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Contents

README

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OPA859IDSGR

Texas Instruments · Operational Amplifier · WSON-8-EP(2x2)

OPA859IDSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB input Feedback input; provides direct connection to amplifier output for transimpedance amplifier feedback network configuration.
2 NC unconnected No connection; must remain floating to provide isolation between FB and IN- pins and reduce capacitive coupling.
3 IN- input Inverting input with differential input impedance of 1 GΩ and differential input capacitance of 0.2 pF.
4 IN+ input Non-inverting input with common-mode input impedance of 1 GΩ, common-mode capacitance of 0.62 pF, and common-mode range 0 V to (VS+ - 1.4 V).
5 VS- power_in Negative power supply rail referenced to ground for split-supply or ground for single-supply operation; absolute maximum voltage range 0 V to (VS+ - 5.5 V).
6 OUT output Amplifier output with output voltage high 3.95 V to 4.1 V and low 1.1 V to 1.15 V at VS+ = 5 V, RL = 200Ω; output swing limited to approximately 3 V.
7 VS+ power_in Positive power supply rail; recommended operating voltage range 3.3 V to 5.25 V; total supply voltage (VS+ - VS-) must be 3.3 V to 5.25 V.
8 PD input Power-down input; logic low (< 0.65 V referenced to VS-) disables amplifier and reduces quiescent current to 70 µA to 140 µA; logic high (> 1.5 V) enables normal operation.
9 Thermal Pad power_in Exposed thermal pad; must be soldered to printed circuit board and connected to VS- for proper thermal and mechanical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(2x2)
Category Amplifiers/Comparators
Pins 9

CAD (KiCad official)

  • Symbol: OPA859IDSGR
  • Footprint: Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
  • 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: opa859idsgr-etched.step / opa859idsgr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa859idsgr.step / opa859idsgr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 6ddd0c0d8169ba63, retrieved 2026-09-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF