# OPA314M

**HGSEMI** · Operational Amplifier · SOP-8

OPA314M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. May be left floating or tied to ground. |
| 2 | INA- | input | Inverting analog input of the op-amp. Rail-to-rail input; input common-mode range −0.1V to VDD+0.1V (spec at VS=5.5V: −0.1 to +5.6V). Absolute max Vss−0.5V to VDD+0.5V. Typical input bias 1pA. |
| 3 | INA+ | input | Non-inverting analog input of the op-amp. Rail-to-rail input; same common-mode range and absolute-max limits as the inverting input. Typical input bias 1pA. |
| 4 | VSS | power_in | Negative supply rail / ground reference. Total supply VDD−VSS from 2.1V to 5.5V (7.5V absolute max). Typically tied to 0V in single-supply operation. |
| 5 | NC | unconnected | No internal connection. May be left floating or tied to ground. |
| 6 | OUT | output | Rail-to-rail op-amp output. Typical output current 53mA (min 35mA over full temp), output swing to within 0.1V of the rails with RL=600Ω or 0.015V with RL=10kΩ. Closed-loop output impedance ~10Ω at 100kHz, G=1. |
| 7 | VDD | power_in | Positive supply rail. Operating range 2.1V to 5.5V referenced to VSS; absolute max VDD−VSS = 7.5V. Typical quiescent current 250µA (max 515µA over full temp). |
| 8 | NC | unconnected | No internal connection. May be left floating or tied to ground. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Op-amp/Cmp |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `OPA314M/TR`
- `OPA314M5/TR`

## CAD (KiCad official)

- Symbol: `OPA314M`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `opa314m-etched.step` / `opa314m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `opa314m.step` / `opa314m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](docs/opa314m-datasheet.pdf) (16 pp, sha256 `52e338c5389f6519`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/opa314m-datasheet.pdf)