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Ray Publish 0.1.0 c64ff53 2d ago

NSVR0170HT1G

onsemi · Schottky Diodes · SOD-323

NSVR0170HT1G from onsemi, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode terminal of the 70 V Schottky barrier diode, with the device rated for a maximum reverse voltage VR of 70 V.
2 ANODE passive Anode terminal of the Schottky barrier diode, with a continuous forward current limit of 70 mA DC and a non-repetitive peak surge forward current of 100 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Leakage (VR = 50 V) IR 25 90 nA VR = 50 V 2
Reverse Leakage (VR = 70 V) IR 3 A VR = 70 V 2
Forward Voltage (IF = 1.0 mA) VF 340 390 mV IF = 1.0 mA 2
Forward Voltage (IF = 10 mA) VF 560 640 mV IF = 10 mA 2
Forward Voltage (IF = 15 mA) VF 650 730 mV IF = 15 mA 2
Total Capacitance CT 2 pF VR = 0 V, f = 1 MHz 2
Reverse Voltage VR 70 V 1
Forward Current (DC) IF 70 mA 1
Non-Repetitive Peak Surge Forward Current IFSM 100 mA 1
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Thermal Resistance Junction-to-Ambient (Note 1) RJA 680 °C/W Mounted onto 4 in square FR-4, 10 mm sq. 1 oz. Cu pad; steady state (Note 1) 2
Total Power Dissipation @ TA = 25°C (Note 1) PD 180 mW TA = 25°C; mounted per Note 1 2
Thermal Resistance Junction-to-Ambient (Note 2) RJA 440 °C/W Mounted onto 4 in square FR-4, 1 in sq. 1 oz. Cu pad; steady state (Note 2) 2
Total Power Dissipation @ TA = 25°C (Note 2) PD 280 mW TA = 25°C; mounted per Note 2 2

CAD (KiCad official)

  • Symbol: NSVR0170HT1G
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: nsvr0170ht1g-etched.step / nsvr0170ht1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsvr0170ht1g.step / nsvr0170ht1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (3 pp, sha256 3907b3a6f0d07838, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF