component

OPA2333M

Public Made by Adom

by adom

HGSEMI Operational Amplifier, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

componentop-amp-cmpopa2333m
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

3D Model

Open in new tab ↗
Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

Datasheet

Open in new tab ↗
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

OPA2333M

HGSEMI · Operational Amplifier · SOP-8

OPA2333M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT A output Output of op-amp channel A. Rail-to-rail output driver.
2 -IN A input Inverting input of op-amp channel A. Rail-to-rail CMOS input.
3 +IN A input Non-inverting input of op-amp channel A. Rail-to-rail CMOS input.
4 V- power_in Negative supply rail (lowest potential). Tie to GND for single-supply operation. Supply span V+ to V- is 1.8V to 5.5V.
5 +IN B input Non-inverting input of op-amp channel B. Rail-to-rail CMOS input.
6 -IN B input Inverting input of op-amp channel B. Rail-to-rail CMOS input.
7 OUT B output Output of op-amp channel B. Rail-to-rail output driver.
8 V+ power_in Positive supply rail (highest potential). Operating range 1.8V to 5.5V referenced to V-. Bypass with 100nF to V-.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • OPA2333M/TR
  • OPA2333BM/TR
  • OPA2333MM/TR
  • OPA2333BMM/TR

CAD (KiCad official)

  • Symbol: OPA2333M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: opa2333m-etched.step / opa2333m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa2333m.step / opa2333m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (20 pp, sha256 bc8cb63c9597692f, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF