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Contents

README

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OPA2335M

HGSEMI · Precision Op Amps · SOP-8

OPA2335M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTA output Amplifier A output, rail-to-rail swing.
2 INA- input Amplifier A inverting input; input range VSS-0.1V to VDD+0.1V, absolute max VSS-0.5V to VDD+0.5V.
3 INA+ input Amplifier A non-inverting input; input range VSS-0.1V to VDD+0.1V, absolute max VSS-0.5V to VDD+0.5V.
4 VSS power_in Negative supply (ground in single-supply operation).
5 INB+ input Amplifier B non-inverting input; input range VSS-0.1V to VDD+0.1V, absolute max VSS-0.5V to VDD+0.5V.
6 INB- input Amplifier B inverting input; input range VSS-0.1V to VDD+0.1V, absolute max VSS-0.5V to VDD+0.5V.
7 OUTB output Amplifier B output, rail-to-rail swing.
8 VDD power_in Positive supply, 2.1V to 5.5V single supply (absolute max 7.5V VDD to VSS); bypass with 0.1µF ceramic capacitor close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS 1 5 µV VS=+5V, VCM=+2.5V, VO=+2.5V, TA=+25°C 3
Input Offset Voltage Drift ΔVOS/ΔT 50 nV/℃ VS=+5V, VCM=+2.5V, VO=+2.5V (table header); features list 0.05µV/°C (Max.) 3
Power Supply Voltage (VDD to Vss) -0.5 7.5 V 2
Operating Temperature Range -40 125 °C 2
Junction Temperature 160 °C 2
Storage Temperature Range -55 150 °C 2
Lead Temperature (soldering) 260 °C soldering, 10 sec 2
ESD Susceptibility HBM 6 KV HBM 2
ESD Susceptibility MM 400 V MM 2
Package Thermal Resistance, SOP-8 junction-to-ambient θJA 125 °C/W TA=+25℃, SOP-8 2
Supply Voltage, single supply 2.1 5.5 V single-supply operation (Features; Application Note) 1

CAD (KiCad official)

  • Symbol: OPA2335M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: opa2335m-etched.step / opa2335m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa2335m.step / opa2335m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 51d9210c2aa8ccf1, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF