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OPA2323IDR

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TI(德州仪器) , SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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OPA2323IDR

TI(德州仪器) · IC · SOIC-8

OPA2323IDR from TI(德州仪器), in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT1 output Output of channel 1.
2 IN1- input Inverting input of channel 1.
3 IN1+ input Noninverting input of channel 1.
4 V- power_in Negative (low) supply or ground for single-supply operation; connect to the lowest supply rail.
5 IN2+ input Noninverting input of channel 2.
6 IN2- input Inverting input of channel 2.
7 OUT2 output Output of channel 2.
8 V+ power_in Positive (high) supply; operating supply range is 1.7V to 5.5V across (V+) - (V-).

Key specifications

Parameter Value
Manufacturer TI(德州仪器)
Package SOIC-8
Category
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, (V+), (V-) VS 1.7 5.5 V 9
Specified temperature TA -40 125 °C 9
Supply voltage, VS = (V+), (V-) VS 0 7 V 9
Common-mode voltage -0.5 6 V Signal input pins 9
Differential voltage -6 6 V Signal input pins 9
Current -10 10 mA Signal input pins 9
Operating ambient temperature TA -55 150 °C 9
Junction temperature TJ 150 °C 9
Storage temperature Tstg -65 150 °C 9
Input offset voltage VOS -1.25 0.15 1.25 mV VS = 1.8V to 5.5V 11
Input offset voltage over temperature VOS -1.35 1.35 mV VS = 1.8V to 5.5V, TA = -40°C to 125°C 11
Input offset voltage drift dVOS/dT -1.8 0.4 1.8 µV/℃ VS = 1.8V to 5.5V, TA = -40°C to 125°C 11
Input offset voltage versus power supply PSRR -20 5 20 µV/V VS = 1.8V to 5.5V 11
Input bias current IB -20 0.5 20 pA VS = 1.8V and VS = 5V 11
Input bias current over temperature IB -1600 1600 pA VS = 1.8V and VS = 5V, TA = -40°C to 125°C 11
Input offset current over temperature IOS -120 120 pA VS = 1.8V and VS = 5V, TA = -40°C to 125°C 11
Common-mode rejection ratio CMRR 100 114 dB VS = 5.5V, (V-), 0.2V ≤ VCM ≤ (V+) + 0.10V 11
Common-mode rejection ratio CMRR 90 104 dB VS = 5.5V, (V-), 0.2V ≤ VCM ≤ (V+) + 0.15V 11
Common-mode rejection ratio over temperature CMRR 84 dB VS = 5.5V, (V-), 0.2V ≤ VCM ≤ (V+) + 0.15V, TA = -40°C to 125°C 11
Common-mode rejection ratio CMRR 85 103 dB VS = 1.8V, (V-), 0.1V ≤ VCM ≤ (V+) + 0.05V 11
Common-mode rejection ratio over temperature CMRR 80 dB VS = 1.8V, (V-), 0.1V ≤ VCM ≤ (V+) + 0.05V, TA = -40°C to 125°C 11
Open-loop voltage gain AOL 103 120 dB VS = 1.8V, (V-) + 0.1V < VO < (V+), 0.1V, RL = 10kΩ to VS / 2 11
Open-loop voltage gain AOL 100 115 dB VS = 1.8V, (V-) + 0.2V < VO < (V+), 0.2V, RL = 2kΩ to VS / 2 11
Open-loop voltage gain AOL 112 125 dB VS = 5.5V, (V-) + 0.1V < VO < (V+), 0.1V, RL = 10kΩ to VS / 2 11
Open-loop voltage gain AOL 108 120 dB VS = 5.5V, (V-) + 0.2V < VO < (V+), 0.2V, RL = 2kΩ to VS / 2 11
Voltage output swing from rail Vo 15 25 mV VS = 1.8V, RL = 10kΩ to VS / 2 12
Voltage output swing from rail Vo 25 35 mV VS = 5.5V, RL = 10kΩ to VS / 2 12
Voltage output swing from rail Vo 45 55 mV VS = 5.5V, RL = 2kΩ to VS / 2 12
Short-circuit current ISC -20 40 mA VS = 1.8V 12
Short-circuit current ISC -80 110 mA VS = 5.5V 12
Quiescent current per amplifier IQ 1.6 1.9 mA VS = 5.5V, IO = 0A 12
Quiescent current per amplifier over temperature IQ 2 mA TA = -40°C to 125°C 12
Junction-to-ambient thermal resistance (SOIC, D) RθJA 139 °C/W 10
Junction-to-case (top) thermal resistance (SOIC, D) RθJC(top) 81.2 °C/W 10
Junction-to-board thermal resistance (SOIC, D) RθJB 82.4 °C/W 10
Junction-to-top characterization parameter (SOIC, D) ψJT 31.3 °C/W 10
Junction-to-board characterization parameter (SOIC, D) ψJB 81.6 °C/W 10

CAD (KiCad official)

  • Symbol: OPA2323IDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: opa2323idr-etched.step / opa2323idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa2323idr.step / opa2323idr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TI(德州仪器) datasheet (67 pp, sha256 d8192973eb3a9d91, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF