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OC5800L

OCX · DC-DC Converters · SOP-8

OC5800L from OCX, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Drain of the internal 100V/5A power MOSFET; connect to the input power supply (8V-90V, absolute max 100V). The exposed thermal pad is internally tied to this pin.
2 VDD power_in Chip bias supply input. Internally clamped at ~33V (I_VDD < 10mA); UVLO rising threshold 4.5V, falling 3V. Typically fed from VIN through a series resistor and a 12V Zener clamp.
3 FB1 input Positive-side output-voltage feedback sense pin. With FB2 forms the CV feedback loop; regulated (FB1-FB2) differential voltage is typically 397 mV. Absolute max -0.3 to 6 V.
4 FB2 input Negative-side output-voltage feedback sense pin. Paired with FB1 in the resistor-divider network that sets VOUT = ((R3+R1)/R1)*VFB. Absolute max -0.3 to 6 V.
5 VCC power_out Internal 5V LDO output (typ. 5.5 V); connect a decoupling capacitor (typ. 4.7 µF) to GND. Absolute max -0.3 to 6 V; not intended to drive external loads.
6 GND power_in Chip ground reference for all internal circuitry and feedback resistor networks.
7 VSEN input Inductor current sense input. A sense resistor between VSEN and GND sets the maximum output current: IOUT_MAX = VCS/R5, where VCS typ. 150 mV (145-155 mV). Also used for cycle-by-cycle current limit (VCS_LMT ≈ 300 mV). Absolute max -0.3 to 6 V.
8 VSEND output Source of the internal power MOSFET (switch node). Connects to the external freewheeling Schottky (e.g. SS510) and to the buck inductor. Absolute max -0.3 to 6 V referenced per datasheet (see notes).
EP EP/Thermal Pad power_in Exposed thermal pad on the bottom of the ESOP-8 package. Internally connected to VIN (pin 1); solder to the VIN copper plane for heat dissipation. Package max dissipation P_ESOP8 = 1 W.

Key specifications

Parameter Value
Manufacturer OCX
Package SOP-8
Category PMIC
Pins 9

CAD (KiCad official)

  • Symbol: OC5800L
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: oc5800l-etched.step / oc5800l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); oc5800l.step / oc5800l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: OCX datasheet (None pp, sha256 986b1a591556c42a, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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