component
NVR4003NT3G
Public Made by Adomby adom
onsemi MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.md+84docs/hero.pngdocs/nvr4003nt3g-datasheet.pdf+2965nvr4003nt3g-etched.glbnvr4003nt3g-hero.glbnvr4003nt3g-hero.overlay.json+150nvr4003nt3g.glbnvr4003nt3g.kicad_mod+177nvr4003nt3g.kicad_sym+25nvr4003nt3g.lbr+116nvr4003nt3g.step+1434package.json+165page.json+171viewers/footprint.html+1viewers/symbol.html+1README.mdadded+84@@ -0,0 +1,84 @@+# NVR4003NT3G++**onsemi** · MOSFETs · SOT-23++NVR4003NT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | Gate | input | ESD-protected gate with a gate-to-source voltage rating of ±20 V (VGS) and a gate threshold voltage VGS(TH) of 0.8 V min, 1.4 V typ. |+| 2 | Source | passive | Source terminal of the N-channel MOSFET; the body-diode source current IS is rated at 1.0 A. |+| 3 | Drain | passive | Drain terminal of the N-channel MOSFET; drain-to-source voltage VDSS is 30 V and continuous drain current ID is 0.56 A (t < 10 s, TA = 25°C). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | onsemi |+| Package | SOT-23 |+| Category | Triode/MOS Tube/Transistor |+| Pins | 3 |++## Electrical characteristics++Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).++| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |+|---|---|---|---|---|---|---|---|+| Drain-to-Source Voltage | VDSS | | | 30 | V | | 1 |+| Gate-to-Source Voltage | VGS | -20 | | 20 | V | | 1 |+| Continuous Drain Current (steady state) | ID | | | 0.5 | A | Steady State, TA = 25°C | 1 |+| Continuous Drain Current (steady state) | ID | | | 0.37 | A | Steady State, TA = 85°C | 1 |+| Power Dissipation (steady state) | PD | | | 0.69 | W | Steady State | 1 |+| Continuous Drain Current | ID | | | 0.56 | A | t < 10 s, TA = 25°C | 1 |+| Continuous Drain Current | ID | | | 0.4 | A | t < 10 s, TA = 85°C | 1 |+| Power Dissipation | PD | | | 0.83 | W | t < 5 s | 1 |+| Pulsed Drain Current | IDM | | | 1.7 | A | tp = 10 s | 1 |+| Source Current (Body Diode) | IS | | | 1 | A | | 1 |+| Operating Junction and Storage Temperature | TJ, Tstg | -55 | | 150 | °C | | 1 |+| Lead Temperature for Soldering Purposes | TL | | | 260 | °C | 1/8 in from case for 10 s | 1 |+| Junction-to-Ambient Thermal Resistance (steady state) | RJA | | | 180 | °C/W | Steady State; surface-mounted on FR4, 1 in sq pad (Note 1) | 2 |+| Junction-to-Ambient Thermal Resistance (t < 10 s) | RJA | | | 150 | °C/W | t < 10 s; surface-mounted on FR4, 1 in sq pad (Note 1) | 2 |+| Junction-to-Ambient Thermal Resistance (steady state) | RJA | | | 300 | °C/W | Steady State; surface-mounted on FR4, minimum recommended pad (Note 2) | 2 |+| Drain-to-Source Breakdown Voltage | V(BR)DSS | 30 | | | V | VGS = 0 V, ID = 100 A | 3 |+| Zero Gate Voltage Drain Current | IDSS | | | 1 | A | VGS = 0 V, VDS = 30 V, TJ = 25°C | 3 |+| Gate-to-Source Leakage Current | IGSS | -1 | | 1 | A | VDS = 0 V, VGS = ±10 V | 3 |+| Gate Threshold Voltage | VGS(TH) | 0.8 | 1.4 | | V | VGS = VDS, ID = 250 A | 3 |+| Drain-to-Source On Resistance | RDS(on) | | 1 | 1.5 | Ω | VGS = 4.0 V, ID = 10 mA | 3 |+| Drain-to-Source On Resistance | RDS(on) | | 1.5 | 2 | Ω | VGS = 2.5 V, ID = 10 mA | 3 |+| Input Capacitance | Ciss | | 21 | 42 | pF | VGS = 0 V, f = 1.0 MHz, VDS = 5.0 V | 3 |+| Output Capacitance | Coss | | 19.7 | 40 | pF | VGS = 0 V, f = 1.0 MHz, VDS = 5.0 V | 3 |+| Reverse Transfer Capacitance | Crss | | 8.1 | 16 | pF | VGS = 0 V, f = 1.0 MHz, VDS = 5.0 V | 3 |+| Forward Diode Voltage | VSD | | 0.65 | 0.7 | V | VGS = 0 V, IS = 10 mA, TJ = 25°C | 3 |+| Zero Gate Voltage Drain Current Temperature Coefficient (V(BR)DSS) | V(BR)DSS/TJ | | 40 | | mV/°C | | 3 |+| Negative Threshold Temperature Coefficient | VGS(TH)/TJ | | 3.4 | | mV/°C | | 3 |+| Forward Transconductance | gFS | | 0.33 | | S | VDS = 3.0 V, ID = 10 mA | 3 |+| Total Gate Charge | QG(TOT) | | 1.15 | | nC | VGS = 5.0 V, VDS = 24 V, ID = 0.1 A | 3 |+| Threshold Gate Charge | QG(TH) | | 0.15 | | nC | VGS = 5.0 V, VDS = 24 V, ID = 0.1 A | 3 |+| Gate-to-Source Gate Charge | QGS | | 0.32 | | nC | VGS = 5.0 V, VDS = 24 V, ID = 0.1 A | 3 |+| Gate-to-Drain Charge | QGD | | 0.23 | | nC | VGS = 5.0 V, VDS = 24 V, ID = 0.1 A | 3 |+| Turn-On Delay Time | td(on) | | 16.7 | | ns | VGS = 4.5 V, VDD = 5.0 V, ID = 0.1 A, RG = 50 | 3 |+| Rise Time | tr | | 47.9 | | ns | VGS = 4.5 V, VDD = 5.0 V, ID = 0.1 A, RG = 50 | 3 |+| Turn-Off Delay Time | td(off) | | 65.1 | | ns | VGS = 4.5 V, VDD = 5.0 V, ID = 0.1 A, RG = 50 | 3 |+| Fall Time | tf | | 64.2 | | ns | VGS = 4.5 V, VDD = 5.0 V, ID = 0.1 A, RG = 50 | 3 |+| Forward Diode Voltage | VSD | | 0.45 | | V | VGS = 0 V, IS = 10 mA, TJ = 125°C | 3 |+| Reverse Recovery Time | tRR | | 14 | | ns | VGS = 0 V, dIS/dt = 8A/s, IS = 10 mA | 3 |++## CAD (KiCad official)++- Symbol: `NVR4003NT3G`+- Footprint: `Package_TO_SOT_SMD:SOT-23`+- 3D model: SOT-23 (KiCad packages3D, STEP)+- 3D model files: `nvr4003nt3g-etched.step` / `nvr4003nt3g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nvr4003nt3g.step` / `nvr4003nt3g.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/nvr4003nt3-d.pdf) (7 pp, sha256 `e18f8cc897667ae2`, retrieved 2026-10-24, tier: manufacturer)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/nvr4003nt3g-datasheet.pdf)
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• Low Gate Voltage Threshold (VGS(TH)) to Facilitate Drive Circuit
Design
• Low Gate Charge for Fast Switching
• ESD Protected Gate
• SOT−23 Package Provides Excellent Thermal Performance
• Minimum Breakdown Voltage Rating of 30 V
• NVR Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Notebooks:
♦ Level Shifters
♦ Logic Switches
♦ Low Side Load Switches
• Portable Applications</pdf:Keywords>+ <xmp:CreatorTool>BroadVision, Inc.</xmp:CreatorTool>+ <xmp:ModifyDate>2020-08-31T11:37:24+02:00</xmp:ModifyDate>+ <xmp:CreateDate>2019-06-11T16:42:27+08:00</xmp:CreateDate>+ <xmp:MetadataDate>2020-08-31T11:37:24+02:00</xmp:MetadataDate>+ <dc:format>application/pdf</dc:format>+ <dc:title>+ <rdf:Alt>+ <rdf:li xml:lang="x-default">MOSFET - Single, N-Channel, Small Signal, SOT-23 30 V, 0.56 A</rdf:li>+ </rdf:Alt>+ </dc:title>+ <dc:creator>+ <rdf:Seq>+ <rdf:li>ON Semiconductor</rdf:li>+ </rdf:Seq>+ </dc:creator>+ <dc:subject>+ <rdf:Bag>+ <rdf:li>Features</rdf:li>+ <rdf:li>• Low Gate Voltage Threshold (VGS(TH)) to Facilitate Drive Circuit</rdf:li>+ <rdf:li>Design</rdf:li>+ <rdf:li>• Low Gate Charge for Fast Switching</rdf:li>+ <rdf:li>• ESD Protected Gate</rdf:li>+ <rdf:li>• SOT−23 Package Provides Excellent Thermal Performance</rdf:li>+ <rdf:li>• Minimum Breakdown Voltage Rating of 30 V</rdf:li>+ <rdf:li>• NVR Prefix for Automotive and Other 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