component
NSIC2030JBT3G
Public Made by Adomby adom
onsemi LED Drivers, DO-214AA(SMB). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownNSIC2030JBT3G
onsemi · LED Drivers · DO-214AA(SMB)
NSIC2030JBT3G from onsemi, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the two-terminal constant current regulator, with an anode-cathode voltage rating of 120 V max (Vak). |
| 2 | Anode | passive | Anode terminal of the two-terminal constant current regulator, with an anode-cathode voltage rating of 120 V max (Vak). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | DO-214AA(SMB) |
| Category | LED Drivers |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Steady State Current | Ireg(SS) | 25.5 | 30 | 34.5 | mA | @ Vak = 7.5 V (Note 1) | 2 |
| Pulse Current | Ireg(P) | 27 | 32.8 | 38.2 | mA | @ Vak = 7.5 V (Note 3) | 2 |
| Voltage Overhead | Voverhead | 1.8 | V | (Note 2) | 2 | ||
| Anode-Cathode Voltage | Vak | 120 | V | 2 | |||
| Reverse Voltage | VR | 500 | mV | 2 | |||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 2 | ||
| Total Device Dissipation | PD | 1210 | mW | TA = 25°C; Note 1: 100 mm2, 1 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 8 | mW/°C | Note 1: 100 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 124 | °C/W | Note 1: 100 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 17.5 | °C/W | Note 1: 100 mm2, 1 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 1282 | mW | TA = 25°C; Note 2: 100 mm2, 2 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 8.5 | mW/°C | Note 2: 100 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 117 | °C/W | Note 2: 100 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 18.2 | °C/W | Note 2: 100 mm2, 2 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 1667 | mW | TA = 25°C; Note 3: 300 mm2, 1 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 11.1 | mW/°C | Note 3: 300 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 90 | °C/W | Note 3: 300 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 16.4 | °C/W | Note 3: 300 mm2, 1 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 1765 | mW | TA = 25°C; Note 4: 300 mm2, 2 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 11.8 | mW/°C | Note 4: 300 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 85 | °C/W | Note 4: 300 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 16.7 | °C/W | Note 4: 300 mm2, 2 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 1948 | mW | TA = 25°C; Note 5: 500 mm2, 1 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 13 | mW/°C | Note 5: 500 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 77 | °C/W | Note 5: 500 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 15.5 | °C/W | Note 5: 500 mm2, 1 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 2055 | mW | TA = 25°C; Note 6: 500 mm2, 2 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 12.7 | mW/°C | Note 6: 500 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 73 | °C/W | Note 6: 500 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 15.6 | °C/W | Note 6: 500 mm2, 2 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 2149 | mW | TA = 25°C; Note 7: 700 mm2, 1 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 14.3 | mW/°C | Note 7: 700 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 69.8 | °C/W | Note 7: 700 mm2, 1 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 14.8 | °C/W | Note 7: 700 mm2, 1 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 2269 | mW | TA = 25°C; Note 8: 700 mm2, 2 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 15.1 | mW/°C | Note 8: 700 mm2, 2 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 66.1 | °C/W | Note 8: 700 mm2, 2 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 2609 | mW | TA = 25°C; Note 9: 1000 mm2, 3 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 17.4 | mW/°C | Note 9: 1000 mm2, 3 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 57.5 | °C/W | Note 9: 1000 mm2, 3 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 13.9 | °C/W | Note 9: 1000 mm2, 3 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 2500 | mW | TA = 25°C; Note 10: 400 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 16.7 | mW/°C | Note 10: 400 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 60 | °C/W | Note 10: 400 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 16 | °C/W | Note 10: 400 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 | ||
| Total Device Dissipation | PD | 3000 | mW | TA = 25°C; Note 11: 900 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 | ||
| Derate above 25°C | PD | 20 | mW/°C | Note 11: 900 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 50 | °C/W | Note 11: 900 mm2, DENKA K1 1.5 mm Al 2kV, 2 oz. Cu, still air | 3 |
CAD (KiCad official)
- Symbol:
NSIC2030JBT3G - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
nsic2030jbt3g-etched.step/nsic2030jbt3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nsic2030jbt3g.step/nsic2030jbt3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
86d936fe9d71380e, retrieved 2026-10-26, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).