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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206

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nup2114ucmr6t1g-etched.step	nup2114ucmr6t1g: factory component page (tier=mfr) · Ray	16d ago
nup2114ucmr6t1g-hero.glb	nup2114ucmr6t1g: hero GLB from the etched model (keeps the MPN mark) · Ray	16d ago
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NUP2114UCMR6T1G

onsemi · ESD Protection Devices · TSOP-6

NUP2114UCMR6T1G from onsemi, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	I/O	passive	Protected high-speed data line input/output with 0.8 pF typical capacitance to GND (VN) and 5 V working reverse voltage.
2	VN	power_in	Negative (ground) reference of the uni-directional protection diodes; surge current is returned from VP (pin 5) to this pin (pin 5 to pin 2).
3	NC	unconnected	No connection.
4	NC	unconnected	No connection.
5	VP	passive	Positive rail connection of the protection diodes (5 V stand-off), used as the surge test reference to pin 2 with IPP up to 12 A (8x20 µs).
6	I/O	passive	Protected high-speed data line input/output with 0.8 pF typical capacitance to GND (VN) and 5 V working reverse voltage.

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	TSOP-6
Category	Circuit Protection
Pins	6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Reverse Working Voltage	VRWM			5	V	Note 1	2
Breakdown Voltage	VBR	5.5		7.5	V	IT = 1 mA, (Note 2)	2
Reverse Leakage Current	IR		0.01	1	A	VRWM = 5 V	2
Clamping Voltage	VC			9	V	IPP = 5 A (Note 3)	2
Clamping Voltage	VC			10	V	IPP = 8 A (Note 3)	2
Maximum Peak Pulse Current	IPP			12	A	8x20 s Waveform	2
Junction Capacitance	CJ		0.8	1	pF	VR = 0 V, f = 1 MHz between I/O Pins and GND	2
Junction Capacitance	CJ		0.5		pF	VR = 0 V, f = 1 MHz between I/O Pins	2
Clamping Voltage	VC			12	V	IPP = 1 A (Note 4)	2
Operating Junction Temperature Range	TJ	-40		125	°C	TJ = 25°C unless otherwise noted	1
Storage Temperature Range	Tstg	-55		150	°C		1
Lead Solder Temperature - Maximum (10 Seconds)	TL			260	°C	10 seconds	1
ESD Human Body Model	ESD			16000	V	HBM	1
ESD Machine Model	ESD			400	V	MM	1
ESD IEC 61000-4-2 Contact	ESD			13000	V	IEC 61000-4-2 Contact	1
ESD IEC 61000-4-2 Air	ESD			15000	V	IEC61000-4-2 Air	1

CAD (KiCad official)

Symbol: NUP2114UCMR6T1G
Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
3D model: TSOP-6 (KiCad packages3D, STEP)
3D model files: nup2114ucmr6t1g-etched.step / nup2114ucmr6t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nup2114ucmr6t1g.step / nup2114ucmr6t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (6 pp, sha256 2993f3469db4aacb, retrieved 2026-10-23, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF