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PCA82C250M

Public Made by Adom

by adom

HGSEMI CAN Transceivers, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PCA82C250M

HGSEMI · CAN Transceivers · SOP-8

PCA82C250M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmitter data input: a LOW level drives the bus dominant, while HIGH or floating leaves it recessive; the MCU-side port is rated -0.3 V to VCC+0.3 V.
2 GND power_in Ground reference for the device; all voltage limits in the datasheet are referenced to this pin.
3 VCC power_in Supply voltage input, recommended 4.5 V to 5.5 V, with an absolute maximum of -0.3 V to +7 V.
4 RXD output Receiver data output that goes LOW when the bus is dominant and HIGH when the bus is recessive; the MCU-side port is rated -0.3 V to VCC+0.3 V.
5 VREF power_in Reference voltage output of 0.45VCC to 0.55VCC at V8 = 1 V (
6 CANL bidirectional Low-level CAN bus line I/O, rated -36 V to +36 V on the bus side, with transient withstand of -200 V to +200 V per the Figure 7 test.
7 CANH bidirectional High-level CAN bus line I/O, rated -36 V to +36 V on the bus side, with transient withstand of -200 V to +200 V per the Figure 7 test.
8 Rs input Mode/slope-control input: tie to GND for high-speed mode, connect a resistor to GND for slope-control mode, or drive HIGH (≥0.75VCC) for low-power standby.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.3 7 V 2
MCU-side pins TXD, RXD, VREF, Rs voltage -0.3 V 2
Bus-side input voltage CANL, CANH -36 36 V 2
Transient voltage pins 6, 7 Vtr -200 200 V pins 6,7; see Fig. 7 2
Storage operating temperature range -55 150 ℃ 2
Ambient temperature -40 125 ℃ 2
Lead soldering temperature TLEAD 245 ℃ 10 s 2
Continuous power dissipation 400 mW SOP8 package 2
Supply voltage Vcc 4.5 5.5 V 3
Supply current, standby mode Icc 275 uA standby mode 3
Maximum transmission rate 1/tbit 1 Mbaud non-return-to-zero code 3
CANH, CANL input/output voltage Vcan -36 36 V 3
Bus differential voltage Vdiff 1.5 3 V 3
Ambient temperature Tamb -40 125 ℃ 3
Low-level input voltage VIL -0.3 V input recessive (输入隐性) 3
High-level input current VIH -200 30 uA V1=4V 3
Low-level input current VIL -100 -600 uA V1=1V 3
Recessive bus voltage V6,7 2 3 V V1=4V, no load 3
Off-state output leakage current ILO -2 2 mA -2V<(V6,V7)<-7V 3
Off-state output leakage current ILO -10 10 mA -5V<(V6,V7)<36V 3
CANH output voltage V7 3 4.5 V V1=1V, VCC=4.75~5.5V 3
CANH output voltage V7 2.75 4.5 V V1=1V, VCC=4.75~5.5V 3
CANL output voltage V6 0.5 2 V V1=1V 3
Differential output voltage pins 6, 7 ΔV6,7 1.5 3 V V1=1V 3
Differential output voltage pins 6, 7 ΔV6,7 1.5 V V1=1V, RL=45Ω 3
Differential output voltage pins 6, 7 (recessive) ΔV6,7 -500 50 mV V1=4V, no load 3
CANH short-circuit current Isc7 -100 -200 mA V7=-36V 3
CANL short-circuit current Isc6 200 mA V6=+36V 3
Recessive differential input voltage Vdiff(r) -1 0.5 V NOTE1 4
Recessive differential input voltage Vdiff(r) -1 0.4 V -7V<(V6,V7)<12V; NOTE1 4
Dominant differential input voltage Vdiff(d) 0.9 5 V -7V<(V6,V7)<12V, 非待机模式 4
Dominant differential input voltage Vdiff(d) 1 5 V 4
Dominant differential input voltage (standby) Vdiff(d) 0.97 5 V 待机模式 4
Dominant differential input voltage (standby) Vdiff(d) 0.91 5 V VCC=4.5~5.1V, 待机模式 4
Differential input hysteresis Vdiff(hys) 150 mV see Fig. 4 4
Low-level output voltage pin 4 VOL 0 V I4=1mA 4
Low-level output voltage pin 4 VOL 0 1.5 V I4=10mA 4
CANH, CANL input impedance Ri 5 25 KΩ 4
Differential input impedance Rdiff 20 100 KΩ 4
Minimum bit time tbit 1 us R8=0Ω 5
TXD to bus active delay tonTXD 50 ns R8=0Ω 5
TXD to bus inactive delay toffTXD 40 80 ns R8=0Ω 5
TXD to receiver active delay tonRXD 55 120 ns R8=0Ω 5
TXD to receiver inactive delay toffRXD 100 190 ns R8=0Ω 5
TXD to receiver inactive delay toffRXD 300 400 ns R8=47KΩ 5
CANH, CANL slew rate /SR/ 7 V/us R8=47KΩ 5
Wake-up delay from standby via pin 8 twake 20 us see Fig. 5 5
Bus dominant to RXD low delay in standby tdRXDL 3 us V8=4V; see Fig. 6 5
Slope control mode current Islope -10 -200 uA 5
Supply current, dominant I3 78 mA dominant; V1=1V; VCC<5.1V 5
Supply current, dominant I3 80 mA dominant; V1=1V; VCC<5.25V 5
Supply current, dominant I3 85 mA dominant; V1=1V; VCC<5.5V 5
Supply current, recessive I3 10 mA recessive; V1=4V; R8=47kΩ 5
Supply current, standby mode I3 275 uA standby mode; NOTE2 5

CAD (KiCad official)

  • Symbol: PCA82C250M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: pca82c250m-etched.step / pca82c250m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pca82c250m.step / pca82c250m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 b14105ddc58a806f, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF