component
NTD4860NT4G
Public Made by Adomby adom
UMW MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownNTD4860NT4G
UMW · MOSFETs · TO-252
NTD4860NT4G from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE terminal; the gate-to-source voltage VGS is rated at ±20 V. |
| 2 | D | passive | DRAIN terminal; the drain-to-source voltage VDSS is rated at 25 V. |
| 3 | S | passive | SOURCE terminal; it is the reference for the gate-to-source rating VGS of ±20 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | 25 | V | TJ=25°C | 1 | ||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | TJ=25°C | 1 | |
| Continuous Drain Current (RθJA) Note 1 | ID | 13 | A | TA=25°C | 1 | ||
| Continuous Drain Current (RθJA) Note 1 | ID | 10 | A | TA=85°C | 1 | ||
| Power Dissipation (RθJA) Note 1 | PD | 2 | W | TA=25°C | 1 | ||
| Continuous Drain Current (RθJA) Note 2 | ID | 10.4 | A | TA=25°C | 1 | ||
| Continuous Drain Current (RθJA) Note 2 | ID | 8 | A | TA=85°C | 1 | ||
| Power Dissipation (RθJA) Note 2 | PD | 1.28 | W | TA=25°C | 1 | ||
| Continuous Drain Current (RθJC) Note 1 | ID | 65 | A | TC=25°C | 2 | ||
| Continuous Drain Current (RθJC) Note 1 | ID | 50 | A | TC=85°C | 2 | ||
| Power Dissipation (RθJC) Note 1 | PD | 50 | W | TC=25°C | 2 | ||
| Pulsed Drain Current | IDM | 130 | A | tp=10μs | 2 | ||
| Current Limited by Package | IDmaxPkg | 45 | A | 2 | |||
| Operating Junction and Storage Temperature | TJ,TSTG | -55 | 175 | °C | 2 | ||
| Source Current (Body Diode) | IS | 42 | A | TA=25°C | 2 | ||
| Drain to Source dv/dt | dv/dt | 6 | V/ns | 2 | |||
| Single Pulse Drain-to-Source Avalanche Energy | EAS | 84.5 | mJ | TJ=25°C, VDD=50V, VGS=10V, IL=13Apk, L=1mH, RG=25 Ω | 2 | ||
| Lead Temperature for Soldering Purposes | TL | 260 | °C | 1/8 in from case for 10 s | 2 | ||
| Junction-to-Case (Drain) | RθJC | 3 | °C/W | 2 | |||
| Junction-to-TAB (Drain) | RθJC-TAB | 3.5 | °C/W | 2 | |||
| Junction-to-Ambient-Steady State Note 1 | RθJA | 75 | °C/W | Steady State, 1 sq-in pad, 1 oz Cu (Note 1) | 2 | ||
| Junction-to-Ambient-Steady State Note 2 | RθJA | 117 | °C/W | Steady State, minimum recommended pad (Note 2) | 2 | ||
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 25 | V | VGS=0V, ID=250µA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS=20V, TJ=25°C | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS=20V, TJ=125°C | 3 | ||
| Gate-to-Source Leakage Current | IGSS | -100 | 100 | nA | VDS=0V, VGS=±20V | 3 | |
| Gate Threshold Voltage | VGS(th) | 2.5 | V | VDS=VGS, ID=250µA | 3 | ||
| Drain-to-Source On Resistance | RDS(ON) | 7.5 | mΩ | VGS=10V, ID=30A | 3 | ||
| Drain-to-Source On Resistance | RDS(ON) | 11.1 | mΩ | VGS=4.5V, ID=30A | 3 |
CAD (KiCad official)
- Symbol:
NTD4860NT4G - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
ntd4860nt4g-etched.step/ntd4860nt4g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ntd4860nt4g.step/ntd4860nt4g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (10 pp, sha256
a385a5bd2931d5a1, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).