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Contents

README

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NTZD3155CT1G

onsemi · MOSFETs · SOT-563

NTZD3155CT1G from onsemi, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source terminal of channel 1 of the complementary MOSFET pair; maximum ratings are VDSS 20 V (N) and -20 V (P) with VGS ±6 V.
2 G1 input Gate terminal of channel 1, ESD protected; gate-to-source voltage is rated ±6 V maximum.
3 D2 passive Drain terminal of channel 2 of the complementary MOSFET pair; drain-to-source voltage is rated 20 V (N) and -20 V (P).
4 S2 passive Source terminal of channel 2 of the complementary MOSFET pair; maximum ratings are VDSS 20 V (N) and -20 V (P) with VGS ±6 V.
5 G2 input Gate terminal of channel 2, ESD protected; gate-to-source voltage is rated ±6 V maximum.
6 D1 passive Drain terminal of channel 1 of the complementary MOSFET pair; drain-to-source voltage is rated 20 V (N) and -20 V (P).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-563
Category Triode/MOS Tube/Transistor
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Breakdown Voltage V(BR)DSS 20 V VGS = 0 V ID = 250 A 2
Drain-to-Source Breakdown Voltage (P-channel) V(BR)DSS -20 V ID = -250 A 2
Gate Threshold Voltage VGS(TH) 0.45 1 V VGS = VDS ID = 250 A 2
Gate Threshold Voltage (P-channel) VGS(TH) -0.45 -1 V ID = -250 A 2
Drain-to-Source On Resistance RDS(on) 0.4 0.55 Ω VGS = 4.5 V, ID = 540 mA 2
Drain-to-Source On Resistance (P-channel) RDS(on) 0.5 0.9 Ω VGS = -4.5 V, ID = -430 mA 2
Drain-to-Source On Resistance RDS(on) 0.5 0.7 Ω VGS = 2.5 V, ID = 500 mA 2
Drain-to-Source On Resistance (P-channel) RDS(on) 0.6 1.2 Ω VGS = -2.5 V, ID = -300 mA 2
Drain-to-Source On Resistance RDS(on) 0.7 0.9 Ω VGS = 1.8 V, ID = 350 mA 2
Drain-to-Source On Resistance (P-channel) RDS(on) 1 2 Ω VGS = -1.8 V, ID = -150 mA 2
Input Capacitance CISS 80 150 pF f = 1 MHz, VGS = 0 V, VDS = 16 V 2
Output Capacitance COSS 13 25 pF f = 1 MHz, VGS = 0 V, VDS = 16 V 2
Reverse Transfer Capacitance CRSS 10 20 pF f = 1 MHz, VGS = 0 V, VDS = 16 V 2
Input Capacitance (P-channel) CISS 105 175 pF f = 1 MHz, VGS = 0 V, VDS = -16 V 2
Output Capacitance (P-channel) COSS 15 30 pF f = 1 MHz, VGS = 0 V, VDS = -16 V 2
Reverse Transfer Capacitance (P-channel) CRSS 10 20 pF f = 1 MHz, VGS = 0 V, VDS = -16 V 2
Total Gate Charge QG(TOT) 1.5 2.5 nC VGS = 4.5 V, VDS = -10 V, ID = 540 mA 3
Total Gate Charge (P-channel) QG(TOT) 1.7 2.5 nC VGS = -4.5 V, VDS = 10 V, ID = -380 mA 3
Forward Diode Voltage VSD 0.7 1.2 V VGS = 0 V, TJ = 25°C, IS = 350 mA 3
Forward Diode Voltage (P-channel) VSD -0.8 -1.2 V VGS = 0 V, TJ = 25°C, IS = -350 mA 3
Drain Current Continuous (N-channel, steady state) ID 540 mA Steady State, TA = 25°C 1
Drain Current Continuous (N-channel, steady state) ID 390 mA Steady State, TA = 85°C 1
Drain Current Continuous (N-channel, t 5 s) ID 570 mA t 5 s, TA = 25°C 1
Drain Current Continuous (P-channel, steady state) ID -430 mA Steady State, TA = 25°C 1
Drain Current Continuous (P-channel, steady state) ID -310 mA Steady State, TA = 85°C 1
Drain Current Continuous (P-channel, t 5 s) ID -455 mA t 5 s, TA = 25°C 1
Power Dissipation PD 250 mW Steady State, TA = 25°C 1
Power Dissipation PD 280 mW t 5 s, TA = 25°C 1
Pulsed Drain Current (N-channel) IDM 1500 mA tp = 10 s 1
Pulsed Drain Current (P-channel) IDM -750 mA tp = 10 s 1
Source Current (Body Diode) IS 350 mA 1
Drain-to-Source Voltage VDSS 20 V 1
Gate-to-Source Voltage VGS -6 6 V 1
Operating Junction and Storage Temperature TJ, TSTG -55 150 °C 1
Lead Temperature for Soldering Purposes TL 260 °C 1/8 in from case for 10 s 1
Junction-to-Ambient Thermal Resistance, Steady State RθJA 500 °C/W Steady State, surface mounted on FR4, 1 in sq pad 2
Junction-to-Ambient Thermal Resistance, t = 5 s RθJA 447 °C/W t = 5 s, surface mounted on FR4, 1 in sq pad 2

CAD (KiCad official)

  • Symbol: NTZD3155CT1G
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: ntzd3155ct1g-etched.step / ntzd3155ct1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ntzd3155ct1g.step / ntzd3155ct1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (10 pp, sha256 8faed5c8b7d1d400, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF