component
NUP2201MR6T1G
Public Made by Adomby adom
onsemi ESD And Surge Protection (TVS/ESD), TSOP-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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NUP2201MR6T1G
onsemi · ESD And Surge Protection (TVS/ESD) · TSOP-6
NUP2201MR6T1G from onsemi, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O 1 | bidirectional | Data line I/O 1 protected by the internal steering diodes, which drive transients to the VP rail or to ground; the data lines are connected at pins 1 and 6. |
| 2 | VN | power_in | Negative reference that must be connected directly to ground through a ground plane to minimize PCB ground inductance; the surge specification is measured from pin 5 to pin 2. |
| 3 | N/C | unconnected | No connection; shown as N/C in the pin configuration and not used by the device. |
| 4 | N/C | unconnected | No connection; shown as N/C in the pin configuration and not used by the device. |
| 5 | VP | power_in | Positive reference: connect directly to the VCC supply rail, or through a 10 kΩ isolation resistor to VCC, or leave unconnected to use the internal TVS as the reference (pin 5 to pin 2 is the surge test path). |
| 6 | I/O | bidirectional | Data line I/O 2 protected by the internal steering diodes, which drive transients to the VP rail or to ground; the data lines are connected at pins 1 and 6. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSOP-6 |
| Category | Circuit Protection |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Power Dissipation (8 x 20 µs @ TA = 25°C, Note 1) | Ppk | 500 | W | 8 x 20 S @ TA = 25°C (Note 1) | 1 | ||
| Operating Junction Temperature Range | TJ | -40 | 125 | °C | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 1 | ||
| Lead Solder Temperature, Maximum | TL | 235 | °C | Maximum (10 Seconds) | 1 | ||
| ESD Human Body Model (HBM) | 16000 | V | Human Body Model (HBM) | 1 | |||
| ESD Machine Model (MM) | 400 | V | Machine Model (MM) | 1 | |||
| ESD IEC 61000-4-2 Air | 20000 | V | IEC 61000-4-2 Air (ESD) | 1 | |||
| ESD IEC 61000-4-2 Contact | 20000 | V | IEC 61000-4-2 Contact (ESD) | 1 | |||
| EFT Current | 40 | A | IEC 61000-4-4 (5/50 ns) | 1 | |||
| Reverse Working Voltage | VRWM | 5 | V | (Note 2) | 2 | ||
| Breakdown Voltage | VBR | 6 | V | IT=1 mA, (Note 3) | 2 | ||
| Reverse Leakage Current | IR | 5 | A | VRWM = 5 V | 2 | ||
| Clamping Voltage at IPP = 5 A | VC | 12.5 | V | IPP = 5 A (Note 4) | 2 | ||
| Clamping Voltage at IPP = 8 A | VC | 20 | V | IPP = 8 A (Note 4) | 2 | ||
| Maximum Peak Pulse Current | IPP | 25 | A | 8x20 s Waveform (Note 4) | 2 | ||
| Junction Capacitance, I/O to GND | CJ | 3 | 5 | pF | VR = 0 V, f=1 MHz between I/O Pins and GND | 2 | |
| Junction Capacitance, I/O to I/O | CJ | 1.5 | 3 | pF | VR = 0 V, f=1 MHz between I/O Pins | 2 |
CAD (KiCad official)
- Symbol:
NUP2201MR6T1G - Footprint:
Package_SO:TSOP-6_1.65x3.05mm_P0.95mm - 3D model: TSOP-6 (KiCad packages3D, STEP)
- 3D model files:
nup2201mr6t1g-etched.step/nup2201mr6t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nup2201mr6t1g.step/nup2201mr6t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
9a8667429844b62b, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NUP2201MR6T1G
**onsemi** · ESD And Surge Protection (TVS/ESD) · TSOP-6
NUP2201MR6T1G from onsemi, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O 1 | bidirectional | Data line I/O 1 protected by the internal steering diodes, which drive transients to the VP rail or to ground; the data lines are connected at pins 1 and 6. |
| 2 | VN | power_in | Negative reference that must be connected directly to ground through a ground plane to minimize PCB ground inductance; the surge specification is measured from pin 5 to pin 2. |
| 3 | N/C | unconnected | No connection; shown as N/C in the pin configuration and not used by the device. |
| 4 | N/C | unconnected | No connection; shown as N/C in the pin configuration and not used by the device. |
| 5 | VP | power_in | Positive reference: connect directly to the VCC supply rail, or through a 10 kΩ isolation resistor to VCC, or leave unconnected to use the internal TVS as the reference (pin 5 to pin 2 is the surge test path). |
| 6 | I/O | bidirectional | Data line I/O 2 protected by the internal steering diodes, which drive transients to the VP rail or to ground; the data lines are connected at pins 1 and 6. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSOP-6 |
| Category | Circuit Protection |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Power Dissipation (8 x 20 µs @ TA = 25°C, Note 1) | Ppk | | | 500 | W | 8 x 20 S @ TA = 25°C (Note 1) | 1 |
| Operating Junction Temperature Range | TJ | -40 | | 125 | °C | | 1 |
| Storage Temperature Range | Tstg | -55 | | 150 | °C | | 1 |
| Lead Solder Temperature, Maximum | TL | | | 235 | °C | Maximum (10 Seconds) | 1 |
| ESD Human Body Model (HBM) | | | | 16000 | V | Human Body Model (HBM) | 1 |
| ESD Machine Model (MM) | | | | 400 | V | Machine Model (MM) | 1 |
| ESD IEC 61000-4-2 Air | | | | 20000 | V | IEC 61000-4-2 Air (ESD) | 1 |
| ESD IEC 61000-4-2 Contact | | | | 20000 | V | IEC 61000-4-2 Contact (ESD) | 1 |
| EFT Current | | | | 40 | A | IEC 61000-4-4 (5/50 ns) | 1 |
| Reverse Working Voltage | VRWM | | | 5 | V | (Note 2) | 2 |
| Breakdown Voltage | VBR | 6 | | | V | IT=1 mA, (Note 3) | 2 |
| Reverse Leakage Current | IR | | | 5 | A | VRWM = 5 V | 2 |
| Clamping Voltage at IPP = 5 A | VC | | | 12.5 | V | IPP = 5 A (Note 4) | 2 |
| Clamping Voltage at IPP = 8 A | VC | | | 20 | V | IPP = 8 A (Note 4) | 2 |
| Maximum Peak Pulse Current | IPP | | | 25 | A | 8x20 s Waveform (Note 4) | 2 |
| Junction Capacitance, I/O to GND | CJ | | 3 | 5 | pF | VR = 0 V, f=1 MHz between I/O Pins and GND | 2 |
| Junction Capacitance, I/O to I/O | CJ | | 1.5 | 3 | pF | VR = 0 V, f=1 MHz between I/O Pins | 2 |
## CAD (KiCad official)
- Symbol: `NUP2201MR6T1G`
- Footprint: `Package_SO:TSOP-6_1.65x3.05mm_P0.95mm`
- 3D model: TSOP-6 (KiCad packages3D, STEP)
- 3D model files: `nup2201mr6t1g-etched.step` / `nup2201mr6t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nup2201mr6t1g.step` / `nup2201mr6t1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586199756276715520) (8 pp, sha256 `9a8667429844b62b`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/nup2201mr6t1g-datasheet.pdf)