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Contents

README

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NSS085N100S

NH · MOSFETs · TO-252

NSS085N100S from NH, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS rated ±20 V and a gate threshold of 1.0 to 3.0 V (typ. 2.0 V).
2 D passive Drain; connected to the tab, with VDS rated 100 V and continuous ID of 100 A at Ta=25℃.
3 S passive Source; the body diode runs from source to drain, with a continuous forward current of up to 100 A.

Key specifications

Parameter Value
Manufacturer NH
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V,ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=60V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(TH) 1 2 3 V VGS=VDS,ID=250uA 2
Drain-Source On Resistance (row 1, typ 7.5 / max 11.0) RDS(ON) 7.5 11 mΩ VGS=10V,ID=2A 2
Drain-Source On Resistance (row 2, typ 11.0 / max 14.5) RDS(ON) 11 14.5 mΩ VGS=4.5V,ID=2A 2
Max. Diode Forward Current ISD 100 A 2
Max. Pulsed Forward Current ISM 300 A 2
Diode Forward Voltage VSD 0.8 1.2 V VGS=0V,IS=10A 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Single Pulse Avalanche Current IAS 38 A L=0.5mH, Starting TJ=25℃ 1
Single Pulse Avalanche Energy EAS 361 mJ L=0.5mH, IAS=38A, VDD=50V, RG=25Ω, Starting TJ=25℃ 1
Operating Junction Temperature TJ -55 150 ℃ 1
Storage Temperature Range TSTD -55 150 ℃ 1
Thermal Resistance Junction to Ambient RθJA 50 ℃/W Device mounted on 1in2 FR-4 board, 2oz copper, still air, TA=25℃ 1
Thermal Resistance Junction-Case RθJC 0.84 ℃/W 1
Thermal Resistance Junction-Case (transient thermal note) RTH-JC 4.5 ℃/W TC=25℃ 6

CAD (KiCad official)

  • Symbol: NSS085N100S
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: nss085n100s-etched.step / nss085n100s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nss085n100s.step / nss085n100s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NH datasheet (10 pp, sha256 098f95315cd4ea52, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF