component

NSR0530HT1G

Public Made by Adom

by adom

onsemi Schottky Diodes, SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NSR0530HT1G

onsemi · Schottky Diodes · SOD-323

NSR0530HT1G from onsemi, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode of the 30 V Schottky barrier diode; reverse voltage VR max 30 V, continuous forward current IF 500 mA.
2 ANODE passive Anode of the 30 V Schottky barrier diode; forward voltage 0.37 V typ at IF = 100 mA, forward surge current IFSM 2.5 A (60 Hz, 1 cycle).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Voltage VR 30 V 1
Forward Current (DC) IF 500 mA 1
Forward Surge Current IFSM 2.5 A 60 Hz @ 1 cycle 1
Reverse Leakage IR 1.4 10 A VR = 10 V, TA = 25°C 2
Reverse Leakage IR 24 200 A VR = 30 V, TA = 25°C 2
Forward Voltage VF 0.28 0.37 V IF = 10 mA, TA = 25°C 2
Forward Voltage VF 0.37 0.46 V IF = 100 mA, TA = 25°C 2
Forward Voltage VF 0.52 0.62 V IF = 500 mA, TA = 25°C 2
Thermal Resistance Junction-to-Ambient (Note 1) RθJA 740 °C/W Mounted onto 10 mm sq. 1 oz. Cu FR-4 board 2
Total Power Dissipation (Note 1) PD 160 mW TA = 25°C, 10 mm sq. 1 oz. Cu FR-4 board 2
Thermal Resistance Junction-to-Ambient (Note 2) RθJA 460 °C/W Mounted onto 1 in sq. 1 oz. Cu FR-4 board 2
Total Power Dissipation (Note 2) PD 270 mW TA = 25°C, 1 in sq. 1 oz. Cu FR-4 board 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Total Capacitance CT 10 pF VR = 1.0 V, f = 1 MHz 2

CAD (KiCad official)

  • Symbol: NSR0530HT1G
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: nsr0530ht1g-etched.step / nsr0530ht1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsr0530ht1g.step / nsr0530ht1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (3 pp, sha256 ba6539e8e0fc4854, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF