component
OPA891DR
Public Made by Adomby adom
Texas Instruments Operational Amplifier, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownOPA891DR
Texas Instruments · Operational Amplifier · SOIC-8
OPA891DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NULL | input | Voltage offset adjust (offset nulling) pin. |
| 2 | IN- | input | Inverting input of the amplifier. |
| 3 | IN+ | input | Noninverting input of the amplifier. |
| 4 | VCC- | power_in | Negative power supply; dual-supply operation is ±4.5V to ±18V (single-supply 9V to 36V total). |
| 5 | NC | unconnected | No connection. |
| 6 | OUT | output | Output of the amplifier, with typical output current drive of 200mA (absolute maximum 240mA). |
| 7 | VCC+ | power_in | Positive power supply; total supply VCC+ - VCC- is limited to 37V absolute maximum. |
| 8 | NULL | input | Voltage offset adjust (offset nulling) pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 37 | V | VCC+, VCC- | 4 | ||
| Output current | IO | 240 | mA | 4 | |||
| Differential input voltage | VIO | -1.5 | 1.5 | V | ±1.5 | 4 | |
| Continuous input current | IIN | 10 | mA | 4 | |||
| Operating free-air temperature | TA | -40 | 85 | °C | 4 | ||
| Junction temperature | TJ | 150 | °C | Any condition | 4 | ||
| Junction temperature, continuous operation, long-term reliability | TJ | 125 | °C | Maximum junction temperature, continuous operation, long-term reliability | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -4000 | 4000 | V | Human body model, all pins, ±4000 | 4 | |
| ESD CDM | V(ESD) | -1500 | 1500 | V | Charged device model, all pins, ±1500 | 4 | |
| Supply voltage, dual-supply | VCC | 4.5 | 15 | 18 | V | Dual-supply, printed as ±4.5, ±15, ±18 | 4 |
| Supply voltage, single-supply | VCC | 9 | 30 | 36 | V | Single-supply | 4 |
| Operating free-air temperature | TA | -40 | 25 | 85 | °C | 4 | |
| Junction-to-ambient thermal resistance | RθJA | 124.5 | °C/W | OPA891, D (SOIC) 8 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 65 | °C/W | OPA891, D (SOIC) 8 pins | 5 | ||
| Junction-to-board thermal resistance | RθJB | 72.2 | °C/W | OPA891, D (SOIC) 8 pins | 5 | ||
| Junction-to-top characterization parameter | ΨJT | 13.6 | °C/W | OPA891, D (SOIC) 8 pins | 5 | ||
| Junction-to-board characterization parameter | ΨJB | 71.3 | °C/W | OPA891, D (SOIC) 8 pins | 5 | ||
| Input offset voltage | VOS | 0.2 | 1 | mV | VCC = ±5V or ±15V, TA = 25°C | 6 | |
| Input bias current | IIB | 9 | 20 | μA | VCC = ±5V or ±15V, TA = 25°C | 6 | |
| Input bias current, full range | IIB | 33 | μA | VCC = ±5V or ±15V, TA = full range | 6 | ||
| Input offset current | IOS | 30 | 250 | nA | VCC = ±5V or ±15V, TA = 25°C | 6 | |
| Input offset current, full range | IOS | 400 | nA | VCC = ±5V or ±15V, TA = full range | 6 | ||
| Common-mode input voltage range | VICR | 13.8 | 14.3 | V | VCC = ±15V, printed ±13.8 / ±14.3 | 7 | |
| Common-mode input voltage range | VICR | 3.8 | 4.3 | V | VCC = ±5V, printed ±3.8 / ±4.3 | 7 | |
| Common-mode rejection ratio | CMRR | 85 | 104 | dB | VCC = ±15V, VICR = ±12V, TA = 25°C | 7 | |
| Common-mode rejection ratio, full range | CMRR | 80 | dB | VCC = ±15V, VICR = ±12V, TA = full range | 7 | ||
| Common-mode rejection ratio | CMRR | 90 | 106 | dB | VCC = ±5V, VICR = ±2.5V, TA = 25°C | 7 | |
| Common-mode rejection ratio, full range | CMRR | 85 | dB | VCC = ±5V, VICR = ±2.5V, TA = full range | 7 | ||
| Output voltage swing | VO | 12 | 12.9 | V | VCC = ±15V, RL = 250Ω, printed ±12 / ±12.9 | 7 | |
| Output voltage swing | VO | 3 | 3.5 | V | VCC = ±5V, printed ±3 / ±3.5 | 7 | |
| Output current | IO | 60 | 200 | mA | RL = 10Ω, VCC = ±15V | 7 | |
| Output current | IO | 50 | 160 | mA | RL = 10Ω, VCC = ±5V | 7 | |
| Supply current (each amplifier) | ICC | 7.5 | 10 | mA | VCC = ±15V, TA = 25°C | 7 | |
| Supply current (each amplifier), full range | ICC | 11 | mA | VCC = ±15V, TA = full range | 7 | ||
| Supply current (each amplifier) | ICC | 6.5 | 9 | mA | VCC = ±5V, TA = 25°C | 7 | |
| Supply current (each amplifier), full range | ICC | 10 | mA | VCC = ±5V, TA = full range | 7 | ||
| Power-supply rejection ratio | PSRR | 90 | 105 | dB | VCC = ±5V or ±15V, TA = 25°C | 7 | |
| Power-supply rejection ratio, full range | PSRR | 85 | dB | VCC = ±5V or ±15V, TA = full range | 7 | ||
| Open-loop gain | 93 | 100 | dB | VCC = ±15V, VO = ±10V, TA = 25°C | 8 | ||
| Open-loop gain, full range | 92 | dB | VCC = ±15V, VO = ±10V, TA = full range | 8 | |||
| Open-loop gain | 92 | 98 | dB | VCC = ±5V, VO = ±2.5V, TA = 25°C | 8 | ||
| Open-loop gain, full range | 91 | dB | VCC = ±5V, VO = ±2.5V, TA = full range | 8 | |||
| Output voltage swing, RL = 1kΩ | VO | 13 | 13.6 | V | VCC = ±15V, printed ±13 / ±13.6 | 9 | |
| Output voltage swing, RL = 1kΩ | VO | 3.4 | 3.8 | V | VCC = ±5V, printed ±3.4 / ±3.8 | 9 | |
| Small-signal bandwidth (-3dB) | BW | 140 | MHz | Gain = -1V/V or 2V/V, VCC = ±15V | 6 | ||
| Slew rate | SR | 105 | V/μs | Gain = -1V/V, VCC = ±15V, 20V step | 6 | ||
| Input voltage noise | Vn | 0.95 | nV/√Hz | VCC = ±5V or ±15V, f > 10kHz | 6 | ||
| Offset voltage drift | 1 | μV/°C | VCC = ±5V or ±15V, TA = full range | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | to a large copper plane. The thermal pad can be connected to any pin on the device, or any other | 3 |
CAD (KiCad official)
- Symbol:
OPA891DR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
opa891dr-etched.step/opa891dr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa891dr.step/opa891dr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (41 pp, sha256
52e8b4cc1fbec7f0, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).