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NSG2005

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WXNSIC Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
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NSG2005

WXNSIC · Gate Drivers · SOIC-8

NSG2005 from WXNSIC, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Low-side supply voltage, recommended 10 V to 20 V and referenced to VSS, with an absolute maximum of 25 V.
2 HIN input High-side logic input, with a logic input voltage range of 0 V to VCC and VIH minimum 2.5 V and VIL maximum 0.8 V (VCC = 10 V to 20 V).
3 LIN input Low-side logic input, with a logic input voltage range of 0 V to VCC and VIH minimum 2.5 V and VIL maximum 0.8 V (VCC = 10 V to 20 V).
4 VSS power_in Ground reference for all voltage ratings and for the logic inputs and low-side outputs.
5 LO output Low-side gate driver output referenced to VSS, with VLO between COM and VCC, and a high-current drive capability of 290 mA source and 600 mA sink (pulse width 10 µs).
6 VS power_in High-side floating ground reference, recommended between COM-9 V and 250 V, and it must stay between -8 V and 200 V for guaranteed operation.
7 HO output High-side gate driver output referenced to VS, with VHO between VS and VB.
8 VB power_in High-side floating supply, recommended at VS + 10 V to VS + 20 V, with an absolute maximum of 275 V.

Key specifications

Parameter Value
Manufacturer WXNSIC
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
High-side floating supply voltage (VB) absolute maximum VB -0.3 275 V referenced to VSS; TA=25°C 5
Low-side supply voltage (VCC) absolute maximum VCC -0.3 25 V referenced to VSS; TA=25°C 5
Allowable transient VS slew rate (dVS/dt) absolute maximum dVS/dt 50 V/ns 5
ESD human body model rating ESD 1.5 kV human body model 5
ESD machine model rating 500 V machine model 5
Package power dissipation (PD) PD 0.625 W TA ≤ 25°C 5
Thermal resistance junction-to-ambient (RthJA) RthJA 200 °C/W 5
Junction temperature (TJ) TJ 150 °C 5
Storage temperature (TS) TS -55 150 °C 5
Lead (pin) temperature (TL) TL 300 °C 5
High-side floating ground voltage (VS) recommended VS 250 V Note 2: VS to be kept within -8V to 200V for normal operation 5
Low-side supply voltage (VCC) recommended VCC 10 20 V 5
Logic input voltage (VIN) recommended VIN 0 V 5
Ambient temperature (TA) recommended TA -40 125 °C 5
Turn-on propagation delay (tON) tON 150 220 ns VS=0/250V 6
Turn-off propagation delay (tOFF) tOFF 150 220 ns VS=0V 6
Turn-on rise time (tR) tR 70 170 ns 6
Turn-off fall time (tF) tF 30 90 ns 6
Delay matching time (tON, tOFF) (MT) MT 60 ns 6
VCC undervoltage positive-going threshold VCCUV+ 8 8.9 9.8 V 6
VCC undervoltage negative-going threshold VCCUV- 7.4 8.2 9 V 6
VBS undervoltage positive-going threshold VBSUV+ 8 8.9 9.8 V 6
VBS undervoltage negative-going threshold VBSUV- 7.4 8.2 9 V 6
High-side floating supply leakage current (ILK) ILK 50 μA VB=VS=250V 6
VBS quiescent current (IQBS) IQBS 50 75 μA all inputs in off state 6
VCC quiescent current (IQCC) IQCC 120 250 μA all inputs in off state 6
Input logic high threshold voltage VIH 2.5 V VCC=10V to 20V 6
Input logic low threshold voltage VIL 0.8 V VCC=10V to 20V 6
Output high-level voltage drop (VBIAS - VO) VOH 0.05 0.2 V IO=2mA 6
Output low-level voltage drop VOL 0.02 0.1 V 6
Logic '1' input bias current (IIN+) IIN+ 3 10 μA VIN=5V 6
Logic '0' input bias current (IIN-) IIN- 5 μA VIN=0V 6
Output source current (IO+) IO+ 200 290 mA VO=0V, PW≤10us 6
Output sink current (IO-) IO- 420 600 mA VO=15V, PW≤10us 6

CAD (KiCad official)

  • Symbol: NSG2005
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: nsg2005-etched.step / nsg2005-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsg2005.step / nsg2005.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WXNSIC datasheet (9 pp, sha256 6683982ce458604e, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF