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OPA325IDBVR
Public Made by Adomby adom
TI(德州仪器) Operational Amplifier, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownOPA325IDBVR
TI(德州仪器) · Operational Amplifier · SOT-23-5
OPA325IDBVR from TI(德州仪器), in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Amplifier output, listed as the output (O) pin of the OPA325 single channel. |
| 2 | V- | power_in | Negative (lowest) power supply pin. |
| 3 | +IN | input | Noninverting input of the amplifier. |
| 4 | -IN | input | Inverting input of the amplifier. |
| 5 | V+ | power_in | Positive (highest) power supply pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TI(德州仪器) |
| Package | SOT-23-5 |
| Category | Amplifiers/Comparators |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VS = (V+), (V-) | VS | 6 | V | 5 | |||
| Input current | IIN | -10 | 10 | mA | 5 | ||
| Operating free-air temperature, TA | TA | -40 | 150 | °C | Operating | 5 | |
| Junction temperature, TJ | TJ | 150 | °C | 5 | |||
| Storage temperature, Tstg | Tstg | -65 | 150 | °C | 5 | ||
| Single supply voltage | VS | 2.2 | 5.5 | V | 5 | ||
| Dual supply voltage | VS | 1.1 | 2.75 | V | Dual supply (±) | 5 | |
| Specified temperature, TA | TA | -40 | 125 | °C | 5 | ||
| Input offset voltage | VOS | 40 | 150 | µV | 7 | ||
| Input offset voltage drift | dVOS/dT | 2 | 7.5 | µV/°C | VS = 5.5 V, TA = -40°C to +125°C | 7 | |
| Power-supply rejection ratio | PSRR | 6 | 20 | µV/V | VS = 2.2 V to +5.5 V | 7 | |
| Power-supply rejection ratio | PSRR | 15 | µV/V | VS = 2.2 V to 5.5 V, TA = -40°C to +125°C | 7 | ||
| Common-mode rejection ratio | CMRR | 100 | 114 | dB | VS = 5.5 V, (V-), 0.1 V < VCM < (V+) + 0.1 V | 7 | |
| Common-mode rejection ratio | CMRR | 95 | dB | TA = -40°C to +125°C | 7 | ||
| Input bias current | IB | -10 | 0.2 | 10 | pA | 7 | |
| Input bias current | IB | -500 | 500 | pA | TA = -40°C to +85°C | 7 | |
| Input bias current | IB | -10 | 10 | nA | TA = -40°C to +125°C | 7 | |
| Input offset current | IOS | -10 | 0.2 | 10 | pA | 7 | |
| Input offset current | IOS | -500 | 500 | pA | TA = -40°C to +85°C | 7 | |
| Input offset current | IOS | -10 | 10 | nA | TA = -40°C to +125°C | 7 | |
| Open-loop voltage gain | AOL | 105 | 130 | dB | 0.1 V < VO < (V+), 0.1 V, RL = 10 kΩ | 7 | |
| Open-loop voltage gain | AOL | 95 | 128 | dB | 0.1 V < VO < (V+), 0.1 V, RL = 10 kΩ, TA = -40°C to +125°C | 7 | |
| Open-loop voltage gain | AOL | 100 | 110 | dB | 0.2 V < VO < (V+), 0.2 V, RL = 2 kΩ | 7 | |
| Voltage output swing from both rails | VO | 10 | 20 | mV | RL = 10 kΩ | 8 | |
| Voltage output swing from both rails | VO | 30 | mV | RL = 10 kΩ, TA = -40°C to +125°C | 8 | ||
| Voltage output swing from both rails | VO | 25 | 45 | mV | RL = 2 kΩ | 8 | |
| Voltage output swing from both rails | VO | 55 | mV | RL = 2 kΩ, TA = -40°C to +125°C | 8 | ||
| Quiescent current per amplifier | IQ | 0.65 | 0.75 | mA | IO = 0 mA, VS = 5.5 V | 8 | |
| Quiescent current per amplifier | IQ | 0.8 | mA | IO = 0 mA, VS = 5.5 V, TA = -40°C to +125°C | 8 | ||
| Junction-to-ambient thermal resistance (DBV SOT-23) | RθJA | 205 | °C/W | 6 | |||
| Junction-to-case (top) thermal resistance (DBV SOT-23) | RθJC(top) | 200 | °C/W | 6 | |||
| Junction-to-board thermal resistance (DBV SOT-23) | RθJB | 113 | °C/W | 6 | |||
| Junction-to-top characterization parameter (DBV SOT-23) | ΨJT | 38.2 | °C/W | 6 | |||
| Junction-to-board characterization parameter (DBV SOT-23) | ΨJB | 104.9 | °C/W | 6 |
CAD (KiCad official)
- Symbol:
OPA325IDBVR - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
opa325idbvr-etched.step/opa325idbvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa325idbvr.step/opa325idbvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TI(德州仪器) datasheet (45 pp, sha256
99df93dd75986a80, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).