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Ray Publish 0.1.0 46f97a9 8d ago

NSG2066

WXNSIC · Gate Drivers · TSSOP-20

NSG2066 from WXNSIC, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HIN1 input Phase 1 high-side logic input, compatible with 3.3 V/5 V logic, with VIH min 2.5 V, VIL max 0.8 V and input range 0 to VCC.
2 HIN2 input Phase 2 high-side logic input, compatible with 3.3 V/5 V logic, with VIH min 2.5 V, VIL max 0.8 V and input range 0 to VCC.
3 HIN3 input Phase 3 high-side logic input, compatible with 3.3 V/5 V logic, with VIH min 2.5 V, VIL max 0.8 V and input range 0 to VCC.
4 LIN1 input Phase 1 low-side logic input, compatible with 3.3 V/5 V logic, with VIH min 2.5 V, VIL max 0.8 V and input range 0 to VCC.
5 LIN2 input Phase 2 low-side logic input, compatible with 3.3 V/5 V logic, with VIH min 2.5 V, VIL max 0.8 V and input range 0 to VCC.
6 LIN3 input Phase 3 low-side logic input, compatible with 3.3 V/5 V logic, with VIH min 2.5 V, VIL max 0.8 V and input range 0 to VCC.
7 VCC power_in Positive low-voltage supply for logic and low-side drivers, recommended 5 V to 20 V with absolute maximum 25 V referenced to COM.
8 COM power_in Ground reference for all voltage parameters and logic inputs.
9 LO3 output Phase 3 low-side gate drive output referenced to COM, swinging 0 to VCC, with 1.2 A typical source and 1.5 A typical sink current.
10 LO2 output Phase 2 low-side gate drive output referenced to COM, swinging 0 to VCC, with 1.2 A typical source and 1.5 A typical sink current.
11 LO1 output Phase 1 low-side gate drive output referenced to COM, swinging 0 to VCC, with 1.2 A typical source and 1.5 A typical sink current.
12 VS3 power_in Phase 3 high-side floating ground (switch node), recommended −5 V to 250 V relative to COM, with −50 V transient for 50 ns guaranteed by design.
13 HO3 output Phase 3 high-side gate drive output referenced to VS3, with 1.2 A typical source and 1.5 A typical sink current.
14 VB3 power_in Phase 3 high-side floating bootstrap supply, recommended VS+5 V to VS+20 V, with absolute maximum 275 V referenced to COM.
15 VS2 power_in Phase 2 high-side floating ground (switch node), recommended −5 V to 250 V relative to COM, with −50 V transient for 50 ns guaranteed by design.
16 HO2 output Phase 2 high-side gate drive output referenced to VS2, with 1.2 A typical source and 1.5 A typical sink current.
17 VB2 power_in Phase 2 high-side floating bootstrap supply, recommended VS+5 V to VS+20 V, with absolute maximum 275 V referenced to COM.
18 VS1 power_in Phase 1 high-side floating ground (switch node), recommended −5 V to 250 V relative to COM, with −50 V transient for 50 ns guaranteed by design.
19 HO1 output Phase 1 high-side gate drive output referenced to VS1, with 1.2 A typical source and 1.5 A typical sink current.
20 VB1 power_in Phase 1 high-side floating bootstrap supply, recommended VS+5 V to VS+20 V, with absolute maximum 275 V referenced to COM.

Key specifications

Parameter Value
Manufacturer WXNSIC
Package TSSOP-20
Category Motor Driver ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute max) VCC -0.3 25 V 5
High-side floating supply voltage (absolute max) VB1,2,3 -0.3 275 V 5
Low-side gate driver output voltage (absolute max) VLO1,2,3 -0.3 V 5
Logic input voltage (absolute max) VIN -0.3 V 5
ESD human body model HBM 1500 V 5
Latch-up current ILU 100 mA 5
Package power dissipation PD 1.25 W TA ≤25°C 5
Thermal resistance junction to ambient RthJA 100 °C/W 5
Junction temperature TJ 150 °C 5
Storage temperature TS -55 150 °C 5
Lead temperature TL 300 °C 5
Supply voltage (recommended) VCC 5 20 V 5
Low-side gate driver output voltage (recommended) VLO1,2,3 0 V 5
Phase node voltage (recommended) VS1,2,3 -5 250 V Note1: transient VS of COM-50V, 50ns pulse width (design-guaranteed) 5
Logic input voltage (recommended) VIN 0 V 5
Junction temperature (recommended) Tj -40 125 °C 5
Turn-on propagation delay ton 50 150 300 ns 6
Turn-off propagation delay toff 50 150 300 ns 6
Output rise time tr 40 60 ns 6
Output fall time tf 15 30 ns 6
Delay matching on-time MT 20 50 ns 6
Dead time tDT 100 200 300 ns 6
VCC undervoltage lockout rising threshold VUVCC 4.5 4.9 V 6
VBS undervoltage lockout rising threshold VUVBS 4.5 4.9 V 6
High-level input voltage threshold VIH 2.5 V 6
Low-level input voltage threshold VIL 0.8 V 6
Input current (HIN1,2,3, LIN1,2,3) IIN+ 25 50 uA HIN=5V,LIN=0V 6
Input current (HIN1,2,3, LIN1,2,3) IIN- 2 uA HIN=0V,LIN=5V 6
Output high-level voltage VOH 0.2 V IO=20mA 6
Output low-level voltage VOL 0.1 V IO=-20mA 6
VCC quiescent supply current IQCC 700 uA VIN=0V or 5V 6
VBS quiescent supply current IQBS 60 uA HO1,2,3=Low 6
VB leakage current ILK 10 uA VB=VS=250V 6
Built-in diode equivalent resistance RBSD 300 Ω 6

CAD (KiCad official)

  • Symbol: NSG2066
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: nsg2066-etched.step / nsg2066-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsg2066.step / nsg2066.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WXNSIC datasheet (9 pp, sha256 5061b7a711131fd6, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF