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Contents

README

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PAC1720-1-AIA-TR

Microchip Tech · Current-Sensing Amplifiers · WDFN-10-EP(3x3)

PAC1720-1-AIA-TR from Microchip Tech, in a WDFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SENSE1+ input VBUS1/VSENSE1+ positive sense input for channel 1 and bus voltage input, analog pin with maximum voltage of 40V.
2 SENSE1- input VSENSE1- negative sense input for channel 1, analog pin with maximum voltage of 40V.
3 SENSE2+ input VBUS2/VSENSE2+ positive sense input for channel 2 and bus voltage input (PAC1720 only), analog pin with maximum voltage of 40V.
4 SENSE2- input VSENSE2- negative sense input for channel 2 (PAC1720 only), analog pin with maximum voltage of 40V.
5 GND power_in System ground.
6 ADDR_SEL input Selects the SMBus/I2C slave address based on a pull-down resistor.
7 ALERT output SMBus ALERT digital output asserted under fault conditions.
8 SMDATA bidirectional Bidirectional SMBus data pin, open drain, requires a pull-up resistor.
9 SMCLK input SMBus clock digital input, open drain, requires a pull-up resistor.
10 VDD power_in Positive power supply input, 3.0V to 5.5V.
11 EP passive Exposed thermal pad, not internally connected, recommended to be connected to ground for noise immunity.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package WDFN-10-EP(3x3)
Category Operational Amplifier/Comparator
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD Range VDD 3 5.5 V 4
Voltage on SENSE+ VSOURCE 0 40 V 4
VDD Pin Supply Current (PAC1720), continuous IDD 0.525 1.3 mA Both measurement channels enabled. Continuous conversions 4
VDD Pin Supply Current (PAC1720), one conversion per second IDD 13 50 µA Both channels enabled. One conversion per second; VSRC_SAMP_TIME = 2.5 ms; CS_SAMP_TIME = 2.5 ms; No SMBus communications 4
VDD Rise Rate VDD_RISE 0.03 V/ms 0 to 3V in 100 ms 4
VDD Standby Current IDD_STBY 5.5 15 µA Standby state 4
SENSE Common-Mode Voltage Range VCM 0 40 V Common-mode voltage on SENSE pins, referenced to ground 4
VSENSE Differential Input Voltage Range VDIFF -80 80 mV Voltage between SENSE+ and SENSE- pins 4
Common-Mode Rejection VSENSE_CMRR 80 100 dB 0V < VSOURCE < 40V 4
VBUS Gain Accuracy VBUS_GAIN_ERR 0.4 % Measured at ADC output, Gain = 1 (printed ±0.4) 4
SENSE pin leakage, sleep ISENSE+, ISENSE- 1 µA VBUS = 24V, VSENSE = 0V; Sleep state 5
SENSE pin leakage, VDD=0 ISENSE+, ISENSE- 1 µA VDD = 0V 5
SENSE+ Pin Bias Current ISENSE+ 100 150 µA -80 mV < VSENSE < 80 mV; Active state 5
SENSE- Pin Bias Current ISENSE- 0.1 1 µA -80 mV < VSENSE < 80 mV; Active state 5
Total Error positive range VSENSE_TOT_ERR 0.5 1 % FSR FSR = 0 to +10 mV 5
Total Error positive range VSENSE_TOT_ERR 0.3 0.6 % FSR FSR = 0 to +20 mV 5
Total Error positive range VSENSE_TOT_ERR 0.2 0.4 % FSR FSR = 0 to +40 mV 5
Total Error negative range VSENSE_TOT_ERR -1 -1.3 -1.6 % FSR FSR = -10 mV to 0 5
Total Error negative range VSENSE_TOT_ERR -1.6 -2 -2.4 % FSR FSR = -80 mV to 0 5
VSOURCE Error VSOURCE_ERR 0.15 0.3 % FSV (±) 5
Total Power Ratio Error positive range PRATIO_ERR 1 % FSR FSR = 0 to +10 mV, 0 to +20 mV, 0 to +40 mV, or 0 to +80 mV 6
Total Power Ratio Error negative range PRATIO_ERR 2 % FSR FSR = -10 mV to 0, -20 mV to 0, -40 mV to 0, or -80 mV to 0 6
First Power Ratio Ready tCONV_P 220 ms Time after power-up before PRATIO updated 6
Pull-up Voltage Range VPULLUP 3 5.5 V Pull-up voltage for SMBus and ALERT pins 6
Time to First Communications tCOMM 25 ms 6
Input High Voltage VIH 2 V SMCLK, SMDATA 6
Input Low Voltage VIL 0.8 V 6
Output Low Voltage VOL 0.4 V OD pin pulled to VPULLUP; 3 mA current sink 6
Leakage Current ILEAK 5 µA Powered or unpowered; TA < +85°C 6
SMBus Input Capacitance CIN 4 10 pF 7
SMBus Clock Frequency fSMB 10 400 kHz 7
Spike Suppression tSP 100 ns 7
Bus Free Time Stop to Start tBUF 1.3 µs 7
Start Setup Time tSU:STA 0.6 µs 7
Start Hold Time tHD:STA 0.6 µs 7
Stop Setup Time tSU:STO 0.6 µs 7
Data Hold Time tHD:DAT 0 µs When transmitting to the master 7
Data Hold Time tHD:DAT 0.3 µs When receiving from the master 7
Data Setup Time tSU:DAT 0.6 µs 7
Clock Low Period tLOW 1.3 µs 7
Clock High Period tHIGH 0.6 µs 7
Clock/Data Fall Time tFALL 300 ns Min = 20 + 0.1 CLOAD ns 7
Clock/Data Rise Time tRISE 300 ns Min = 20 + 0.1 CLOAD ns 7
Capacitive Load CLOAD 400 pF Total per bus line 7
VDD pin VDD -0.3 6 V 3
Voltage on SENSE- and SENSE+ pins -0.3 42 V 3
Voltage on any other pin to GND -0.3 V -GND-0.3 to VDD+0.3V (max VDD+0.3) 3
Voltage between Sense pins 40 V /(SENSE+, SENSE-)/ 3
Input current to any pin except VDD 10 mA 3
Package Power Dissipation 0.5 W up to TA = +85°C 3
Operating Ambient Temperature Range TA 0 85 °C 3
Storage Temperature Range -55 150 °C 3
ESD HBM SMCLK, SMDATA, ALERT 8000 V HBM 3
ESD HBM all other pins 2000 V HBM 3
Junction to Ambient θJ-A 78 °C/W 3
Offset Error Voltage FSR ±80 mV VOS 40 µV FSR = ±80 mV (printed ±40) 5

CAD (KiCad official)

  • Symbol: PAC1720-1-AIA-TR
  • Footprint: Package_DFN_QFN:WDFN-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm
  • 3D model: WDFN-10-EP(3x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: pac1720-1-aia-tr-etched.step / pac1720-1-aia-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pac1720-1-aia-tr.step / pac1720-1-aia-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (48 pp, sha256 d4936cbfd55b88c2, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF