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OP27GSZ

Public Made by Adom

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Analog Devices Operational Amplifier, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

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OP27GSZ

Analog Devices · Operational Amplifier · SOIC-8

OP27GSZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOS TRIM passive Offset voltage trim pin (balance) used for offset voltage adjustment.
2 -IN input Inverting input of the amplifier.
3 +IN input Noninverting input of the amplifier.
4 V- power_in Negative supply pin.
5 NC unconnected No connect.
6 OUT output Amplifier output, guaranteed swing of ±10 V into 600 Ω.
7 V+ power_in Positive supply pin.
8 VOS TRIM passive Offset voltage trim pin (balance) used for offset voltage adjustment.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input offset voltage VOS 30 100 µV VS = ±15 V, TA = 25°C 4
Long-term VOS stability VOS/Time 0.4 2 µV/MO 4
Input offset current IOS 12 75 nA VS = ±15 V, TA = 25°C 4
Input bias current IB 15 80 nA VS = ±15 V, TA = 25°C 4
Input noise voltage, p-p en p-p 0.09 0.25 µV p-p 0.1 Hz to 10 Hz 4
Input noise voltage density en 3.8 8 nV/√Hz fO = 10 Hz 4
Input noise voltage density en 3.3 5.6 nV/√Hz fO = 30 Hz 4
Input noise voltage density en 3.2 4.5 nV/√Hz fO = 1000 Hz 4
Input noise current density in 0.4 0.6 pA/√Hz fO = 1000 Hz 4
Input resistance, differential mode RIN 0.7 4 MΩ 4
Input voltage range IVR 11 12.3 V 4
Common-mode rejection ratio CMRR 100 120 dB VCM = ±11 V 4
Power supply rejection ratio PSRR 2 20 µV/V VS = ±4 V to ±18 V 4
Large signal voltage gain AVO 700 1500 V/mV RL ≥ 2 kΩ, VO = ±10 V 4
Large signal voltage gain AVO 600 1500 V/mV RL ≥ 600 Ω, VO = ±10 V 4
Output voltage swing VO 11.5 13.5 V RL ≥ 2 kΩ 4
Output voltage swing VO 10 11.5 V RL ≥ 600 Ω 4
Slew rate SR 1.7 2.8 V/µs RL ≥ 2 kΩ 4
Gain bandwidth product GBW 5 8 MHz 4
Offset adjustment range 4 mV RP = 10 kΩ 4
Power consumption Pd 100 170 mW VO 4
Input offset voltage (-40°C to 85°C) VOS 55 220 µV −40°C ≤ TA ≤ 85°C 5
Average input offset drift TCVOS 0.4 1.8 µV/°C −40°C ≤ TA ≤ 85°C 5
Average input offset drift (n-type) TCVOSn 0.4 1.8 µV/°C −40°C ≤ TA ≤ 85°C 5
Input offset current (-40°C to 85°C) IOS 20 135 nA −40°C ≤ TA ≤ 85°C 5
Input bias current (-40°C to 85°C) IB 25 150 nA −40°C ≤ TA ≤ 85°C 5
Input voltage range (-40°C to 85°C) IVR 10.5 11.8 V −40°C ≤ TA ≤ 85°C 5
Common-mode rejection ratio (-40°C to 85°C) CMRR 96 118 dB VCM = ±10 V, −40°C ≤ TA ≤ 85°C 5
Power supply rejection ratio (-40°C to 85°C) PSRR 2 32 µV/V VS = ±4.5 V to ±18 V, −40°C ≤ TA ≤ 85°C 5
Large signal voltage gain (-40°C to 85°C) AVO 450 1000 V/mV RL ≥ 2 kΩ, VO = ±10 V, −40°C ≤ TA ≤ 85°C 5
Output voltage swing (-40°C to 85°C) VO 11 13.3 V RL ≥ 2 kΩ, −40°C ≤ TA ≤ 85°C 5
Supply voltage 22 V 7
Input voltage 22 V Supplies below ±22 V: equal to supply voltage 7
Differential input voltage 0.7 V 7
Differential input current 25 mA 7
Storage temperature range -65 150 °C 7
Operating temperature range -40 85 °C OP27G (P, S, J, Z) 7
Lead temperature range (soldering) 300 °C Soldering, 60 sec 7
Junction temperature -65 150 °C 7
Input noise current density in 1.7 pA/√Hz fO = 10 Hz 4
Input noise current density in 1 pA/√Hz fO = 30 Hz 4
Common-mode input resistance RINCM 2 GΩ 4
Open-loop output resistance RO 70 Ω VO = 0, IO = 0 4
Junction-to-ambient thermal resistance, SOIC_N (S) θJA 158 °C/W 8-Lead SOIC_N (S), device soldered to printed circuit board 7
Junction-to-case thermal resistance, SOIC_N (S) θJC 43 °C/W 8-Lead SOIC_N (S) 7

CAD (KiCad official)

  • Symbol: OP27GSZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: op27gsz-etched.step / op27gsz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); op27gsz.step / op27gsz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (21 pp, sha256 671c5514b484a402, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF