component

P6SMBJ6.8CA

Public Made by Adom

by adom

BORN TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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P6SMBJ6.8CA

BORN · TVS · DO-214AA(SMB)

P6SMBJ6.8CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer BORN
Package DO-214AA(SMB)
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (bidirectional, 6.8 V type) VBR 6.45 7.14 V @ IT = 10 mA 2
Reverse Stand-off Voltage (bidirectional, 6.8 V type) VR 5.8 V Reverse stand-off voltage column 2
Maximum Reverse Leakage Current IR 1000 μA @ VR = 5.8 V 2
Maximum Clamping Voltage VC 10.5 V @ IPP = 58.1 A 2
Maximum Peak Pulse Current IPP 58.1 A 2
Peak Pulse Power Dissipation PPPM 600 W (Note1)(Note2): Note1 non-repetitive 10/1000us waveform; Note2 mounted on 5×5mm copper pad each terminal 2
Steady State Power Dissipation PD 5 W (Note3): infinite heatsink at TA=50°C 2
Peak Forward Surge Current IFSM 100 A (Note4): 8.3ms single half sine wave or equivalent square wave, duty cycle 4 per minute maximum 2
Operating Temperature Range TJ -55 150 ℃ 2
Storage Temperature Range TSTG -55 150 ℃ 2
Typical Thermal Resistance Junction to Lead RθJL 20 ℃/W 2
Typical Thermal Resistance Junction to Ambient RθJA 100 ℃/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ■ Lead Finish: Matte Tin ■ Computer ■ Case Material: Epoxy Molding Compound. ■ Industrial electronic 1

CAD (KiCad official)

  • Symbol: P6SMBJ6.8CA
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: p6smbj6-8ca-etched.step / p6smbj6-8ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); p6smbj6-8ca.step / p6smbj6-8ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (7 pp, sha256 51ff6f5794b511c5, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF