# PAM2320BECADJR

**Diodes Incorporated** · DC-DC Converters · HSOP-8-EP

PAM2320BECADJR from Diodes Incorporated, in a HSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not connected, as stated in the pin description table. |
| 2 | VIN | power_in | Bias supply and chip main power supply pin, with supply voltage 2.7 V to 5.5 V and VIN absolute maximum of 6 V. |
| 3 | SW | output | Drains of the internal main and synchronous power MOSFETs, with SW pin voltage limited to -0.3 V to (VIN +0.3) V. |
| 4 | GND | power_in | Ground reference pin; all voltages are referenced to ground. |
| 5 | FB | input | Feedback voltage input to the internal error amplifier with a 0.6 V threshold, FB pin voltage limited to -0.3 V to (VIN +0.3) V. |
| 6 | NC | unconnected | Not connected, as stated in the pin description table. |
| 7 | EN | input | Enable control input: above 1.5 V enables the chip and below 0.3 V shuts down the device, with EN pin voltage limited to -0.3 V to +6.0 V. |
| 8 | NC | unconnected | Not connected, as stated in the pin description table. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | HSOP-8-EP |
| Category | Power Management ICs |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage | VIN |  |  | 6 | V |  | 3 |
| SW Pin Voltage |  | -0.3 |  |  | V | max printed as (VIN +0.3) | 3 |
| FB Pin Voltage |  | -0.3 |  |  | V | max printed as (VIN +0.3) | 3 |
| EN Pin Voltage |  | -0.3 |  | 6 | V |  | 3 |
| Maximum Junction Temperature |  |  |  | 150 | °C |  | 3 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 3 |
| Soldering Temperature |  |  |  | 300 | °C | 5sec | 3 |
| Supply Voltage |  | 2.7 |  | 5.5 | V |  | 3 |
| Junction Temperature Range |  | -40 |  | 125 | °C |  | 3 |
| Ambient Temperature Range |  | -40 |  | 85 | °C |  | 3 |
| Thermal Resistance (Junction to Ambient) | θJA |  |  | 90 | °C/W | PSOP-8 | 3 |
| Thermal Resistance (Junction to Case) | θJC |  |  | 14 | °C/W | PSOP-8 | 3 |
| Internal Power Dissipation | PD |  |  | 1100 | mW | @TA= +25°C, PSOP-8 | 3 |
| Input Voltage Range | VIN | 2.7 |  | 5.5 | V |  | 4 |
| Output Voltage Range | VO | 0.6 |  |  | V | max printed as VIN | 4 |
| UVLO Threshold, VIN Rising | VUVLO | 2.4 | 2.5 |  | V | VIN Rising | 4 |
| UVLO Hysteresis |  | 240 |  |  | mV |  | 4 |
| UVLO Threshold, VIN Falling | VUVLO | 1.8 |  |  | V | VIN Falling | 4 |
| Regulated Output Voltage Accuracy | VO | -3 |  | 2 | % | IO = 0A to 3A | 4 |
| Regulated Feedback Voltage | VFB | 0.591 | 0.6 | 0.609 | V |  | 4 |
| FB Leakage Current | IFB |  |  | 0.2 | µA | VO = 1V | 4 |
| Output Voltage Line Regulation | LNR |  | 0.2 |  | %/V | VIN = 2.5V to 5V | 4 |
| Output Voltage Load Regulation | LDR |  | 0.5 |  | %/A | IO = 0A to 3A | 4 |
| Quiescent Current | IQ |  | 42 | 90 | µA | No Load | 4 |
| Shutdown Current | ISD |  |  | 1 | µA | VEN = 0V | 4 |
| Current Limit | ILIM |  | 4 |  | A |  | 4 |
| Oscillator Frequency | fOSC | 1.2 | 1.5 | 1.8 | MHz |  | 4 |
| Drain-Source On-State Resistance, High Side | RDS(ON) |  | 0.85 |  | mΩ | High Side | 4 |
| Drain-Source On-State Resistance, Low Side | RDS(ON) |  | 60 |  | mΩ | Low Side | 4 |
| High Efficiency | η |  | 95 |  | % |  | 4 |
| Analog Soft-Start Time | tS |  | 0.5 | 3 | ms | From enable to output regulation | 4 |
| EN Threshold High | VEH | 1.5 |  |  | V |  | 4 |
| EN Threshold Low | VEL |  |  | 0.3 | V |  | 4 |
| EN Leakage Current | IEN | -1 |  | 1 | µA | VIN = VEN = 0V | 4 |
| Over Temperature Protection | OTP |  | 150 |  | °C |  | 4 |
| OTP Hysteresis | OTH |  | 30 |  | °C |  | 4 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin |  Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208  Weight: 0.081 grams (Approximate) | 12 |

## CAD (KiCad official)

- Symbol: `PAM2320BECADJR`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: HSOP-8-EP (KiCad packages3D, STEP)
- 3D model files: `pam2320becadjr-etched.step` / `pam2320becadjr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `pam2320becadjr.step` / `pam2320becadjr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/PAM2320BECADJR.pdf) (13 pp, sha256 `0e3f145ff95fc55b`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/pam2320becadjr-datasheet.pdf)