# nSMD100-13.2V

**TECHFUSE** · Resettable Fuses · 1206

nSMD100-13.2V from TECHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the nonpolarized PPTC resettable fuse (Ihold 1.00 A, Itrip 1.80 A, Vmax 13.2 Vdc, Imax 100 A); the pad is 1.0 mm x 1.9 mm on a 2.0 mm pitch gap per the recommended layout. |
| 2 | 2 | passive | Terminal 2 of the nonpolarized PPTC resettable fuse (Ihold 1.00 A, Itrip 1.80 A, Vmax 13.2 Vdc, Imax 100 A); interchangeable with terminal 1. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax |  |  | 13.2 | Vdc | Maximum operating voltage the device can withstand without damage at rated current (Imax) | 2 |
| Maximum fault current (Imax) | Imax |  |  | 100 | A | @25°C; maximum fault current the device can withstand without damage at rated voltage (Vmax) | 2 |
| Trip current (Itrip) | Itrip | 1.8 |  |  | A | 25°C still air; minimum current at which the device always trips | 2 |
| Minimum device resistance prior to tripping (Rimin) | Rimin | 0.055 |  |  | W | @25°C | 2 |
| Device resistance one hour post reflow (R1max) | R1max |  |  | 0.27 | W | @25°C; measured one hour post reflow | 2 |
| Ambient operating temperature | Tamb | -40 |  | 85 | °C | Ambient operating conditions | 2 |
| Maximum surface temperature in tripped state |  |  |  | 125 | °C | Device in the tripped state | 2 |
| Storage temperature |  |  |  | 40 | °C | Storage conditions, maximum | 4 |
| Storage relative humidity |  |  |  | 70 | % | Storage conditions, maximum R.H. | 4 |
| Resistance change, passive aging |  | -5 |  | 5 | % | Passive aging +85°C, 1000 hrs; printed as ±5% typical | 2 |
| Resistance change, humidity aging |  | -5 |  | 5 | % | Humidity aging +85°C, 85% R.H., 168 hours; printed as ±5% typical | 2 |
| Resistance change, thermal shock |  | -33 |  | 33 | % | Thermal shock +85°C to -40°C, 20 times; printed as ±33% typical | 2 |
| Power dissipation in tripped state (Pd) | Pd |  | 0.6 |  | W | 25°C still air, tripped state at rated voltage | 2 |
| Hold current (Ihold) | Ihold |  | 1 |  | A | 25°C still air; maximum current device will not trip | 2 |
| Time to trip |  |  | 0.3 |  | Sec | Time To Trip at 8.00 A current; typical at 25°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 1.45 |  | A | Maximum ambient operating temperature Tmao = -40°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 1.31 |  | A | Maximum ambient operating temperature Tmao = -20°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 1.15 |  | A | Maximum ambient operating temperature Tmao = 0°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 1 |  | A | Maximum ambient operating temperature Tmao = 25°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 0.84 |  | A | Maximum ambient operating temperature Tmao = 40°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 0.77 |  | A | Maximum ambient operating temperature Tmao = 50°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 0.69 |  | A | Maximum ambient operating temperature Tmao = 60°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 0.61 |  | A | Maximum ambient operating temperature Tmao = 70°C | 2 |
| Ihold vs maximum ambient operating temperature | Ihold |  | 0.48 |  | A | Maximum ambient operating temperature Tmao = 85°C | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | α = Trademark H = Part identification Termination Pad Characteristics Terminal pad materials： Tin-plated Nickel-Copper Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 C | 3 |

## CAD (KiCad official)

- Symbol: `nSMD100-13.2V`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `nsmd100-13-2v-etched.step` / `nsmd100-13-2v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nsmd100-13-2v.step` / `nsmd100-13-2v.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TECHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756593438198915072) (4 pp, sha256 `3731c7f80f653c7d`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/nsmd100-13-2v-datasheet.pdf)