NTMFS6B03NT3G-VB from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	S	passive	Source terminal of the N-channel MOSFET, pin 1 marked by the dot on the package.
2	S	passive	Source terminal of the N-channel MOSFET.
3	S	passive	Source terminal of the N-channel MOSFET.
4	G	input	Gate terminal with a maximum gate-source voltage of ±20 V.
5	D	passive	Drain terminal, rated 100 V drain-source.
6	D	passive	Drain terminal, rated 100 V drain-source.
7	D	passive	Drain terminal, rated 100 V drain-source.
8	D	passive	Drain terminal, rated 100 V drain-source.
9	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	VBsemi Elec
Package	DFN5x6-8
Category	Transistors/Thyristors
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Gate-Source Voltage	VGS	-20		20	V	TC = 25 °C	1
Continuous Drain Current	ID			60	A	TJ = 175 °C, TC = 100 °C, package limited	1
Pulsed Drain Current	IDM			315	A	TC = 25 °C	1
Continuous Source Current (Diode Conduction)	IS			170	A	package limited	1
Avalanche Current	IAS			60	A	L = 0.1 mH	1
Single Avalanche Energy	EAS			110	mJ	Duty Cycle ≤ 1 %, L = 0.1 mH	1
Maximum Power Dissipation	PD			136	W	TC = 25 °C	1
Operating Junction and Storage Temperature Range	TJ, Tstg	-55		175	°C		1
Maximum Junction-to-Ambient (t ≤ 10 s)	RthJA		15	18	°C/W	t ≤ 10 sec	1
Maximum Junction-to-Ambient (Steady State)	RthJA		40	50	°C/W	Steady State	1
Maximum Junction-to-Case	RthJC		0.85	1.1	°C/W		1
Drain-Source Breakdown Voltage	VDS	100			V	VGS = 0 V, ID = 250 µA	2
Gate-Body Leakage	IGSS	-100		100	nA	VDS = 0 V, VGS = ± 20 V	2
Zero Gate Voltage Drain Current	IDSS			1	µA	VDS = 30V, VGS = 0 V	2
Zero Gate Voltage Drain Current (125 °C)	IDSS			50	µA	VDS = 30V, VGS = 0 V, TJ = 125 °C	2
Zero Gate Voltage Drain Current (175 °C)	IDSS			250	µA	VDS = 30V, VGS = 0 V, TJ = 175 °C	2
On-State Drain Current	ID(on)	60			A	VDS = 5 V, VGS = 10 V	2
Drain-Source On-State Resistance (125 °C)	RDS(on)		0.008		Ω	VGS = 10 V, ID = 20 A, TJ = 125 °C	2
Drain-Source On-State Resistance (175 °C)	RDS(on)		0.01		Ω	VGS = 10 V, ID = 20 A, TJ = 175 °C	2
Drain-Source On-State Resistance	RDS(on)		0.006		Ω	VGS = 4.5 V, ID = 35 A	2
Forward Transconductance	gfs		60		S	VDS = 15 V, ID = 20 A	2
Pulsed Current (Source-Drain)	ISM			315	A	TC = 25 °C	2
Input Capacitance	Ciss		11000		pF	VGS = 0 V, VDS = 100 V, f = 1 MHz	2
Output Capacitance	Coss		470		pF	VGS = 0 V, VDS = 100 V, f = 1 MHz	2
Reverse Transfer Capacitance	Crss		225		pF	VGS = 0 V, VDS = 100 V, f = 1 MHz	2

CAD (KiCad official)

Symbol: NTMFS6B03NT3G-VB
Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
3D model: DFN5x6-8 (KiCad packages3D, STEP)
3D model files: ntmfs6b03nt3g-vb-etched.step / ntmfs6b03nt3g-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ntmfs6b03nt3g-vb.step / ntmfs6b03nt3g-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: VBsemi Elec datasheet (7 pp, sha256 e7a5afb45e8a443c, retrieved 2026-10-31, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

NTMFS6B03NT3G-VB

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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