Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

NSG2186

WXNSIC · Gate Drivers · SOIC-8

NSG2186 from WXNSIC, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HIN input High-side logic input, compatible with 3.3 V, 5 V and 15 V logic, with VIH minimum 2.5 V and VIL maximum 0.8 V.
2 LIN input Low-side logic input, compatible with 3.3 V, 5 V and 15 V logic, with VIH minimum 2.5 V and VIL maximum 0.8 V.
3 COM power_in Ground reference for the logic inputs and the low-side driver; the datasheet labels this pin 地 (ground).
4 LO output Low-side gate driver output, swinging between COM and VCC, with 4.0 A typical peak source/sink current (pulse width up to 10 µs).
5 VCC power_in Low-side supply, recommended 10 V to 20 V, with an absolute maximum of 25 V referenced to COM.
6 VS power_in High-side floating ground (offset return) for the high-side channel, recommended -9 V to 700 V, and tolerant of -9 V negative transients.
7 HO output High-side gate driver output, referenced to VS and swinging between VS and VB, with 4.0 A typical peak source/sink current (pulse width up to 10 µs).
8 VB power_in High-side floating supply, recommended VS + 10 V to VS + 20 V, with an absolute maximum of 725 V.

Key specifications

Parameter Value
Manufacturer WXNSIC
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Turn-on propagation delay tON 130 250 ns VS=0 6
Turn-off propagation delay tOFF 130 250 ns VS=0V or 700V 6
Turn-on rise time tR 15 20 ns VS=0V 6
Turn-off fall time tF 10 15 ns 6
Delay matching time (tON, tOFF) MT 50 ns 6
VCC undervoltage positive-going threshold VCCUV+ 8 8.9 9.8 V 6
VCC undervoltage negative-going threshold VCCUV- 7.4 8.2 9 V 6
VBS undervoltage positive-going threshold VBSUV+ 8 8.9 9.8 V 6
VBS undervoltage negative-going threshold VBSUV- 7.4 8.2 9 V 6
High-side floating supply leakage current ILK 50 μA VB=VS=700V 6
VBS quiescent current IQBS 50 100 μA VIN=0V or 5V 6
VCC quiescent current IQCC 150 240 μA 6
High-level input threshold voltage VIH 2.5 V VCC=10~20V 6
Low-level input threshold voltage VIL 0.8 V 6
Output high level: supply minus output (VOH) VOH 1.4 V IO=0A 6
Output low level: output minus ground (VOL) VOL 0.1 V IO=20mA 6
Logic "1" input bias current IIN+ 25 60 μA LIN=5V 6
Logic "0" input bias current IIN- 2 μA LIN=0V 6
Output high short-circuit pulse current IO+ 3 4 A Vo=0V, PW≤10µs 6
Output low short-circuit pulse current IO- 3 4 A Vo=15V, PW≤10µs 6
High-side floating supply voltage VB (absolute max) VB -0.3 725 V 5
Low-side supply voltage VCC (absolute max) VCC -0.3 25 V 5
Low-side output voltage VLO (absolute max) VLO -0.3 V max printed as VCC+0.3 5
Logic input voltage HIN, LIN (absolute max) VIN -0.3 V max printed as VCC+0.3 5
ESD human body model ESD 1.5 kV 5
ESD machine model ESD 500 V 5
Package power dissipation PD 0.625 W TA ≤25°C 5
Junction-to-ambient thermal resistance RthJA 200 °C/W 5
Junction temperature TJ 150 °C 5
Storage temperature TS -55 150 °C 5
Lead temperature TL 300 °C 5
High-side floating supply ground VS (recommended) VS -9 700 V 5
Low-side supply voltage VCC (recommended) VCC 10 20 V 5
Low-side output voltage VLO (recommended) VLO 0 V max printed as VCC 5
Logic input voltage HIN, LIN (recommended) VIN 0 V max printed as VCC 5
Ambient temperature TA -40 125 °C 5

CAD (KiCad official)

  • Symbol: NSG2186
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: nsg2186-etched.step / nsg2186-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsg2186.step / nsg2186.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WXNSIC datasheet (9 pp, sha256 055e0e5eb43cf975, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF