component
P25Q80H-SUH-IT
Public Made by Adomby adom
PUYA NOR FLASH, SOP-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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P25Q80H-SUH-IT
PUYA · NOR FLASH · SOP-8-208mil
P25Q80H-SUH-IT from PUYA, in a SOP-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip select input for the device; the datasheet gives no further electrical limit for this pin. |
| 2 | SO | bidirectional | Serial data output for 1 x I/O (SIO1), and serial data input and output for 4 x I/O read mode. |
| 3 | WP# | bidirectional | Write protection, active low, and serial data input and output (SIO2) for 4 x I/O read mode. |
| 4 | GND | power_in | Ground of the device. |
| 5 | SI | bidirectional | Serial data input for 1 x I/O (SIO0), and serial data input and output for 4 x I/O read mode. |
| 6 | SCLK | input | Serial interface clock input. |
| 7 | HOLD# | bidirectional | Pauses the device without deselecting it, and serial data input and output (SIO3) for 4 x I/O read mode. |
| 8 | VCC | power_in | Power supply of the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | PUYA |
| Package | SOP-8-208mil |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature | -65 | 150 | °C | 8 | |||
| Operation Temperature | -40 | 125 | °C | 8 | |||
| Maximum Operation Voltage | 4 | V | 8 | ||||
| Voltage on Any Pin with respect to Ground | -0.6 | 4.1 | V | 8 | |||
| DC Output Current | 5 | mA | 8 | ||||
| Supply voltage (single supply) | 2.3 | 3.6 | V | Single supply | 4 | ||
| Operating temperature (industrial grade) | -40 | 85 | °C | Industrial grade (suffix I) | 4 | ||
| Output Capacitance | COUT | 8 | pF | VOUT=GND | 8 | ||
| Input Capacitance | CIN | 6 | pF | VIN=GND | 8 | ||
| Deep power down current | IDPD | 0.6 | 1.5 | uA | CS#=Vcc, all other inputs at 0V or Vcc | 9 | |
| Standby current | ISB | 9 | uA | CS#, HOLD#, WP#=VIH all inputs at CMOS levels | 9 | ||
| Low power read current (03h) | ICC1 | 2 | 3 | mA | f=1MHz; IOUT=0mA | 9 | |
| Low power read current (03h) | ICC1 | 2 | 4 | mA | f=33MHz; IOUT=0mA | 9 | |
| Read current (0Bh) | ICC2 | 2.5 | 4 | mA | f=50MHz; IOUT=0mA | 9 | |
| Read current (0Bh) | ICC2 | 2.5 | 4.5 | mA | f=85MHz; IOUT=0mA | 9 | |
| Program current | ICC3 | 3 | 5 | mA | CS#=Vcc | 9 | |
| Erase current | ICC4 | 3 | 5 | mA | CS#=Vcc | 9 | |
| Input load current | ILI | 1 | uA | All inputs at CMOS level | 9 | ||
| Output leakage | ILO | 1 | uA | All inputs at CMOS level | 9 | ||
| Output low voltage | VOL | 0.2 | V | IOL=100uA | 9 | ||
| Clock Frequency for FAST_READ, RDSFDP, PP, SE, BE32K, BE, CE, DP, RES, WREN, WRDI, RDID, RDSR, WRSR | fSCLK | 104 | MHz | FAST_READ, RDSFDP, PP, SE, BE32K, BE, CE, DP, RES, WREN, WRDI, RDID, RDSR, WRSR | 10 | ||
| Clock Frequency for READ instructions | fRSCLK | 55 | MHz | READ instructions | 10 | ||
| Clock Frequency for 2READ, DREAD instructions | fTSCLK | 104 | MHz | 2READ, DREAD instructions | 10 | ||
| Clock Frequency for 4READ, QREAD instructions | fQ | 104 | MHz | 4READ, QREAD instructions | 10 | ||
| Clock Frequency for QPP (Quad page program) | fQPP | 104 | MHz | QPP (Quad page program) | 10 | ||
| Clock High Time | tCH | 4.5 | ns | 10 | |||
| CS# Active Setup Time (relative to SCLK) | tSLCH | 5 | ns | 10 | |||
| CS# Not Active Hold Time (relative to SCLK) | tCHSL | 5 | ns | 10 | |||
| Data In Setup Time | tDVCH | 2 | ns | 10 | |||
| Data In Hold Time | tCHDX | 3 | ns | 10 | |||
| CS# Active Hold Time (relative to SCLK) | tCHSH | 5 | ns | 10 | |||
| CS# Not Active Setup Time (relative to SCLK) | tSHCH | 5 | ns | 10 | |||
| CS# Deselect Time From Read to next Read | tSHSL | 15 | ns | From Read to next Read | 10 | ||
| CS# Deselect Time From Write, Erase, Program to Read Status Register | tSHSL | 30 | ns | From Write, Erase, Program to Read Status Register | 10 | ||
| Output Disable Time | tSHQZ | 6 | ns | 10 | |||
| Clock Low to Output Valid | tCLQV | 7 | ns | Loading 30pF | 10 | ||
| Clock Low to Output Valid | tCLQV | 6 | ns | Loading 15pF | 10 | ||
| Output Hold Time | tCLQX | 0 | ns | 10 | |||
| HOLD# Active Setup Time (relative to SCLK) | tHLCH | 5 | ns | 10 | |||
| HOLD# Active Hold Time (relative to SCLK) | tCHHH | 5 | ns | 10 | |||
| HOLD# Not Active Setup Time (relative to SCLK) | tHHCH | 5 | ns | 10 | |||
| HOLD# Not Active Hold Time (relative to SCLK) | tCHHL | 5 | ns | 10 | |||
| HOLD# to Output Low-Z | tHHQX | 6 | ns | 10 | |||
| HOLD# to Output High-Z | tHLQZ | 6 | ns | 10 | |||
| Write Protect Setup Time | tWHSL | 20 | ns | 10 | |||
| Write Protect Hold Time | tSHWL | 100 | ns | 10 | |||
| CS# High to Deep Power-down Mode | tDP | 3 | us | 10 | |||
| CS# High To Standby Mode Without Electronic Signature Read | tRES1 | 8 | us | 10 | |||
| CS# High To Standby Mode With Electronic Signature Read | tRES2 | 8 | us | 10 | |||
| Write Status Register Cycle Time | tW | 8 | 12 | ms | 10 | ||
| Erase Suspend Latency | TESL | 30 | us | 11 | |||
| Program Suspend Latency | TPSL | 30 | us | 11 | |||
| Latency between Program Resume and next Suspend | TPRS | 0.3 | us | 11 | |||
| Latency between Erase Resume and next Suspend | TERS | 0.3 | us | 11 | |||
| Page program time (up to 256 bytes) | tPP | 2 | 3 | ms | up to 256 bytes | 11 | |
| Page erase time | tPE | 8 | 12 | ms | 11 | ||
| Sector erase time | tSE | 8 | 12 | ms | 11 | ||
| Block erase time for 32K bytes | tBE1 | 8 | 12 | ms | 11 | ||
| Block erase time for 64K bytes | tBE2 | 8 | 12 | ms | 11 | ||
| Chip erase time | tCE | 8 | 12 | ms | 11 |
CAD (KiCad official)
- Symbol:
P25Q80H-SUH-IT - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8-208mil (KiCad packages3D, STEP)
- 3D model files:
p25q80h-suh-it-etched.step/p25q80h-suh-it-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);p25q80h-suh-it.step/p25q80h-suh-it.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: PUYA datasheet (71 pp, sha256
3287f414093ae53e, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).