# NTCG163JF103HT1

**TDK** · NTC Thermistors · 0603

NTCG163JF103HT1 from TDK, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TDK |
| Package | 0603 |
| Category | Sensors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance (R25), H code |  | -3 |  | 3 | % |  | 11 |
| B constant tolerance, F code |  | -1 |  | 1 | % |  | 11 |
| Allowable operating current |  |  |  | 0.31 | mA | 25°C | 11 |
| Maximum rated power |  |  |  | 100 | mW | 25°C ambient, rated maximum power (depends on board layout) | 7 |
| Operating temperature range |  | -40 |  | 125 | °C | Includes self-temperature rise | 5 |
| Storage temperature range |  | -40 |  | 125 | °C | Storage temperature; per datasheet, applies after board mounting | 5 |
| Recommended storage temperature |  | 10 |  | 40 | °C | Storage place; use within 6 months | 2 |
| Recommended storage relative humidity |  |  |  | 75 | % | Storage place; relative humidity | 2 |
| Load applied directly to thermistor body from regulated supply |  |  |  | 5 | mW | Direct instantaneous application to thermistor body; datasheet caution | 2 |
| Peak reflow temperature (lead-free solder) |  |  |  | 260 | °C | Lead-free solder reflow | 17 |
| Number of reflow cycles |  |  |  | 2 | times | Reflow | 17 |
| Soldering iron tip temperature |  |  |  | 350 | °C | Soldering iron; 20 W max, tip 3.0 mm max, 5 s max per terminal | 17 |
| Soldering iron power |  |  |  | 20 | W | Soldering iron | 17 |
| Soldering iron time |  |  |  | 5 | s | Soldering iron, per terminal | 17 |
| Nominal resistance R25 | R25 |  | 10000 |  | Ω | 25°C | 11 |
| B constant B(25/50) | B |  | 3380 |  | K | 25/50°C | 11 |
| B constant B(25/75) | B |  | 3422 |  | K | 25/75°C | 11 |
| B constant B(25/85) | B |  | 3435 |  | K | 25/85°C | 11 |
| B constant B(25/100) | B |  | 3453 |  | K | 25/100°C | 11 |
| Thermal dissipation constant |  |  | 1 |  | mW/°C | 25°C | 7 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | nickel | 端子电极 (4) Ni | 3 |

## CAD (KiCad official)

- Symbol: `NTCG163JF103HT1`
- Footprint: `Resistor_SMD:R_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `ntcg163jf103ht1-etched.step` / `ntcg163jf103ht1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ntcg163jf103ht1.step` / `ntcg163jf103ht1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TDK datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588926363806150656) (21 pp, sha256 `6990af8164a49b7c`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ntcg163jf103ht1-datasheet.pdf)