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OPA2277UM

HGSEMI · Operational Amplifier · SOP-8

OPA2277UM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Out A output Output channel A of the OPA2277 dual amplifier, which swings to within 2 V of the supply rails at RL = 10 kΩ.
2 -In A input Inverting input of channel A, with a 1-kΩ series input resistor and diode clamps for protection.
3 +In A input Noninverting input of channel A, with a common-mode range of (V-)+2 V to (V+)-2 V.
4 V- power_in Negative (lowest) power supply; the device operates from ±2 V to ±16 V total supply.
5 +In B input Noninverting input of channel B, with a common-mode range of (V-)+2 V to (V+)-2 V.
6 -In B input Inverting input of channel B, with a 1-kΩ series input resistor and diode clamps for protection.
7 Out B output Output channel B of the OPA2277 dual amplifier, which swings to within 2 V of the supply rails at RL = 10 kΩ.
8 V+ power_in Positive (highest) power supply; the maximum supply voltage is 32 V (±16 V).

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage V0S 10 100 µV TA = 25°C 8
Input Offset Voltage over temperature V0S 20 µV TA = -20°C to 85°C 8
Input Offset Voltage Drift dV0S/dT 0.1 0.25 µV/°C TA = -20°C to 85°C, OPA2277U (high-grade, dual) 8
Power supply rejection ratio PSRR 0.3 0.5 µV/V VS = ±2 V to ±16 V 8
Power supply rejection ratio over temperature PSRR 0.5 1 µV/V TA = -20°C to 85°C 8
Input Bias Current IB 0.5 1 nA TA = 25°C 9
Input Bias Current over temperature IB 2 4 nA TA = -20°C to 85°C 9
Input Offset Current IOS 0.5 1 nA TA = 25°C 9
Input Offset Current over temperature IOS 2 4 nA TA = -20°C to 85°C 9
Input Voltage Noise 0.22 µVPP f = 0.1 to 10 Hz 9
Input Voltage Noise Density 12 nV/√Hz f = 10 Hz 9
Input Voltage Noise Density 8 nV/√Hz f = 100 Hz 9
Input Current Noise Density 0.2 pA/√Hz f = 1 kHz 9
Common-Mode Rejection CMRR 130 140 dB VCM = (V-)+2 V to (V+)-2 V 9
Common-Mode Rejection over temperature CMRR 128 dB TA = -20°C to 85°C 9
Open-Loop Voltage Gain AOL 126 134 dB VO = (V-)+1.5 V to (V+)-1.5 V, RL = 2 kΩ 9
Gain-Bandwidth Product GBW 1 MHz 9
Slew Rate SR 0.8 V/µs 9
Settling Time 0.1% 14 µs VS = ±15 V, G = 1, 10-V step 9
Settling Time 0.01% 16 µs VS = ±15 V, G = 1, 10-V step 9
Overload Recovery Time 3 µs VIN × G = VS 9
Total Harmonic Distortion+Noise THD+N 0.002 % 1 kHz, G = 1, VO = 3.5 Vrms 9
Short-Circuit Current ISC 35 mA 10
Open-loop output impedance ZO 40 Ω f = 1 MHz 10
Specified Voltage Range VS 5 15 V Single limit applies over ±5 V to ±15 V 10
Operating Voltage Range 2 16 V Supply ±2 V to ±16 V 10
Quiescent Current (per amplifier) IQ 1 3.5 mA IO = 0 10
Specified Temperature Range -20 85 °C Specified range 10
Operating Temperature Range -20 125 °C Operating range 10
Supply voltage Vs 36 V Vs = (V+), (V-) 6
Operating temperature -20 85 °C over operating free-air temperature range 6
Junction temperature 150 °C 6
Lead temperature 260 °C 10 s 6
Storage temperature Tstg -20 125 °C 6
Supply voltage Vs 4 30 32 V Vs = (V+), (V-); MIN 4 (±2), NOM 30 (±15), MAX 32 (±16) 6
Specified temperature -20 85 °C over operating free-air temperature range 6
Junction-to-ambient thermal resistance RθJA 107.4 °C/W OPA2277 M (SOP) 7
Junction-to-case (top) thermal resistance RθJC(top) 45.8 °C/W OPA2277 M (SOP) 7
Junction-to-board thermal resistance RθJB 47.9 °C/W OPA2277 M (SOP) 7
Junction-to-top characterization parameter ψJT 5.7 °C/W OPA2277 M (SOP) 7
Junction-to-board characterization parameter ψJB 47.3 °C/W OPA2277 M (SOP) 7

CAD (KiCad official)

  • Symbol: OPA2277UM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: opa2277um-etched.step / opa2277um-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa2277um.step / opa2277um.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (23 pp, sha256 7cff3ab2ae68c1e8, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF