component
OPA2340M
Public Made by Adomby adom
HGSEMI Operational Amplifier, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownOPA2340M
HGSEMI · Operational Amplifier · SOP-8
OPA2340M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT1 | output | Amplifier 1 output. |
| 2 | -IN1 | input | Inverting input of amplifier 1, with a voltage range from (VS- - 0.1V) to (VS+ + 0.1V). |
| 3 | +IN1 | input | Non-inverting input of amplifier 1, with the same voltage range as -IN. |
| 4 | -VS | power_in | Negative power supply. |
| 5 | +IN2 | input | Non-inverting input of amplifier 2, with the same voltage range as -IN. |
| 6 | -IN2 | input | Inverting input of amplifier 2, with a voltage range from (VS- - 0.1V) to (VS+ + 0.1V). |
| 7 | OUT2 | output | Amplifier 2 output. |
| 8 | +VS | power_in | Positive power supply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input offset voltage | VOS | -0.35 | 0.1 | 0.35 | mV | 5 | |
| Offset voltage drift | VOS TC | 1 | 2.3 | μV/℃ | TA = −40 to +125 ℃ | 5 | |
| Power supply rejection ratio | PSRR | 95 | 110 | dB | VS = 2.0 to 5.5 V, VCM < VS+ − 2V | 5 | |
| Power supply rejection ratio over temperature | PSRR | 82 | dB | TA = −40 to +125 ℃ | 5 | ||
| Input bias current | IB | 150 | pA | TA = +85 ℃ | 5 | ||
| Input bias current | IB | 500 | pA | TA = +125 ℃ | 5 | ||
| Common-mode voltage range (VS− − 0.1 V to VS+ + 0.1 V) | VCM | -0.1 | 0.1 | V | 5 | ||
| Common-mode rejection ratio | CMRR | 80 | 96 | dB | VS = 5.5 V, VCM = −0.1 to 5.6 V | 5 | |
| Common-mode rejection ratio | CMRR | 75 | dB | VCM = 0 to 5.3 V, TA = −40 to +125 ℃ | 5 | ||
| Common-mode rejection ratio | CMRR | 76 | 90 | dB | VS = 2.0 V, VCM = −0.1 to 2.1 V | 5 | |
| Common-mode rejection ratio | CMRR | 70 | dB | VCM = 0 to 1.8 V, TA = −40 to +125 ℃ | 5 | ||
| Open-loop voltage gain | AVOL | 97 | 105 | dB | RL = 10 kΩ, VO = 0.05 to 3.5 V | 5 | |
| Open-loop voltage gain over temperature | AVOL | 87 | dB | TA = −40 to +125 ℃ | 5 | ||
| Open-loop voltage gain | AVOL | 85 | 90 | dB | RL = 600 Ω, VO = 0.15 to 3.5 V | 5 | |
| Open-loop voltage gain over temperature | AVOL | 75 | dB | TA = −40 to +125 ℃ | 5 | ||
| High output voltage swing (VS+ referenced) | VOH | -12 | -8 | mV | RL = 10 kΩ | 6 | |
| High output voltage swing (VS+ referenced) | VOH | -180 | -125 | mV | RL = 600 Ω | 6 | |
| Low output voltage swing (VS− referenced) | VOL | 6 | 9 | mV | RL = 10 kΩ | 6 | |
| Low output voltage swing (VS− referenced) | VOL | 90 | 130 | mV | RL = 600 Ω | 6 | |
| Short-circuit current | ISC | -75 | 75 | mA | 6 | ||
| Operating supply voltage | VS | 1.8 | 5.5 | V | TA = 0 to +70 ℃ | 6 | |
| Operating supply voltage | VS | 2 | 5.5 | V | TA = −40 to +125 ℃ | 6 | |
| Quiescent current (per amplifier) | IQ | 625 | 760 | μA | VS = 2.0 V | 6 | |
| Quiescent current (per amplifier) | IQ | 750 | 930 | μA | VS = 5.0 V | 6 | |
| Operating temperature range | TA | -40 | 125 | ℃ | 6 | ||
| Package thermal resistance, SOP-8 (θJA) | θJA | 125 | ℃/W | SOP-8 package | 6 | ||
| Supply voltage, VS+ to VS− | 10 | V | 4 | ||||
| Signal input terminal voltage (VS− − 0.5 V to VS+ + 0.5 V) | -0.5 | 0.5 | V | 4 | |||
| Signal input terminal current | -10 | 10 | mA | 4 | |||
| Storage temperature range | Tstg | -65 | 150 | ℃ | 4 | ||
| Junction temperature | TJ | 150 | ℃ | 4 | |||
| Lead temperature range (soldering) | 260 | ℃ | 10 sec soldering | 4 | |||
| ESD, human body model (HBM) | -5000 | 5000 | V | MIL-STD-883J / Method 3015.9 | 4 | ||
| ESD, charged device model (CDM) | -2000 | 2000 | V | ESDA/JEDEC JS-002-2014 | 4 | ||
| ESD, machine model (MM) | -250 | 250 | V | JESD22-A115C | 4 |
CAD (KiCad official)
- Symbol:
OPA2340M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
opa2340m-etched.step/opa2340m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa2340m.step/opa2340m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (21 pp, sha256
6481da42ff809a99, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).