component
NTJD4105CT2G
Public Made by Adomby adom
onsemi MOSFETs, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| ntjd4105ct2g-etched.glb | 17d ago |
| ntjd4105ct2g-etched.step | 17d ago |
| ntjd4105ct2g-hero.glb | 17d ago |
| ntjd4105ct2g-hero.overlay.json | 17d ago |
| ntjd4105ct2g.glb | 17d ago |
| ntjd4105ct2g.kicad_mod | 17d ago |
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| ntjd4105ct2g.lbr | 17d ago |
| ntjd4105ct2g.step | 17d ago |
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| README.md | 17d ago |
NTJD4105CT2G
onsemi · MOSFETs · SOT-363
NTJD4105CT2G from onsemi, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source terminal of the channel 1 MOSFET; the datasheet rates the N-channel VDSS at 20 V and the P-channel at -8.0 V but does not state which channel this pin belongs to. |
| 2 | G1 | input | Gate terminal of the channel 1 MOSFET, with a gate-to-source rating of ±12 V for N-channel and ±8.0 V for P-channel. |
| 3 | D2 | passive | Drain terminal of the channel 2 MOSFET, with continuous drain current of 0.63 A (N-channel) and -0.775 A (P-channel) at TA = 25°C based on RθJA. |
| 4 | S2 | passive | Source terminal of the channel 2 MOSFET, with the same pair ratings as the channel 1 source (N-channel VDSS 20 V, P-channel -8.0 V). |
| 5 | G2 | input | Gate terminal of the channel 2 MOSFET, with a gate-to-source rating of ±12 V for N-channel and ±8.0 V for P-channel. |
| 6 | D1 | passive | Drain terminal of the channel 1 MOSFET, with continuous drain current of 0.63 A (N-channel) and -0.775 A (P-channel) at TA = 25°C based on RθJA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-363 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage, N-Ch | VDSS | 20 | V | 1 | |||
| Drain-to-Source Voltage, P-Ch | VDSS | -8 | V | 1 | |||
| Gate-to-Source Voltage, N-Ch | VGS | -12 | 12 | V | 1 | ||
| Gate-to-Source Voltage, P-Ch | VGS | -8 | 8 | V | 1 | ||
| Continuous Drain Current, N-Ch (based on RJA) | ID | 0.63 | A | Steady state, TA = 25°C | 1 | ||
| Continuous Drain Current, N-Ch (based on RJA) | ID | 0.46 | A | Steady state, TA = 85°C | 1 | ||
| Continuous Drain Current, P-Ch (based on RJA) | ID | -0.775 | A | Steady state, TA = 25°C | 1 | ||
| Continuous Drain Current, P-Ch (based on RJA) | ID | -0.558 | A | Steady state, TA = 85°C | 1 | ||
| Continuous Drain Current, N-Ch (based on RJL) | ID | 0.91 | A | Steady state, TA = 25°C | 1 | ||
| Continuous Drain Current, N-Ch (based on RJL) | ID | 0.65 | A | Steady state, TA = 85°C | 1 | ||
| Continuous Drain Current, P-Ch (based on RJL) | ID | -1.1 | A | Steady state, TA = 25°C | 1 | ||
| Continuous Drain Current, P-Ch (based on RJL) | ID | -0.8 | A | Steady state, TA = 85°C | 1 | ||
| Pulsed Drain Current | IDM | -1.2 | 1.2 | A | tp ≤ 10 s | 1 | |
| Power Dissipation (based on RJA) | PD | 0.27 | W | Steady state, TA = 25°C | 1 | ||
| Power Dissipation (based on RJA) | PD | 0.14 | W | Steady state, TA = 85°C | 1 | ||
| Power Dissipation (based on RJL) | PD | 0.55 | W | Steady state, TA = 25°C | 1 | ||
| Power Dissipation (based on RJL) | PD | 0.29 | W | Steady state, TA = 85°C | 1 | ||
| Operating Junction and Storage Temperature | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Source Current (Body Diode), N-Ch | IS | 0.63 | A | 1 | |||
| Source Current (Body Diode), P-Ch | IS | -0.775 | A | 1 | |||
| Lead Temperature for Soldering Purposes | TL | 260 | °C | 1/8 in from case for 10 s | 1 | ||
| Junction-to-Ambient Thermal Resistance, Steady State | RθJA | 400 | 460 | °C/W | Surface mounted on FR4, 1 oz Cu area 0.9523 in² (Note 1) | 1 | |
| Junction-to-Lead (Drain) Thermal Resistance, Steady State | RθJL | 194 | 226 | °C/W | Steady state (Note 1) | 1 | |
| Drain-to-Source Breakdown Voltage, N-Ch | V(BR)DSS | 20 | 27 | V | VGS = 0 V, ID = 250 µA | 2 | |
| Drain-to-Source Breakdown Voltage, P-Ch | V(BR)DSS | -8 | -10.5 | V | ID = -250 µA | 2 | |
| Gate Threshold Voltage, N-Ch | VGS(TH) | 0.6 | 0.92 | 1.5 | V | VGS = VDS, ID = 250 µA | 2 |
| Gate Threshold Voltage, P-Ch | VGS(TH) | -0.45 | -0.83 | -1 | V | VGS = VDS, ID = -250 µA | 2 |
| Drain-to-Source On Resistance, N-Ch | RDS(on) | 0.29 | 0.375 | Ω | VGS = 4.5 V, ID = 0.63 A | 2 | |
| Drain-to-Source On Resistance, P-Ch | RDS(on) | 0.22 | 0.3 | Ω | VGS = -4.5 V, ID = -0.57 A | 2 | |
| Drain-to-Source On Resistance, N-Ch | RDS(on) | 0.36 | 0.445 | Ω | VGS = 2.5 V, ID = 0.40 A | 2 | |
| Drain-to-Source On Resistance, P-Ch | RDS(on) | 0.32 | 0.46 | Ω | VGS = -2.5 V, ID = -0.48 A | 2 | |
| Drain-to-Source On Resistance, P-Ch | RDS(on) | 0.51 | 0.9 | Ω | VGS = -1.8 V, ID = -0.20 A | 2 | |
| Input Capacitance, N-Ch | CISS | 33 | 46 | pF | f = 1 MHz, VGS = 0 V, VDS = 20 V | 2 | |
| Input Capacitance, P-Ch | CISS | 160 | 225 | pF | f = 1 MHz, VGS = 0 V, VDS = -8.0 V | 2 | |
| Output Capacitance, N-Ch | COSS | 13 | 22 | pF | f = 1 MHz, VGS = 0 V, VDS = 20 V | 2 | |
| Output Capacitance, P-Ch | COSS | 38 | 55 | pF | f = 1 MHz, VGS = 0 V, VDS = -8.0 V | 2 | |
| Reverse Transfer Capacitance, N-Ch | CRSS | 2.8 | 5 | pF | f = 1 MHz, VGS = 0 V, VDS = 20 V | 2 | |
| Reverse Transfer Capacitance, P-Ch | CRSS | 28 | 40 | pF | f = 1 MHz, VGS = 0 V, VDS = -8.0 V | 2 | |
| Total Gate Charge, N-Ch | QG(TOT) | 1.3 | 3 | nC | VGS = 4.5 V, VDS = 10 V, ID = 0.7 A | 2 | |
| Total Gate Charge, P-Ch | QG(TOT) | 2.2 | 4 | nC | VGS = -4.5 V, VDS = -5.0 V, ID = -0.6 A | 2 | |
| Forward Diode Voltage, N-Ch | VSD | 0.76 | 1.1 | V | VGS = 0 V, TJ = 25°C, IS = 0.23 A | 2 | |
| Forward Diode Voltage, P-Ch | VSD | 0.76 | 1.1 | V | VGS = 0 V, TJ = 25°C, IS = -0.23 A | 2 |
CAD (KiCad official)
- Symbol:
NTJD4105CT2G - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
ntjd4105ct2g-etched.step/ntjd4105ct2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ntjd4105ct2g.step/ntjd4105ct2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
f3a806f5ec332925, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).