component

NUP1301ML3T1G

Public Made by Adom

by adom

onsemi ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NUP1301ML3T1G

onsemi · ESD And Surge Protection (TVS/ESD) · SOT-23

NUP1301ML3T1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of one of the two ESD diodes, which direct transients to the positive supply rail or to ground; each diode has a maximum reverse voltage of 70 V and a maximum forward current of 215 mA.
2 CATHODE passive Cathode of one of the two ESD diodes, which direct transients to the positive supply rail or to ground; each diode has a maximum reverse voltage of 70 V and a maximum forward current of 215 mA.
3 CATHODE/ANODE passive Common node of the two diodes (cathode of one diode tied to anode of the other per Style 11), with diode capacitance of 0.9 pF maximum between I/O and ground.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Voltage VR 70 Vdc 2
Forward Current IF 215 mAdc 2
Peak Forward Surge Current IFM(surge) 500 mAdc 2
Repetitive Peak Reverse Voltage VRRM 70 V 2
Average Rectified Forward Current IF(AV) 715 mA averaged over any 20 ms period (Note 1) 2
Repetitive Peak Forward Current IFRM 450 mA 2
Non-Repetitive Peak Forward Current IFSM 2 A t = 1.0 s 2
Non-Repetitive Peak Forward Current IFSM 1 A t = 1.0 ms 2
Non-Repetitive Peak Forward Current IFSM 0.5 A t = 1.0 S (as printed) 2
Thermal Resistance Junction-to-Ambient RJA 625 °C/W 2
Lead Solder Temperature TL 260 °C Maximum 10 Seconds Duration 2
Junction Temperature TJ -65 150 °C 2
Storage Temperature Tstg -65 150 °C 2
Reverse Breakdown Voltage V(BR) 70 Vdc I(BR) = 100 A (as printed; micro sign missing in text) 2
Reverse Voltage Leakage Current IR 2.5 Adc VR = 70 Vdc 2
Reverse Voltage Leakage Current IR 30 Adc VR = 25 Vdc, TJ = 150°C 2
Reverse Voltage Leakage Current IR 50 Adc VR = 70 Vdc, TJ = 150°C 2
Diode Capacitance (between I/O and ground) CD 0.9 pF VR = 0, f = 1.0 MHz 2
Forward Voltage VF 715 mVdc IF = 1.0 mAdc 2
Forward Voltage VF 855 mVdc IF = 10 mAdc 2
Forward Voltage VF 1000 mVdc IF = 50 mAdc 2
Forward Voltage VF 1250 mVdc IF = 150 mAdc 2

CAD (KiCad official)

  • Symbol: NUP1301ML3T1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: nup1301ml3t1g-etched.step / nup1301ml3t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nup1301ml3t1g.step / nup1301ml3t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 a0c5cba7ba3fd048, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF