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P6SMB30CA HM4

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Taiwan Semiconductor ESD And Surge Protection (TVS/ESD), DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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P6SMB30CA HM4

Taiwan Semiconductor · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)

P6SMB30CA HM4 from Taiwan Semiconductor, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package DO-214AA(SMB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage VBR 28.5 31.5 V IT = 1.0 mA, TA = 25°C; VBR measured after IT applied for 300μs 2
Stand-off voltage VWM 25.6 V TA = 25°C 2
Maximum reverse leakage ID 1 µA @VWM, TA = 25°C 2
Maximum peak pulse current IPPM 15 A Surge current waveform per Fig.3, TA = 25°C 2
Maximum clamping voltage VC 41.4 V @IPPM, TA = 25°C 2
Maximum temperature coefficient of VBR 0.097 %/°C TA = 25°C 2
Test current IT 1 mA VBR test 2
Non-repetitive peak impulse power dissipation PPPSM 600 W 10/1000μs waveform, TA = 25°C 1
Steady state power dissipation Ptot 3 W TA = 25°C 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction-to-case thermal resistance RӨJC 10 °C/W 2
Junction-to-ambient thermal resistance RӨJA 55 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: P6SMB30CA HM4
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: p6smb30ca-hm4-etched.step / p6smb30ca-hm4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); p6smb30ca-hm4.step / p6smb30ca-hm4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (7 pp, sha256 71741e46506355f0, retrieved 2026-10-26, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF