component
NX7002BKMYL
Public Made by Adomby adom
Nexperia MOSFETs, SOT-883. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
NX7002BKMYL
Nexperia · MOSFETs · SOT-883
NX7002BKMYL from Nexperia, in a SOT-883. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET; the datasheet gives no further pin-level limits beyond the absolute maximum VGS of -20 V to 20 V (Table 5). |
| 2 | S | passive | Source terminal of the N-channel MOSFET; the datasheet gives no further pin-level limits. |
| 3 | D | passive | Drain terminal of the N-channel MOSFET; the datasheet gives VDS of 60 V maximum and ID of 350 mA at Tamb = 25 °C (Table 5), with the mounting pad for drain specified for the thermal conditions. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-883 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 60 | V | 3 | |||
| Gate-source voltage | VGS | -20 | 20 | V | Tj = 25 °C | 3 | |
| Drain current | ID | 350 | mA | VGS = 10 V; Tamb = 25 °C [1] | 3 | ||
| Drain current | ID | 200 | mA | VGS = 10 V; Tamb = 100 °C [1] | 3 | ||
| Peak drain current | IDM | 0.9 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 | ||
| Total power dissipation | Ptot | 350 | mW | Tamb = 25 °C [2] | 3 | ||
| Total power dissipation | Ptot | 680 | mW | [1] | 3 | ||
| Total power dissipation | Ptot | 3100 | mW | Tsp = 25 °C | 3 | ||
| Junction temperature | Tj | -55 | 150 | °C | 3 | ||
| Ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Source current | IS | 200 | mA | Tamb = 25 °C [1] | 3 | ||
| Drain-source breakdown voltage | V(BR)DSS | 60 | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 | ||
| Gate-source threshold voltage | VGSth | 1.1 | 1.6 | 2.1 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | 10 | µA | VGS = 20 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | -10 | µA | VGS = -20 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | 1 | µA | VGS = 10 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | -1 | µA | VGS = -10 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | 0.3 | µA | VGS = 5 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | -0.3 | µA | VGS = -5 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Drain-source on-state resistance | RDSon | 2.2 | 2.8 | Ω | VGS = 10 V; ID = 200 mA; Tj = 25 °C | 6 | |
| Drain-source on-state resistance | RDSon | 4.5 | 5.7 | Ω | VGS = 10 V; ID = 100 mA; Tj = 150 °C | 6 | |
| Drain-source on-state resistance | RDSon | 2.5 | 3.2 | Ω | VGS = 5 V; ID = 200 mA; Tj = 25 °C | 6 | |
| Source-drain voltage | VSD | 0.87 | 1.2 | V | IS = 200 mA; VGS = 0 V; Tj = 25 °C | 6 | |
| Junction to ambient thermal resistance (standard footprint) | Rth(j-a) | 314 | 360 | K/W | in free air; [1] | 4 | |
| Junction to ambient thermal resistance (mounting pad for drain 1 cm2) | Rth(j-a) | 159 | 180 | K/W | in free air; [2] | 4 | |
| Junction to solder point thermal resistance | Rth(j-sp) | 35 | 40 | K/W | 4 |
CAD (KiCad official)
- Symbol:
NX7002BKMYL - Footprint:
Package_TO_SOT_SMD:SOT-883 - 3D model: SOT-883, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.45 mm nominal SOT height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
nx7002bkmyl-etched.step/nx7002bkmyl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nx7002bkmyl.step/nx7002bkmyl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (16 pp, sha256
bda035dc0e90893e, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NX7002BKMYL
**Nexperia** · MOSFETs · SOT-883
NX7002BKMYL from Nexperia, in a SOT-883. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET; the datasheet gives no further pin-level limits beyond the absolute maximum VGS of -20 V to 20 V (Table 5). |
| 2 | S | passive | Source terminal of the N-channel MOSFET; the datasheet gives no further pin-level limits. |
| 3 | D | passive | Drain terminal of the N-channel MOSFET; the datasheet gives VDS of 60 V maximum and ID of 350 mA at Tamb = 25 °C (Table 5), with the mounting pad for drain specified for the thermal conditions. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-883 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | | | 60 | V | | 3 |
| Gate-source voltage | VGS | -20 | | 20 | V | Tj = 25 °C | 3 |
| Drain current | ID | | | 350 | mA | VGS = 10 V; Tamb = 25 °C [1] | 3 |
| Drain current | ID | | | 200 | mA | VGS = 10 V; Tamb = 100 °C [1] | 3 |
| Peak drain current | IDM | | | 0.9 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| Total power dissipation | Ptot | | | 350 | mW | Tamb = 25 °C [2] | 3 |
| Total power dissipation | Ptot | | | 680 | mW | [1] | 3 |
| Total power dissipation | Ptot | | | 3100 | mW | Tsp = 25 °C | 3 |
| Junction temperature | Tj | -55 | | 150 | °C | | 3 |
| Ambient temperature | Tamb | -55 | | 150 | °C | | 3 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 3 |
| Source current | IS | | | 200 | mA | Tamb = 25 °C [1] | 3 |
| Drain-source breakdown voltage | V(BR)DSS | 60 | | | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 |
| Gate-source threshold voltage | VGSth | 1.1 | 1.6 | 2.1 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS | | | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | 10 | µA | VGS = 20 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | -10 | µA | VGS = -20 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | 1 | µA | VGS = 10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | -1 | µA | VGS = -10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | 0.3 | µA | VGS = 5 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | -0.3 | µA | VGS = -5 V; VDS = 0 V; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon | | 2.2 | 2.8 | Ω | VGS = 10 V; ID = 200 mA; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon | | 4.5 | 5.7 | Ω | VGS = 10 V; ID = 100 mA; Tj = 150 °C | 6 |
| Drain-source on-state resistance | RDSon | | 2.5 | 3.2 | Ω | VGS = 5 V; ID = 200 mA; Tj = 25 °C | 6 |
| Source-drain voltage | VSD | | 0.87 | 1.2 | V | IS = 200 mA; VGS = 0 V; Tj = 25 °C | 6 |
| Junction to ambient thermal resistance (standard footprint) | Rth(j-a) | | 314 | 360 | K/W | in free air; [1] | 4 |
| Junction to ambient thermal resistance (mounting pad for drain 1 cm2) | Rth(j-a) | | 159 | 180 | K/W | in free air; [2] | 4 |
| Junction to solder point thermal resistance | Rth(j-sp) | | 35 | 40 | K/W | | 4 |
## CAD (KiCad official)
- Symbol: `NX7002BKMYL`
- Footprint: `Package_TO_SOT_SMD:SOT-883`
- 3D model: SOT-883, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.45 mm nominal SOT height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `nx7002bkmyl-etched.step` / `nx7002bkmyl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nx7002bkmyl.step` / `nx7002bkmyl.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588913516091097088) (16 pp, sha256 `bda035dc0e90893e`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/nx7002bkmyl-datasheet.pdf)