component
nSMD150-13.2V
Public Made by Adomby adom
TECHFUSE Resettable Fuses, 1206. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
nSMD150-13.2V
TECHFUSE · Resettable Fuses · 1206
nSMD150-13.2V from TECHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax | 13.2 | Vdc | Maximum operating voltage the device can withstand without damage at rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 100 | A | Maximum fault current the device can withstand without damage at rated voltage (Vmax) | 2 | ||
| Hold current (Ihold) | Ihold | 1.5 | A | 25°C still air; maximum current the device will not trip | 2 | ||
| Trip current (Itrip) | Itrip | 3 | A | 25°C still air; minimum current at which the device will always trip | 2 | ||
| Minimum device resistance prior to tripping (Rimin) | Rimin | 0.03 | W | 25°C, prior to tripping | 2 | ||
| Maximum device resistance one hour post reflow (R1max) | R1max | 0.13 | W | Measured one hour post reflow | 2 | ||
| Power dissipation in tripped state (Pd) | Pd | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Time to trip | 0.3 | s | 25°C, at 8.00 A fault current | 2 | |||
| Resistance change, passive aging | -5 | 5 | % | +85°C, 1000 hrs; printed as ±5% typical | 2 | ||
| Resistance change, humidity aging | -5 | 5 | % | +85°C, 85% R.H., 168 hours; printed as ±5% typical | 2 | ||
| Resistance change, thermal shock | -33 | 33 | % | +85°C to -40°C, 20 times; printed as ±33% typical | 2 | ||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 2 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in the tripped state | 2 | |||
| Storage temperature | 40 | °C | Storage conditions, maximum | 4 | |||
| Storage relative humidity | 70 | % | Storage conditions, R.H. maximum | 4 | |||
| Maximum solder paste thickness | 0.25 | mm | Recommended reflow | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | I = Part identification Termination Pad Characteristics Terminal pad materials： Tin-plated Nickel-Copper Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rew | 3 |
CAD (KiCad official)
- Symbol:
nSMD150-13.2V - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
nsmd150-13-2v-etched.step/nsmd150-13-2v-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nsmd150-13-2v.step/nsmd150-13-2v.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TECHFUSE datasheet (4 pp, sha256
e6d620712406cbe3, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# nSMD150-13.2V
**TECHFUSE** · Resettable Fuses · 1206
nSMD150-13.2V from TECHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax | | | 13.2 | Vdc | Maximum operating voltage the device can withstand without damage at rated current (Imax) | 2 |
| Maximum fault current (Imax) | Imax | | | 100 | A | Maximum fault current the device can withstand without damage at rated voltage (Vmax) | 2 |
| Hold current (Ihold) | Ihold | | | 1.5 | A | 25°C still air; maximum current the device will not trip | 2 |
| Trip current (Itrip) | Itrip | 3 | | | A | 25°C still air; minimum current at which the device will always trip | 2 |
| Minimum device resistance prior to tripping (Rimin) | Rimin | 0.03 | | | W | 25°C, prior to tripping | 2 |
| Maximum device resistance one hour post reflow (R1max) | R1max | | | 0.13 | W | Measured one hour post reflow | 2 |
| Power dissipation in tripped state (Pd) | Pd | | 0.8 | | W | Tripped state, 25°C still air, at rated voltage | 2 |
| Time to trip | | | 0.3 | | s | 25°C, at 8.00 A fault current | 2 |
| Resistance change, passive aging | | -5 | | 5 | % | +85°C, 1000 hrs; printed as ±5% typical | 2 |
| Resistance change, humidity aging | | -5 | | 5 | % | +85°C, 85% R.H., 168 hours; printed as ±5% typical | 2 |
| Resistance change, thermal shock | | -33 | | 33 | % | +85°C to -40°C, 20 times; printed as ±33% typical | 2 |
| Ambient operating temperature | | -40 | | 85 | °C | Ambient operating conditions | 2 |
| Maximum surface temperature in tripped state | | | | 125 | °C | Device in the tripped state | 2 |
| Storage temperature | | | | 40 | °C | Storage conditions, maximum | 4 |
| Storage relative humidity | | | | 70 | % | Storage conditions, R.H. maximum | 4 |
| Maximum solder paste thickness | | | | 0.25 | mm | Recommended reflow | 4 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | I = Part identification Termination Pad Characteristics Terminal pad materials： Tin-plated Nickel-Copper Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rew | 3 |
## CAD (KiCad official)
- Symbol: `nSMD150-13.2V`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `nsmd150-13-2v-etched.step` / `nsmd150-13-2v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nsmd150-13-2v.step` / `nsmd150-13-2v.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TECHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756593450592542720) (4 pp, sha256 `e6d620712406cbe3`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/nsmd150-13-2v-datasheet.pdf)