input current | II | 20 | mA | 11 | |||
| DC output current | IO | 25 | mA | 11 | |||
| Supply current | IDD | 100 | mA | 11 | |||
| Total power dissipation | Ptot | 400 | mW | 11 | |||
| Power dissipation per output | PO | 100 | mW | 11 | |||
| Storage temperature | Tstg | -65 | 150 | ℃ | 11 | ||
| Operating ambient temperature | Tamb | -40 | 85 | ℃ | 11 | ||
| Lead temperature (soldering) | TL | 260 | ℃ | Soldering, 10 seconds | 11 | ||
| Supply voltage | VDD | 2.5 | 6 | V | 11 | ||
| Supply current, operating mode | IDD | 40 | 100 | µA | operating mode; VDD = 6 V; no load; VI = VDD or VSS; fSCL = 100 kHz | 11 | |
| Standby current | Istb | 2.5 | 10 | µA | standby mode; VDD = 6 V; no load; VI = VDD or VSS | 11 | |
| Power-on reset voltage | VPOR | 1.3 | 2.4 | V | VDD = 6 V; no load; VI = VDD or VSS; note 1 | 11 | |
| LOW level input voltage (SCL, SDA) | VIL | -0.5 | V | 11 | |||
| LOW level output current (SDA) | IOL | 3 | mA | VOL = 0.4 V | 11 | ||
| Leakage current (SCL, SDA) | IL | -1 | 1 | µA | VI = VDD or VSS | 11 | |
| Input capacitance (SCL, SDA) | Ci | 7 | pF | VI = VSS | 11 | ||
| LOW level input voltage (I/Os) | VIL | -0.5 | V | 12 | |||
| Maximum allowed input current through protection diode | IIHL(max) | 400 | µA | VI ≥ VDD or VI ≤ VSS | 12 | ||
| LOW level output current (I/Os) | IOL | 10 | 25 | mA | VOL = 1 V; VDD = 5 V | 12 | |
| HIGH level output current (I/Os) | IOH | 30 | 300 | µA | VOH = VSS | 12 | |
| Input capacitance (I/Os) | Ci | 10 | pF | 12 | |||
| Output capacitance (I/Os) | Co | 10 | pF | 12 | |||
| Output data valid time | tpv | 4 | µs | CL ≤ 100 pF (see Figs 10 and 11) | 12 | ||
| LOW level output current (INT) | IOL | 1.6 | mA | VOL = 0.4 V | 12 | ||
| Leakage current (INT) | IL | -1 | 1 | µA | VI = VDD or VSS | 12 | |
| Input data valid time | tiv | 4 | µs | CL ≤ 100 pF | 12 | ||
| Reset delay time | tir | 4 | µs | CL ≤ 100 pF | 12 | ||
| LOW level input voltage (A0 to A2) | VIL | -0.5 | V | 12 | |||
| Input leakage current (A0 to A2) | ILI | -250 | 250 | nA | pin at VDD or VSS | 12 | |
| SCL clock frequency | fSCL | 100 | kHz | 13 | |||
| Tolerable spike width on bus | tSW | 100 | ns | 13 | |||
| Bus free time | tBUF | 4.7 | µs | 13 | |||
| START condition set-up time | tSU;STA | 4.7 | µs | 13 | |||
| START condition hold time | tHD;STA | 4 | µs | 13 | |||
| SCL LOW time | tLOW | 4.7 | µs | 13 | |||
| SCL HIGH time | tHIGH | 4 | µs | 13 | |||
| SCL and SDA rise time | tr | 1 | µs | 13 | |||
| SCL and SDA fall time | tf | 0.3 | µs | 13 | |||
| Data set-up time | tSU;DAT | 250 | ns | 13 | |||
| Data hold time | tHD;DAT | 0 | ns | 13 | |||
| SCL LOW to data out valid | tVD;DAT | 3.4 | µs | 13 | |||
| STOP condition set-up time | tSU;STO | 4 | µs | 13 | |||
| HIGH level output current (I/Os) | IOHt | -1 | mA | Transient pull-up current HIGH during acknowledge (see Fig.14); VOH = VSS; VDD = 2.5 V | 12 | ||
| Input data set-up time | tsu | 0 | µs | CL ≤ 100 pF | 12 | ||
| Input data hold time | th | 4 | µs | CL ≤ 100 pF | 12 |
CAD (KiCad official)
- Symbol:
PCF8574P - Footprint:
Package_DIP:DIP-16_W7.62mm - 3D model: DIP-16 (KiCad packages3D, STEP)
- 3D model files:
pcf8574p-etched.step/pcf8574p-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pcf8574p.step/pcf8574p.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (18 pp, sha256
b4f2128e4d380a5d, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).