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Contents

README

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OPA317M5

HGSEMI · Precision Op Amps · SOT-23-5

OPA317M5 from HGSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT output Amplifier output with rail-to-rail swing, typically within 5mV of the supply rail at loads above 100kΩ and rated for 30mA output current.
2 VSS power_in Negative supply (ground in single-supply operation); the input common-mode range extends from VSS-0.1V and the supply is bypassed with a 0.1µF ceramic capacitor in dual-supply operation.
3 IN+ input Non-inverting input, rail-to-rail with a common-mode range of VSS-0.1V to VDD+0.1V and an absolute maximum of VSS-0.5V to VDD+0.5V.
4 IN- input Inverting input, rail-to-rail with a common-mode range of VSS-0.1V to VDD+0.1V and an absolute maximum of VSS-0.5V to VDD+0.5V.
5 VDD power_in Positive supply for 1.8V to 5.5V single-supply operation (absolute maximum 7.5V VDD to VSS), bypassed with a 0.1µF ceramic capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-5
Category Amplifiers/Comparators
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage (VOS) VOS 2 10 µV 4
Single-Supply Operating Voltage 1.8 5.5 V 1
Power Supply Voltage (VDD to Vss) -0.5 7.5 V 3
PDB Input Voltage 7 V Vss-0.5V minimum as printed 3
Operating Temperature Range -45 125 °C 3
Junction Temperature 160 °C 3
Storage Temperature Range -55 150 °C 3
Lead Temperature (soldering) 245 °C soldering, 10 sec 3
Package Thermal Resistance, SOT23-5 θJA θJA 190 °C/W TA=+25℃ 3
ESD Susceptibility HBM 6 KV HBM 3
ESD Susceptibility MM 400 V MM 3

CAD (KiCad official)

  • Symbol: OPA317M5
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: opa317m5-etched.step / opa317m5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa317m5.step / opa317m5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (15 pp, sha256 b33979654bb70200, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF