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Contents

README

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OPA317M

HGSEMI · Precision Op Amps · SOP-8

OPA317M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection on the OPA317 SOP-8 package.
2 INA- input Inverting input of the amplifier; input voltage must stay within Vss-0.5V to VDD+0.5V (absolute maximum).
3 INA+ input Non-inverting input of the amplifier; input voltage must stay within Vss-0.5V to VDD+0.5V (absolute maximum), with common-mode range extending 100mV beyond the rails.
4 VSS power_in Negative supply or ground; for dual-supply operation bypass it to ground with a separate 0.1µF ceramic capacitor.
5 NC unconnected No internal connection on the OPA317 SOP-8 package.
6 OUT output Rail-to-rail amplifier output with typical 30mA output current and 20mA short-circuit limit.
7 VDD power_in Positive supply, 1.8V to 5.5V single supply (7.5V absolute maximum VDD to Vss); place a 0.1µF ceramic capacitor close to this pin.
8 NC unconnected No internal connection on the OPA317 SOP-8 package.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS 2 10 µV 4
Power Supply Voltage (VDD to Vss) -0.5 7.5 V 3
PDB Input Voltage 7 V Vss-0.5V minimum (symbolic, not numeric) 3
Operating Temperature Range -45 125 °C 3
Junction Temperature 160 °C 3
Storage Temperature Range -55 150 °C 3
Lead Temperature (soldering) 245 °C soldering, 10sec 3
ESD Susceptibility HBM 6 KV HBM 3
ESD Susceptibility MM 400 V MM 3
Package Thermal Resistance SOP-8 (junction-to-ambient) θJA 125 °C/W TA=+25℃ 3
Single-Supply Operating Voltage 1.8 5.5 V single supply; dual ±0.9V to ±2.75V also stated 1
Operating Temperature -45 125 °C 1

CAD (KiCad official)

  • Symbol: OPA317M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: opa317m-etched.step / opa317m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa317m.step / opa317m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (15 pp, sha256 c68ecfcce345135e, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF