PAM2863ECR

@@ -0,0 +1,48 @@+# PAM2863ECR++**Diodes Incorporated** · LED Drivers · SOIC-8-EP++PAM2863ECR from Diodes Incorporated, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VIN | power_in | Input supply voltage, 4.5V to 40V (absolute max -0.3V to +40V). Decouple to ground with a 10µF or higher X7R ceramic capacitor placed close to the device. |+| 2 | ISENSE | input | High-side current-sense input. Connect resistor Rs from this pin to VIN to program the nominal average output current: IOUT(nom) = 0.1V / Rs (VSENSE typical 100mV). Input current typ. 8µA. |+| 3 | AGND | power_in | Analog ground (0V). Shown as AGND on the pin-assignment diagram; the pin-description table groups pins 3, 7, 8 together as GND. Tie to the ground plane. |+| 4 | VSET | input | Multi-function on/off and brightness control. Leave floating for normal operation. Drive <0.2V to disable output; DC voltage 0.3V-2.5V adjusts output current from 12% to 100% of IOUT(nom); PWM (open-collector/open-drain) at f<500Hz gives 1%-100% range. A capacitor from VSET to GND sets soft-start time (default ~0.1ms; ~1.5ms with 1nF). Abs max -0.3V to +6.0V. |+| 5 | LX | output | Drain of internal 40V NDMOS switch. Connect to the external Schottky diode / inductor node of the step-down power stage. Rated to 40V, RDS(on) typ. 0.3Ω @ 100mA, peak inductor current limit 2.5A. Pins 5 and 6 are internally tied and should both be soldered. |+| 6 | LX | output | Drain of internal 40V NDMOS switch (paralleled with pin 5 for current handling / thermal). Same electrical net as pin 5. |+| 7 | PGND | power_in | Power ground return for the internal NDMOS switch (0V). Pin-assignment diagram labels PGND; pin-description table groups pins 3,7,8 as GND. Tie to ground plane; keep return path to the input capacitor short. |+| 8 | PGND | power_in | Power ground return for the internal NDMOS switch (0V), paralleled with pin 7. |+| EP | EP | passive | Exposed thermal pad on package underside (SO-8EP). Solder to ground copper for heat dissipation; electrically tied to GND. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Diodes Incorporated |+| Package | SOIC-8-EP |+| Category | LED-drv |+| Pins | 9 |++## Ordering variants++- `PAM2863ECRECR`++## CAD (KiCad official)++- Symbol: `PAM2863ECR`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/PAM2863ECR.pdf) (11 pp, sha256 `f591051d0579f29b`, retrieved 2026-08-17, tier: manufacturer)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/pam2863ecr-datasheet.pdf)

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