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NSR01L30NXT5G

onsemi · Schottky Diodes · 0201

NSR01L30NXT5G from onsemi, in a 0201. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode terminal of the 30 V Schottky barrier diode; maximum reverse voltage is 30 V (VR).
2 ANODE passive Anode terminal of the Schottky barrier diode; continuous forward current is rated at 100 mA (IF).

Key specifications

Parameter Value
Manufacturer onsemi
Package 0201
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Voltage VR 30 V 1
Forward Current (DC) IF 100 mA 1
Forward Surge Current IFSM 4 A 60 Hz @ 1 cycle 1
ESD Rating: Human Body Model 8 kV Printed as >8.0 1
ESD Rating: Machine Model 400 V Printed as >400 1
Reverse Leakage IR 0.2 A VR = 10 V 2
Reverse Leakage IR 3 A VR = 30 V 2
Forward Voltage VF 0.4 V IF = 10 mA 2
Forward Voltage VF 0.53 V IF = 100 mA 2
Total Capacitance CT 7 pF VR = 5.0 V, f = 1 MHz 2
Thermal Resistance Junction-to-Ambient RJA 400 °C/W Note 1: 4 in square FR-4, 10 mm sq 1 oz Cu, steady state 2
Total Power Dissipation @ TA = 25°C PD 312 mW TA = 25°C, Note 1 (10 mm sq pad) 2
Thermal Resistance Junction-to-Ambient RJA 170 °C/W Note 2: 4 in square FR-4, 1 in sq 1 oz Cu, steady state 2
Total Power Dissipation @ TA = 25°C PD 735 mW TA = 25°C, Note 2 (1 in sq pad) 2
Storage Temperature Range Tstg -40 125 °C 2
Junction Temperature TJ 150 °C 2

CAD (KiCad official)

  • Symbol: NSR01L30NXT5G
  • Footprint: Diode_SMD:D_0201_0603Metric
  • 3D model: 0201, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.3 mm nominal 01005 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: nsr01l30nxt5g-etched.step / nsr01l30nxt5g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsr01l30nxt5g.step / nsr01l30nxt5g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 a4f2a3075badd27e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF